W25Q16JV
3V 16M-BIT
SERIAL FLASH MEMORY WITH
DUAL/QUAD SPI
Publication Release Date: March 22, 2018, 2018
Revision G
W25Q16JV
Table of Contents
1.
2.
3.
GENERAL DESCRIPTIONS ............................................................................................................. 4
FEATURES ....................................................................................................................................... 4
PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 5
3.1
Pin Configuration SOIC 150/208-mil .................................................................................... 5
3.2
Pad Configuration WSON 6x5-mm & USON 2x3-mm/4x3-mm, XSON 4x4-mm ................. 5
3.3
Pin Description SOIC 150/208-mil, WSON 6x5-mm, USON 2x3-mm/4x3-mm, XSON 4x4-
mm
5
3.4
Ball Configuration WLCSP ................................................................................................... 6
3.5
Ball Description WLCSP ....................................................................................................... 6
PIN DESCRIPTIONS ........................................................................................................................ 7
4.1
Chip Select (/CS) .................................................................................................................. 7
4.2
Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................... 7
4.3
Write Protect (/WP)............................................................................................................... 7
4.4
HOLD (/HOLD) ..................................................................................................................... 7
4.5
Serial Clock (CLK) ................................................................................................................ 7
4.1
Reset (/RESET)
(1)
................................................................................................................. 7
BLOCK DIAGRAM ............................................................................................................................ 8
FUNCTIONAL DESCRIPTIONS ....................................................................................................... 9
6.1
Standard SPI Instructions ..................................................................................................... 9
6.2
Dual SPI Instructions ............................................................................................................ 9
6.1
Quad SPI Instructions........................................................................................................... 9
6.2
Software Reset & Hardware /RESET pin ............................................................................. 9
6.3
Write Protection .................................................................................................................. 10
6.4
Write Protect Features........................................................................................................ 10
STATUS AND CONFIGURATION REGISTERS ............................................................................ 11
7.1
Status Registers ................................................................................................................. 11
Erase/Write In Progress (BUSY)
–
Status Only ................................................................. 11
Write Enable Latch (WEL)
–
Status Only ........................................................................... 11
Block Protect Bits (BP2, BP1, BP0)
–
Volatile/Non-Volatile Writable ................................. 11
Top/Bottom Block Protect (TB)
–
Volatile/Non-Volatile Writable ........................................ 12
Sector/Block Protect Bit (SEC)
–
Volatile/Non-Volatile Writable ........................................ 12
Complement Protect (CMP)
–
Volatile/Non-Volatile Writable ............................................ 12
Status Register Protect SRP, SRL)
–
Volatile/Non-Volatile Writable
................................. 13
Erase/Program Suspend Status (SUS)
–
Status Only ....................................................... 14
Security Register Lock Bits (LB3, LB2, LB1)
–Non-Volatile
OTP Writable ......................... 14
4.
5.
6.
7.
8.
QUAD ENABLE (QE)
–
VOLATILE/NON-VOLATILE WRITABLE
.............................................. 14
Write Protect Selection (WPS)
–
Volatile/Non-Volatile Writable ........................................ 15
Output Driver Strength (DRV1, DRV0)
–
Volatile/Non-Volatile Writable ............................ 15
Reserved Bits
–
Non Functional ........................................................................................ 15
W25Q16JV Status Register Memory Protection (WPS = 0, CMP = 0) ................................. 16
W25Q16JV Status Register Memory Protection (WPS = 0, CMP = 1) ................................. 17
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W25Q16JV
W25Q16JV Individual Block Memory Protection (WPS=1) ................................................... 18
9.
INSTRUCTIONS ............................................................................................................................. 19
9.1
Device ID and Instruction Set Tables ................................................................................. 19
Manufacturer and Device Identification ................................................................................. 19
Instruction Set Table 1 (Standard SPI Instructions)
(1)
.......................................................... 20
Instruction Set Table 2 (Dual/Quad SPI Instructions)
(1)
......................................................... 21
Notes:................................................................................................................................................ 21
9.2
Instruction Descriptions ...................................................................................................... 22
Write Enable (06h) ................................................................................................................ 22
Write Enable for Volatile Status Register (50h)..................................................................... 22
Write Disable (04h) ............................................................................................................... 23
Read Status Register-1 (05h), Status Register-2 (35h) & Status Register-3 (15h) ............... 23
Write Status Register-1 (01h), Status Register-2 (31h) & Status Register-3 (11h) ............... 24
Read Data (03h) ................................................................................................................... 26
Fast Read (0Bh) ................................................................................................................... 27
Fast Read Dual Output (3Bh) ............................................................................................... 28
Fast Read Quad Output (6Bh) .............................................................................................. 29
Fast Read Dual I/O (BBh) ................................................................................................... 30
Fast Read Quad I/O (EBh).................................................................................................. 31
Set Burst with Wrap (77h) ................................................................................................... 32
Page Program (02h) ........................................................................................................... 33
Quad Input Page Program (32h)......................................................................................... 34
9.3
Sector Erase (20h) ............................................................................................................. 35
32KB Block Erase (52h)........................................................................................................ 36
64KB Block Erase (D8h) ....................................................................................................... 37
Chip Erase (C7h / 60h) ......................................................................................................... 38
Erase / Program Suspend (75h) ........................................................................................... 39
Erase / Program Resume (7Ah) ............................................................................................ 40
Power-down (B9h) ................................................................................................................ 41
Release Power-down / Device ID (ABh) ............................................................................... 42
Read Manufacturer / Device ID (90h) ................................................................................... 43
Read Manufacturer / Device ID Dual I/O (92h) ..................................................................... 44
Read Manufacturer / Device ID Quad I/O (94h) .................................................................. 45
Read Unique ID Number (4Bh) ........................................................................................... 46
Read JEDEC ID (9Fh) ........................................................................................................ 47
Read SFDP Register (5Ah)................................................................................................. 48
Erase Security Registers (44h) ........................................................................................... 49
Program Security Registers (42h) ....................................................................................... 50
Read Security Registers (48h) ............................................................................................ 51
Individual Block/Sector Lock (36h) ...................................................................................... 52
Individual Block/Sector Unlock (39h) .................................................................................. 53
Read Block/Sector Lock (3Dh)............................................................................................ 54
Global Block/Sector Lock (7Eh) .......................................................................................... 55
Global Block/Sector Unlock (98h) ....................................................................................... 55
Enable Reset (66h) and Reset Device (99h) ...................................................................... 56
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Publication Release Date: March 22, 2018, 2018
Revision G
W25Q16JV
10.
