Hall ICs
DN6847/SE/S
4.0±0.2
(1.0)
Wide operating temperature range
(−40°C to
+100°C)
Alternating magnetic field operation
■
Overview
In each of Hall ICs, a Hall element, an amplifier circuit,
a Schmidt circuit, a stabilized power supply, and a tem-
perature compensation circuit are integrated on a single
chip by IC technique. The Hall element output is ampli-
fied by the amplifier circuit, and converted into the corre-
sponding digital signals through the Schmidt circuit so
that TTL and MOS IC are directly drivable.
DN6847
4.5±0.2
Unit: mm
2.0±0.2
(1.0)
(5°)
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1.27
1 2 3
5°
2°
10.5±0.5
0.55±0.15
(1.0)
0.8±0.1
(0.7)
0.43
–0.05
+0.1
0.43
–0.05
+0.1
■
Features
•
High sensitivity and low drift
•
Stabilized temperature characteristics owing to addi-
tional integration of temperature compensation circuit.
•
Wide operating supply voltage range
(V
CC
=
4.5 V to 16 V)
•
Alternating magnetic field operation
•
TTL and MOS IC are directly drivable by the output.
•
Equipped with an output pull-up resistor (typical 27 kΩ)
■
Applications
•
Speed sensor, position sensor, rotation sensor, keyboard
switch, micro switch and the like
on
■
Block Diagram (DN6847/SE/S)
Ma
int
en
27 kΩ 3
0.4±0.15
2
Hall element Amplifier Schmidt
trigger
Output stage
GND
(4)
3.0±0.3
5.4±0.4
Note) The number in ( ) shows the pin number for the DN6847S.
ESOP004-P-0200
Note) The packages (SSIP003-P-0000A, SSIP003-P-
0000C and ESOP004-P-0200) of this product
will be changed to lead-free type (SSIP003-P-
0000H, SSIP003-P-0000J and ESOP004-P-
0200A). See the new package dimensions sec-
tion later of this datasheet.
0.2
–0.05
0.1±0.1
1 : V
CC
2 : N.C. or GND
3 : Output
4 : GND
0.4±0.2
+0.15
1.5±0.3
Output
0.95±0.2
N.C.
or
GND
(2)
an
Power supply circuit and
temperature compensation circuit
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1 : V
CC
2 : GND
3 : Output
SSIP003-P-0000A
DN6847SE
Unit: mm
4.52±0.3
(1.0)
0.55±0.15
12.5±06.5
4.52±0.3
(1.0)
(0.72)
0.4±0.1
1.27
(0.4)
123
1.54±0.1
1 : V
CC
2 : GND
3 : Output
tin
ue
SSIP003-P-0000C
DN6847S
1
0.6±0.2
Unit: mm
isc
4
ce
1
2
3
V
CC
3.0±0.3
/D
1.6
Publication date: November 2002
SPC00002CEB
1
DN6847/SE/S
■
Absolute Maximum Ratings
Parameter
Supply voltage
Supply current
Circuit current
Power dissipation
Operating ambient temperature
Storage temperature
Symbol
V
CC
I
CC
I
O
P
D
T
opr
T
stg
Rating
18
8
20
150
−40
to
+100
−55
to
+125
Unit
V
mA
mA
mW
°C
°C
Parameter
Symbol
V
CC
Supply voltage
■
Electrical Characteristics at T
a
=
25°C
Parameter
Symbol
B
1(L-H)
Operating magnetic flux density
B
2(H-L)
BW
V
OL
Hysteresis width
Output voltage
V
OH
Output short circuit current
Supply current
−I
OS
I
CC
Note) 1. The variation of operating magnetic flux density does not depend on supply voltage due to its built-in stabilized power
source. (V
CC
should be confined to the range of 4.5 V to 16 V.)
2. A supply current increases by approximately 1 mA when its output level varies from high to low.
•
Position of Hall element (unit: mm)
A Hall element is placed on the shaded part in the figure.
