5962R0051501VPA datasheet, PDF

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5962R0051501VPA: Description5962R0051501VPA amplifier basic information: 5962R0051501VPA is a COMPARATOR from Analog Devices Inc. Commonly used packaging methods are DIP, DIP8,.3 5962R0051501VPA amplifier core information: The minimum operating temperature of 5962R0051501VPA is -55 °C and the maximum operating temperature is 125 °C. Its peak reflow temperature is NOT SPECIFIED The nominal supply voltage of 5962R0051501VPA is 5 V, and its corresponding nominal negative supply voltage is -5 V. The input offset voltage of 5962R0051501VPA is 10000 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).) Related dimensions of 5962R0051501VPA: 5962R0051501VPA has 8 terminals. Its terminal position type is: DUAL. Terminal pitch is 2.54 mm. Total pins: 8 5962R0051501VPA amplifier additional information: Its temperature grade is: MILITARY. 5962R0051501VPA does not comply with Rohs certification. It contains lead. The corresponding JESD-30 code is: R-CDIP-T8. The corresponding JESD-609 code is: e0. The packaging code of 5962R0051501VPA is: DIP. The materials used in the 5962R0051501VPA package are mostly CERAMIC, METAL-SEALED COFIRED. The package shape is RECTANGULAR. The 5962R0051501VPA package pin format is: IN-LINE. Its terminal form is: THROUGH-HOLE.; CategoryAnalog mixed-signal IC Amplifier circuit; File Size126KB，14 Pages; ManufacturerADI; Websitehttps://www.analog.com; Alternative parts：5962R0051501VPA

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5962R0051501VPA Overview

5962R0051501VPA amplifier basic information:

5962R0051501VPA is a COMPARATOR from Analog Devices Inc. Commonly used packaging methods are DIP, DIP8,.3

5962R0051501VPA amplifier core information:

The minimum operating temperature of 5962R0051501VPA is -55 °C and the maximum operating temperature is 125 °C. Its peak reflow temperature is NOT SPECIFIED

The nominal supply voltage of 5962R0051501VPA is 5 V, and its corresponding nominal negative supply voltage is -5 V. The input offset voltage of 5962R0051501VPA is 10000 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)

Related dimensions of 5962R0051501VPA:

5962R0051501VPA has 8 terminals. Its terminal position type is: DUAL. Terminal pitch is 2.54 mm. Total pins: 8

5962R0051501VPA amplifier additional information:

Its temperature grade is: MILITARY. 5962R0051501VPA does not comply with Rohs certification. It contains lead. The corresponding JESD-30 code is: R-CDIP-T8. The corresponding JESD-609 code is: e0.

The packaging code of 5962R0051501VPA is: DIP. The materials used in the 5962R0051501VPA package are mostly CERAMIC, METAL-SEALED COFIRED. The package shape is RECTANGULAR. The 5962R0051501VPA package pin format is: IN-LINE. Its terminal form is: THROUGH-HOLE.

5962R0051501VPA Parametric

Parameter Name	Attribute value
Brand Name	Analog Devices Inc
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	DIP
package instruction	DIP, DIP8,.3
Contacts	8
Reach Compliance Code	not_compliant
ECCN code	EAR99
Amplifier type	COMPARATOR
Maximum input offset voltage	10000 µV
JESD-30 code	R-CDIP-T8
JESD-609 code	e0
Negative supply voltage upper limit	-7 V
Nominal Negative Supply Voltage (Vsup)	-5 V
Number of functions	1
Number of terminals	8
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Encapsulate equivalent code	DIP8,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3/5/+-5 V
Certification status	Qualified
Filter level	MIL-PRF-38535 Class V
Supply voltage upper limit	7 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	BIPOLAR
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
total dose	100k Rad(Si) V
Base Number Matches	1

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REVISIONS

LTR

DESCRIPTION

Drawing updated to reflect current requirements. - gt

Add radiation hardness assurance requirements. - rrp

Five year review requirement. - ro

Add device type 02 tested at low dose rate. Make change to paragraphs 1.2.2

and 1.5. Make changes to footnotes 1/ and 2/ as specified under

Table I. Make change to paragraph 4.4.4.1. -rrp

DATE (YR-MO-DA)

02-04-24

02-07-29

07-10-02

APPROVED

R. MONNIN

R. HEBER

C. SAFFLE

12-05-31

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

Rajesh Pithadia

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

CHECKED BY

Rajesh Pithadia

APPROVED BY

Raymond Monnin

DRAWING APPROVAL DATE

00-04-06

REVISION LEVEL

DLA LAND AND MARITIME

COLUMBUS, OHIO 43218-3990

http://www.landandmaritime.dla.mil

MICROCIRCUIT, LINEAR, SINGLE, ULTRAFAST

COMPARATOR, MONOLITHIC SILICON

SIZE

CAGE CODE

AMSC N/A

67268

SHEET

1 OF 13

5962-00515

DSCC FORM 2233

APR 97

5962-E360-12

1.3 Absolute maximum ratings. 1/

Total analog supply voltage .......................................................................................

Digital supply voltage .................................................................................................

Analog positive supply-digital positive supply ............................................................

Input voltage ..............................................................................................................

Differential input voltage ............................................................................................

Output short circuit duration to GND ..........................................................................

Storage temperature range ........................................................................................

Operating temperature range ....................................................................................