ELECTRICAL CHARACTERISTICS............................................................................................... 57
10.1 Absolute Maximum Ratings (1) .......................................................................................... 57
10.2 Operating Ranges .............................................................................................................. 57
10.3 Power-Up Power-Down Timing and Requirements ........................................................... 58
10.4 DC Electrical Characteristics- ............................................................................................. 59
10.5 AC Measurement Conditions ............................................................................................. 60
10.6 AC Electrical Characteristics
(6)
........................................................................................... 61
10.7 Serial Output Timing ........................................................................................................... 63
10.8 Serial Input Timing.............................................................................................................. 63
10.9 /WP Timing ......................................................................................................................... 63
PACKAGE SPECIFICATIONS ....................................................................................................... 64
11.1 8-Pin SOIC 150-mil (Package Code SN) 20131227 .......................................................... 64
11.3 8-Pin SOIC 208-mil (Package Code SS) ............................................................................ 65
11.4 8-Pad USON 2x3x0.6-mm^³ (Package Code UX) ............................................................. 66
11.5 8-Pad WSON 6x5-mm (Package Code ZP) ....................................................................... 67
11.6 8-Pad USON 4x3-mm (Package Code UU) ....................................................................... 68
11.7 8-Pad XSON 4x4x0.45-mm (Package Code XG) .............................................................. 69
11.8 8-Ball WLCSP (Package Code BY) .................................................................................... 70
ORDERING INFORMATION .......................................................................................................... 71
12.1 Valid Part Numbers and Top Side Marking ........................................................................ 72
REVISION HISTORY ...................................................................................................................... 74
11.
12.
13.
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W25Q16JV
1. GENERAL DESCRIPTIONS
The W25Q16JV (16M-bit) Serial Flash memory provides a storage solution for systems with limited space,
pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices.
They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing
voice, text and data. The device operates on a single 2.7V to 3.6V power supply with current consumption
as low as 1µA for power-down.
The W25Q16JV array is organized into 8,192 programmable pages of 256-bytes each. Up to 256 bytes can
be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB
block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q16JV has 512
erasable sectors and 32 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in
applications that require data and parameter storage. (See figure 2.)
The W25Q16JV supports the standard Serial Peripheral Interface (SPI), and a high performance Dual/Quad
output as well as Dual/Quad I/O SPI: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2, and
I/O3. SPI clock frequencies of up to 133MHz are supported allowing equivalent clock rates of 266MHz
(133MHz x 2) for Dual I/O and 532MHz (133MHz x 4) for Quad I/O when using the Fast Read Dual/Quad
I/O instructions. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash
memories.
Additionally, the device supports JEDEC standard manufacturer and device ID and SFDP Register, a 64-
bit Unique Serial Number and three 256-bytes Security Registers.
2. FEATURES
New Family of SpiFlash Memories
– W25Q16JV: 16M-bit / 2M-byte (2,097,152)
– Standard SPI: CLK, /CS, DI, DO
– Dual SPI: CLK, /CS, IO
0
, IO
1
– Quad SPI: CLK, /CS, IO
0
, IO
1
, IO
2
, IO
3
– Software & Hardware Reset
(1)
Highest Performance Serial Flash
– 133MHz Single, Dual/Quad SPI clocks
– 266/532MHz equivalent Dual/Quad SPI
– 66MB/S continuous data transfer rate
– Min. 100K Program-Erase cycles per sector
– More than 20-year data retention
Efficient “Continuous Read”
– Continuous Read with 8/16/32/64-Byte Wrap
– As few as 8 clocks to address memory
– Allows true XIP (execute in place) operation
– Outperforms X16 Parallel Flash
Low Power, Wide Temperature Range
– Single 2.7V to 3.6V supply
– -40°C to +85°C operating range
– -40°C to +105°C operating range
– <1µA Power-down (typ.)
Flexible Architecture with 4KB sectors
– Uniform Sector/Block Erase (4K/32K/64K-Byte)
– Program 1 to 256 byte per programmable page
– Erase/Program Suspend & Resume
Advanced Security Features
– Software and Hardware Write-Protect
– Power Supply Lock-Down and
– Special OTP protection
(2)
– Top/Bottom, Complement array protection
– Individual Block/Sector array protection
– 64-Bit Unique ID for each device
– Discoverable Parameters (SFDP) Register
– 3X256-Bytes Security Registers with OTP locks
– Volatile & Non-volatile Status Register Bits
Space Efficient Packaging
– 8-pin SOIC 150-mil / 208-mil
– 8-pad USON 2X3mm/4x3-mm
– 8-pad XSON 4x4-mm
– 8-pad WSON 6x5-mm
– 8-ball WLCSP
– Contact Winbond for KGD and other options
Note: 1. Hardware /RESET pin is only available on SOIC-16 & TFBGA packages
2. Please contact Winbond for details.
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Publication Release Date: March 22, 2018, 2018
Revision G
Mobile and portable
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