DN6847
DN6847SE
1.0 1.63
Ma
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■
Technical Data
1.
0
1.0 1.75
1.0
1.0
1.25
1.3
1.5
Distance from package surface to sensor part
0.7
2
0.42
SPC00002CEB
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Range
Unit
V
4.5 to 16
Conditions
Min
7
Typ
−6
6
Max
Unit
mT
V
CC
=
12 V
V
CC
=
12 V
−17.5
17.5
mT
mT
V
V
CC
=
12 V
10
V
CC
=
4.5 V to 16 V, I
O
=
12 mA,
B
=
17.5 mT
0.4
V
CC
=
16 V, I
O
= −30 µA,
B
= −17.5
mT
14.7
2.9
V
V
CC
=
4.5 V, I
O
= −30 µA,
B
= −17.5
mT
V
CC
=
16 V
V
V
CC
=
16 V, V
O
=
0 V, B
= −17.5
mT
V
CC
=
4.5 V
0.4
1
0.9
6
mA
mA
1
5.5
mA
DN6847S
1.
0
1.5
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Note) This IC is not suitable for car electrical equipment.
■
Recommended Operating Range
/D
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tin
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0.65
DN6847/SE/S
■
Technical Data (continued)
•
Magneto-electro conversion characteristics
Output voltage V
O
Marked face
B
L-H
B
H-L
8
7
6
V
CC
=
16 V
5
4
V
CC
=
4.5 V
3
2
1
0
−50
−25
0
25
50
75
100
isc
on
Operating magnetic flux density
Supply voltage
tin
ue
Ambient temperature T
a
(°C)
20
ce
/D
T
a
=
25°C
Operating magnetic flux density B (mT)
B
H-L
10
Low-level output voltage V
OL
(mV)
0
B
L-H
−10
−20
0
2
4
6
8
10
12
14
16
18
Supply voltage V
CC
(V)
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V
CC
=
12 V
20
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Applying direction of magnetic flux
Magnetic flux density B
•
Main characteristics
Supply current
Ambient temperature
Operating magnetic flux density
Ambient temperature
Operating magnetic flux density B (mT)
Supply current I
CC
(mA)
10
Sample 1
B
H-L
Sample 2 B
H-L
0
Samp
le 3 B
H
-L
Sample 1 B
L-H
−10
Sample 2 B
L-H
Sample
3 B
L
-H
−20
125
−50
−25
0
25
50
75
100
125
Ambient temperature T
a
(°C)
Low-level output voltage
Ambient temperature
100
V
CC
=
12 V
I
O
=
12 mA
90
80
70
60
50
40
30
20
10
Ma
int
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an
0
20
−50
−25
0
25
50
75
100
125
Ambient temperature T
a
(°C)
SPC00002CEB
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DN6847/SE/S
■
Caution on Use of Hall ICs
The Hall ICs are often used to detect movement. In such cases, the position of the Hall IC may be changed by
exposition to shock or vibration over a long period of time, and it causes the detection level change. To prevent this, fix
the package with adhesives or fix it on a dedicated case.
1. A case using an adhesive
Some kinds of adhesive generate corrosive gas (such as chloric gas) during curing. This corrosive gas corrodes
the aluminum on the surface of the Hall IC, and may cause a functional defect of disconnection.
If Hall IC is to be sealed after installation, attention should be given to the adhesive or resin used for peripherals
and substrate cleaner, as well as to the adhesive used for Hall IC installation. Please confirm the above matter to those
manufacturers before using.
We could not select the specified adhesive, for we find it difficult to guarantee the ingredient of each adhesive.
2. A case bending lead wire
Wrong
Correct
Bend the lead wire without stressing the package.
Wrong
Wrong
Fixed
W
W
Fixed
Bending method of lead wire
Ma
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3. Power supply line/Power transmission line
If a power supply line/power transmission line becomes longer, noise and/or oscillation may be found on the
line. In this case, set the capacitor of 0.1
µF
to 10
µF
near the Hall IC to prevent it.