Junction temperature range .......................................................................................

Lead temperature range (soldering, 10 seconds) ......................................................

Power dissipation (P

) ..............................................................................................

+14 V

-600 mV

±7 V

±8 V

Indefinite

-65°C to +150°C

-55°C to +125°C

-65°C to +150°C

+300°C

500 mW

Thermal resistance, junction-to-case (θ

) ................................................................ See MIL-STD-1835

Thermal resistance, junction-to-ambient (θ

Case H ................................................................................................................... 180°C/W

Case P ................................................................................................................... 148°C/W

1.4 Recommended operating conditions. 2/ 3/ 6/

Single supply voltage operation ................................................................................. +3.0 V to +5.0 V

Dual supply voltage operation ...................................................................................

±5

Ambient operating temperature (T

) ......................................................................... -55°C to +125°C

1.5 Radiation features:

Device type 01:

Maximum total dose available (dose rate = 50 – 300 rads(Si)/s) ............. 100 krads(Si) 2/

Device type 02:

Maximum total dose available (dose rate

≤

10 mrads(Si)/s) .................... 50 krads(Si) 3/

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part

of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the

solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATION

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883 -

MIL-STD-1835 -

Test Method Standard Microcircuits.

Interface Standard Electronic Component Case Outlines.

_____

1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the

maximum levels may degrade performance and affect reliability.

2/ Device type 01, may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects.

Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in

MIL-STD-883, method 1019, condition A.

3/ For device type 02, radiation end point limits for the noted parameters are guaranteed only for the conditions specified in

MIL-STD-883, method 1019, condition D.

STANDARD

MICROCIRCUIT DRAWING

DLA LAND AND MARITIME

COLUMBUS, OHIO 43218-3990

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-00515

SHEET

DEPARTMENT OF DEFENSE HANDBOOKS

MIL-HDBK-103 -

MIL-HDBK-780 -

List of Standard Microcircuit Drawings.

Standard Microcircuit Drawings.

(Copies of these documents are available online at

https://assist.daps.dla.mil/quicksearch/

or from the Standardization

Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text

of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with

MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The

modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for

device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified

herein.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified

in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.

3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.

3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document

revision level control and shall be made available to the preparing and acquiring activity upon request.

3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the

electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full

ambient operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical

tests for each subgroup are defined in table I.

3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be

marked. For packages where marking of the entire SMD PIN is not feasible due to space limitations, the manufacturer has the

option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked.

Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in

accordance with MIL-PRF-38535, appendix A.

3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in

MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.

3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535

listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of

compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see

6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of

supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of

MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.

3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for

device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.

STANDARD

MICROCIRCUIT DRAWING

DLA LAND AND MARITIME

COLUMBUS, OHIO 43218-3990

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-00515

SHEET

5962R0051501VPA Related Products

	5962R0051501VPA	5962-0051501VPA	SIP-4769SD-02-2803FD	5962R0051501VHA
Description	Aerospace 7nS Single Comparator	Aerospace 7nS Single Comparator	Array/Network Resistor, Isolated, Thin Film, 0.6W, 280000ohm, 100V, 1% +/-Tol, 50ppm/Cel, Through Hole Mount, 6007, SIP-6	Aerospace 7nS Single Comparator
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP8,.3	DIP, DIP8,.3	SIP, 6007	CERAMIC, DFP-10
Reach Compliance Code	not_compliant	not_compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99
Number of functions	1	1	3	1
Number of terminals	8	8	6	10
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-65 °C	-55 °C
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR PACKAGE	RECTANGULAR
Package form	IN-LINE	IN-LINE	SIP	FLATPACK
surface mount	NO	NO	NO	YES
technology	BIPOLAR	BIPOLAR	THIN FILM	BIPOLAR
Brand Name	Analog Devices Inc	Analog Devices Inc	-	Analog Devices Inc
Is it lead-free?	Contains lead	Contains lead	-	Contains lead
Parts packaging code	DIP	DIP	-	DFP
Contacts	8	8	-	10
Amplifier type	COMPARATOR	COMPARATOR	-	COMPARATOR
Maximum input offset voltage	10000 µV	8000 µV	-	10000 µV
JESD-30 code	R-CDIP-T8	R-CDIP-T8	-	R-CDFP-F10
JESD-609 code	e0	e0	e0	-
Negative supply voltage upper limit	-7 V	-7 V	-	-7 V
Nominal Negative Supply Voltage (Vsup)	-5 V	-5 V	-	-5 V
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	-	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP	DIP	-	DFP
Encapsulate equivalent code	DIP8,.3	DIP8,.3	-	FL10,.3
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	-	220
power supply	3/5/+-5 V	3/5/+-5 V	-	3/5/+-5 V
Certification status	Qualified	Qualified	-	Qualified
Filter level	MIL-PRF-38535 Class V	MIL-PRF-38535 Class V	-	MIL-PRF-38535 Class V
Supply voltage upper limit	7 V	7 V	-	7 V
Nominal supply voltage (Vsup)	5 V	5 V	-	5 V
Temperature level	MILITARY	MILITARY	-	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn60Pb40)	-
Terminal form	THROUGH-HOLE	THROUGH-HOLE	-	FLAT
Terminal pitch	2.54 mm	2.54 mm	-	1.27 mm
Terminal location	DUAL	DUAL	-	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	-	30

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