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IBM25PPC440GP-3FC466C

Description
RISC Microprocessor, 32-Bit, 466MHz, CMOS, PBGA552, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-552
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size2MB,72 Pages
ManufacturerIBM
Websitehttp://www.ibm.com
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IBM25PPC440GP-3FC466C Overview

RISC Microprocessor, 32-Bit, 466MHz, CMOS, PBGA552, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-552

IBM25PPC440GP-3FC466C Parametric

Parameter NameAttribute value
MakerIBM
Parts packaging codeBGA
package instructionBGA, BGA552,24X24,40
Contacts552
Reach Compliance Codeunknown
ECCN code3A001.A.3
Other featuresALSO REQUIRES 3.3V SUPPLY
Address bus width64
bit size32
boundary scanYES
maximum clock frequency66.66 MHz
External data bus width64
FormatFIXED POINT
Integrated cacheYES
JESD-30 codeS-PBGA-B552
length25 mm
low power modeYES
Number of terminals552
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA552,24X24,40
Package shapeSQUARE
Package formGRID ARRAY
power supply1.8,2.5,3.3 V
Certification statusNot Qualified
Maximum seat height3.361 mm
speed466 MHz
Maximum supply voltage1.9 V
Minimum supply voltage1.7 V
Nominal supply voltage1.8 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
width25 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC
Base Number Matches1
PowerPC 440GP Embedded Processor Data Sheet
Features
• PowerPC
®
440 processor core operating up to
500MHz with 32KB I- and D-caches
• On-chip 8 KB SRAM
• Selectable processor:bus clock ratios of 3:1,
4:1, 5:1, 5:2, 7:2
• Double Data Rate (DDR) Synchronous DRAM
(SDRAM) 32/64-bit interface operating up to
133MHz
• External Peripheral Bus for up to eight devices
with external mastering
• DMA support for external peripherals, internal
UART and memory
• PCI-X V1.0a interface (32 or 64 bits, up to
133MHz) with support for conventional PCI
V2.2
• Programmable Interrupt Controller supports
interrupts from a variety of sources.
• Programmable General Purpose Timers (GPT)
• Two serial ports (16750 compatible UART)
• Two IIC interfaces
• General Purpose I/O (GPIO) interface available
• JTAG interface for board level testing
• Internal Processor Local Bus (PLB) runs at
DDR SDRAM interface frequency
• Processor can boot from PCI memory
• Available in ceramic and plastic packages
• Two Ethernet 10/100Mbps half- or full-duplex
interfaces. Operational modes supported are
MII, RMII, and SMII.
Description
Designed specifically to address high-end
embedded applications, the PowerPC 440GP
(PPC440GP) provides a high-performance, low
power solution that interfaces to a wide range of
peripherals by incorporating on-chip power
management features and lower power dissipation.
This chip contains a high-performance RISC
processor core, DDR SDRAM controller,8KB
SRAM, PCI-X bus interface, Ethernet interfaces,
control for external ROM and peripherals, DMA with
scatter-gather support, serial ports, IIC interface,
and general purpose I/O.
Technology: IBM CMOS SA-27E, 0.18µm
(0.11 L
eff
), 5-layer metal
Packages: 25mm, 552-ball Ceramic Ball Grid Array
(CBGA) or Plastic Ball Grid Array (PBGA)
Power (estimated): Less than:
4.0W in normal mode
1.0 W in sleep mode
Supply voltages required: 3.3V, 2.5V, 1.8V
5/13/04
Page 1 of 72

IBM25PPC440GP-3FC466C Related Products

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Description RISC Microprocessor, 32-Bit, 466MHz, CMOS, PBGA552, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-552 RISC Microprocessor, 32-Bit, 500MHz, CMOS, PBGA552, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-552 RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA552, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-552 RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA552, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-552 RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA552, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-552 RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA552, 25 X 25 MM, CERAMIC, BGA-552 RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA552, 25 X 25 MM, CERAMIC, BGA-552 RISC Microprocessor, 32-Bit, 466MHz, CMOS, PBGA552, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-552 RISC Microprocessor, 32-Bit, 500MHz, CMOS, PBGA552, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-552 RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA552, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-552
Maker IBM IBM IBM IBM IBM IBM IBM IBM IBM IBM
Parts packaging code BGA BGA BGA BGA BGA BGA BGA BGA BGA BGA
package instruction BGA, BGA552,24X24,40 BGA, BGA552,24X24,40 BGA, BGA552,24X24,40 BGA, BGA552,24X24,40 BGA, BGA552,24X24,40 BGA, BGA552,24X24,40 BGA, BGA552,24X24,40 BGA, BGA552,24X24,40 BGA, BGA552,24X24,40 BGA, BGA552,24X24,40
Contacts 552 552 552 552 552 552 552 552 552 552
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown unknown
ECCN code 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3
Other features ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY
Address bus width 64 64 64 64 64 64 64 64 64 64
bit size 32 32 32 32 32 32 32 32 32 32
boundary scan YES YES YES YES YES YES YES YES YES YES
maximum clock frequency 66.66 MHz 66.66 MHz 66.66 MHz 66.66 MHz 66.66 MHz 66.66 MHz 66.66 MHz 66.66 MHz 66.66 MHz 66.66 MHz
External data bus width 64 64 64 64 64 64 64 64 64 64
Format FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT
Integrated cache YES YES YES YES YES YES YES YES YES YES
JESD-30 code S-PBGA-B552 S-PBGA-B552 S-PBGA-B552 S-PBGA-B552 S-PBGA-B552 S-CBGA-B552 S-CBGA-B552 S-PBGA-B552 S-PBGA-B552 S-PBGA-B552
length 25 mm 25 mm 25 mm 25 mm 25 mm 25 mm 25 mm 25 mm 25 mm 25 mm
low power mode YES YES YES YES YES YES YES YES YES YES
Number of terminals 552 552 552 552 552 552 552 552 552 552
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA BGA BGA BGA BGA BGA BGA
Encapsulate equivalent code BGA552,24X24,40 BGA552,24X24,40 BGA552,24X24,40 BGA552,24X24,40 BGA552,24X24,40 BGA552,24X24,40 BGA552,24X24,40 BGA552,24X24,40 BGA552,24X24,40 BGA552,24X24,40
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
power supply 1.8,2.5,3.3 V 1.8,2.5,3.3 V 1.8,2.5,3.3 V 1.8,2.5,3.3 V 1.8,2.5,3.3 V 1.8,2.5,3.3 V 1.8,2.5,3.3 V 1.8,2.5,3.3 V 1.8,2.5,3.3 V 1.8,2.5,3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.361 mm 3.361 mm 3.361 mm 3.361 mm 3.361 mm 3.8 mm 3.8 mm 3.361 mm 3.361 mm 3.361 mm
speed 466 MHz 500 MHz 400 MHz 400 MHz 400 MHz 400 MHz 400 MHz 466 MHz 500 MHz 400 MHz
Maximum supply voltage 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V
Minimum supply voltage 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V
Nominal supply voltage 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
surface mount YES YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Terminal form BALL BALL BALL BALL BALL BALL BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
width 25 mm 25 mm 25 mm 25 mm 25 mm 25 mm 25 mm 25 mm 25 mm 25 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1 1 1 1 1 1 1 1 1
Maximum operating temperature 85 °C 85 °C - 85 °C - 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C - -40 °C - -40 °C -40 °C -40 °C -40 °C -40 °C
Temperature level INDUSTRIAL INDUSTRIAL - INDUSTRIAL - INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
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