If a voltage of 18 V or more is thought to be applied to the power supply line (flyback voltage from coil or the
ignition pulse, etc.), avoid it with external components (capacitor, resistor, Zener diode, diode, surge absorbing ele-
ments, etc.).
4. On mounting of the surface mount type package (ESOP004-P-0200)
Set pin 2 of the ESOP004-P-0200 package open, or connect it to GND. The IC will be damaged if it is connected
to V
CC
.
When mounted on the printed circuit board, the Hall IC may be highly stressed by the warp that may occur from
the soldering. This may also cause a change in the operating magnetic flux density and a deterioration of its resistance
to moisture.
Wrong
5. V
CC
and GND
Do not reverse V
CC
and GND. If the V
CC
and GND pins are reversely connected, this IC will be destroyed. If the
IC GND-pin voltage is set higher than other pin voltage, the IC configuration will become the same as a forward
biased diode. Therefore, it will turn on at the diode forward voltage (approximately 0.7 V), and a large current will
flow through the IC, ending up in its destruction. (This is common to monolithic IC.)
6. Cautions on power-on of Hall IC
When a Hall IC is turned on, the position of the magnet or looseness may change the output of a Hall IC, and a pulse
may be generated. Therefore, care should be given whenever the output state of a Hall IC is critical when the supply
power is on.
4
SPC00002CEB
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Correct
M
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(a)
W Fixed
Wrong
3 mm *
Correct
(b)
3 mm *
Bending position of lead wire
*: The distance can be within 3 mm, if no stress is applied
to the resin mold by tightly fixing the lead wires with a
metallic mold or the like.
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DN6847/SE/S
■
Caution on Use of Hall ICs (continued)
7. Fixing a Hall IC
When the Hall IC of an insertion type package installed by soldering the lead wire only is to be used under
vibration, fix it firmly with a holder. Otherwise, vibration may cause metal fatigue in the lead wire of Hall IC,
resulting in wire breakage.
8. On fixing a Hall IC to holder
When a Hall IC is mounted on the printed circuit board with a holder and the coefficient of expansion of the holder
is large, the lead wire of the Hall IC will be stretched and it may give a stress to the Hall IC.
If the lead wire is stressed intensely due to the distortion of holder or board, the adhesives between the package
and the lead wire may be weakened and cause a minute gap resulting in the deterioration of its resistance to moisture.
Sensitivity may also be changed by this stress.
9. On using flux in soldering
Choose a flux which does not include ingredients from halogen group, such as chlorine, fluorine, etc. The
ingredients of halogen group may enter where the lead frame and package resin joint, causing corrosion and the
disconnection of the aluminum wiring on the surface of an IC chip.
10. In case of the magnetic field of a magnet is too strong
Output may be inverted when applying a magnetic flux density of 100 mT or more. Accordingly, magnetic flux
density should be used within the range of 100 mT.
11. On mounting , deburring and soldering of insertion type package
If the leads of a Hall IC in an insertion type package are inserted up to their root part through holes on the printed
circuit board, abnormal stress is applied to the package and the reliability of the Hall IC is likely to deteriorate. So,
when mounting each Hall IC of the insertion type, insert the leads in due degree at which the bottom face of the package
is separated at least 2 mm from the top face of the PCB.
Also note that burrs of epoxy resin may be left sticking to the lead wires. (We are trying to remove such burrs as
Remaining burrs
much as possible in the deburring process, but in some cases, they are not perfectly removable.)
12. On surface treatment of mini-mold package
Surface treatment is available in either smooth or dull finish.
13. On soldering of the surface mount type package
Surface mounting type Hall ICs are apt to change its electrical characteristics due to the stress from soldering at
mounting. Therefore, avoid the mounting by flow (dipping) and a soldering iron. Please mount it by reflow soldering
abiding by its recommended conditions.
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Printed board
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2 mm
When soldering the leads, remenber to separate
the soldering position by 2 mm or more from
the resin part of the package.
SPC00002CEB
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