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290-51.1K-RC

Description
thick film resistors - smd 1/8watt 51.1kohms
CategoryPassive components    The resistor   
File Size228KB,3 Pages
ManufacturerXicon Passive Components
Websitehttp://www.xicor.com
Environmental Compliance
Download Datasheet Parametric View All

290-51.1K-RC Overview

thick film resistors - smd 1/8watt 51.1kohms

290-51.1K-RC Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerXicon Passive Components
Reach Compliance Codeunknown
ECCN codeEAR99
structureChip
JESD-609 codee3
Manufacturer's serial number290-RC
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package height0.55 mm
Package length3.1 mm
Package formSMT
Package width1.55 mm
method of packingTR
Rated power dissipation(P)0.125 W
resistance51100 Ω
Resistor typeFIXED RESISTOR
series290-RC
size code1206
technologyMETAL FILM
Temperature Coefficient-200,200 ppm/°C
Terminal surfaceTin (Sn) - with Nickel (Ni) barrier
Tolerance1%
Operating Voltage200 V
1% Thick Film Chip Resistors
(RoHS Compliant)
CR1-RC Series
FEATURES
Temperature Range: -55°C ~ +125°C
High purity alumina substrate
Wave or flow solderable
Excellent high frequency characteristics
Wrap around termination
Inner electrode protection
DERATING CURVE
Rated Load (%)
REEL DIMENSIONS (mm)
¿13 –0.5
50
min.
178
2.0
10 –1
Ambient Temperature (¡C)
PART NUMBERING SYSTEM
2
9
Series
0
1
0
Ohms
K
-
R
C
Suffix (RoHS Compliant)
SERIES, SIZE, WATTAGE, VOLTAGE, AND DIMENSIONS
L
W
D
C
t
Series
290
292
302
304
Case Size
1206
0805
0603
0402
Power
Rating
1/8
1/10
1/10
1/16
Voltage (max.)
W.V.
O.V.
200
400
150
300
50
25
100
50
L
3.1 ± 0.15
2.0 ± 0.15
1.6 ± 0.10
1.00 ± 0.1
Dimensions (mm)
W
C
D
1.55 ± 0.15
0.45 ± 0.2
0.45 ± 0.2
1.25 ± 0.15
0.40 ± 0.2
0.40 ± 0.2
0.8 ± 0.15
0.5 ± 0.05
0.30 ± 0.2
0.2 ± 0.1
0.30 ± 0.2
0.25 ± 0.1
t
0.55 ± 0.10
0.55 ± 0.10
0.45± 0.10
0.35 ± 0.05
XICON PASSIVE COMPONENTS • (800) 628-0544
XC-600037
Specifications are subject to change without notice. No liability or warranty implied by this information. Environmental compliance based on producer documentation.
Date Revised: 9/28/05
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