Datasheet
Serial EEPROM Series for Automotive EEPROM
125 °C Operation I
2
C BUS EEPROM
for Automotive (2-Wire)
BR24H256xxx-5AC Series
General Description
BR24H256xxx-5AC Series is a 256 Kbit serial EEPROM
of I
2
C BUS Interface.
Key Specifications
Write Cycles:
4 Million Times (Ta=25 °C)
Data Retention:
100 Years (Ta=25 °C)
Write Cycle Time:
3.5 ms (Max)
Supply Voltage:
1.7 V to 5.5 V
Ambient Operating Temperature:
-40 °C to +125 °C
W(Typ) x D(Typ) x H(Max)
5.00 mm x 6.20 mm x 1.71 mm
4.90 mm x 6.00 mm x 1.65 mm
3.00 mm x 6.40 mm x 1.20 mm
2.90 mm x 4.00 mm x 0.90 mm
2.00 mm x 3.00 mm x 0.60 mm
Features
AEC-Q100 Qualified
(Note 1)
All Controls Available by 2 Ports of Serial Clock
(SCL) and Serial Data (SDA)
1.7 V to 5.5 V Wide Limit of Operating Voltage,
Possible 1 MHz Operation
Page Write Mode 64 Byte
Bit Format 32K x 8 bit
Low Current Consumption
Prevention of Miswriting
WP (Write Protect) Function Added
Prevention of Miswriting at Low Voltage
Noise Filter Built-in SCL / SDA Pin
Initial Delivery State FFh
Packages
SOP8
SOP-J8
TSSOP-B8
MSOP8
VSON008X2030
(Note 1)
Grade 1
Applications
Automotive Camera
Automotive Electronics
SOP8
MSOP8
Typical Application Circuit
V
CC
A0
*
A1
A2
GND
VCC
WP
SCL
SDA
0.1 µF
Figure 2
* Connect A0, A1, A2 to VCC or GND.
These pins have pull-down elements inside the IC.
If pins are open, they are the same as when they are connected to GND.
SOP-J8
VSON008X2030
Micro-
controller
TSSOP-B8
Figure 1. Typical Application Circuit
〇Product
structure : Silicon integrated circuit
.
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〇This
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BR24H256xxx-5AC Series
Contents
General Description ........................................................................................................................................................................ 1
Features.......................................................................................................................................................................................... 1
Applications .................................................................................................................................................................................... 1
Typical Application Circuit ............................................................................................................................................................... 1
Key Specifications........................................................................................................................................................................... 1
Packages ........................................................................................................................................................................................ 1
Contents ......................................................................................................................................................................................... 2
Pin Configuration ............................................................................................................................................................................ 3
Pin Description................................................................................................................................................................................ 3
Block Diagram ................................................................................................................................................................................ 3
Absolute Maximum Ratings ............................................................................................................................................................ 4
Thermal Resistance ........................................................................................................................................................................ 4
Operating Conditions ...................................................................................................................................................................... 5
Input / Output Capacitance ............................................................................................................................................................. 5
Input Impedance ............................................................................................................................................................................. 5
Memory Cell Characteristics ........................................................................................................................................................... 6
Electrical Characteristics................................................................................................................................................................. 6
AC Characteristics .......................................................................................................................................................................... 7
AC Characteristics Condition .......................................................................................................................................................... 7
Input / Output Timing ...................................................................................................................................................................... 8
Typical Performance Curves ........................................................................................................................................................... 9
I
2
C BUS Communication............................................................................................................................................................... 18
Write Command ............................................................................................................................................................................ 19
Read Command............................................................................................................................................................................ 20
Method of Reset ........................................................................................................................................................................... 21
Acknowledge Polling ..................................................................................................................................................................... 21
WP Valid Timing (Write Cancel) .................................................................................................................................................... 22
Command Cancel by Start Condition and Stop Condition ............................................................................................................. 22
Application Examples ................................................................................................................................................................... 23
Caution on Power-Up Conditions.................................................................................................................................................. 25
Low Voltage Malfunction Prevention Function .............................................................................................................................. 25
I/O Equivalence Circuits................................................................................................................................................................ 26
Operational Notes ......................................................................................................................................................................... 27
Ordering Information ..................................................................................................................................................................... 28
Lineup ........................................................................................................................................................................................... 28
Marking Diagrams ......................................................................................................................................................................... 29
Physical Dimension and Packing Information ............................................................................................................................... 30
Revision History ............................................................................................................................................................................ 35
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BR24H256xxx-5AC Series
Pin Configuration
(TOP VIEW)
A0
A1
A2
GND
1
2
3
4
8
8
7
6
5
VCC
WP
SCL
SDA
A0 1
A1
2
(TOP VIEW)
8 VCC
7 WP
6 SCL
EXP-PAD
5 SDA
A2 3
GND 4
Figure 3-(a). Pin Configuration
(SOP8, SOP-J8, TSSOP-B8, MSOP8)
Figure 3-(b). Pin Configuration
(VSON008X2030)
Pin Description
Pin No.
1
2
3
4
5
6
7
8
-
Pin Name
A0
A1
A2
GND
SDA
SCL
WP
VCC
EXP-PAD
Input / Output
Input
Input
Input
-
Input / Output
Input
Input
-
-
Descriptions
Slave address setting
(Note 2)
Slave address setting
(Note 2)
Slave address setting
(Note 2)
Reference voltage of all input / output, 0 V
Serial data input / serial data output
(Note 3)
Serial clock input
Write protect pin
(Note 4)
Connect the power source
Leave as OPEN or connect to GND
(Note 2)
Connect to VCC or GND. There are pull-down elements inside the IC. If pins are open, they are the same as when they are connected to GND.
(Note 3)
SDA is NMOS open drain, so it requires a pull-up resistor.
(Note 4)
Connect to VCC or GND, or control to ‘HIGH’ level or ‘LOW’ level. There are pull-down elements inside the IC. If this pin is open, this input is recognized
as ‘LOW’.
Block Diagram
A0
1
256 Kbit EEPROM Array
8 bit
Address
Decoder
Word
Address Register
Data
Register
8
VCC
A1
2
15 bit
7
WP
START
STOP
A2 3
Control Circuit
ACK
6
SCL
GND 4
High Voltage
Generating Circuit
Supply Voltage
Detection
5
SDA
Figure 4. Block Diagram
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BR24H256xxx-5AC Series
Absolute Maximum Ratings
Parameter
Supply Voltage
Symbol
V
CC
Rating
-0.3 to +6.5
Unit
V
Remark
Ta=25 °C
Ta=25 °C. The maximum value of input
voltage/ output voltage is not over than 6.5 V.
When the pulse width is 50ns or less, the
minimum value of input voltage/output voltage
is -1.0 V.
Ta=25 °C
Ta=25 °C
Input Voltage / Output Voltage
-
-0.3 to V
CC
+1.0
V
Electro Static Discharge
(Human Body Model)
Maximum Output Low Current
(SDA)
Maximum Junction Temperature
Storage Temperature Range
V
ESD
I
OLMAX
Tjmax
Tstg
-3000 to +3000
10
150
-65 to +150
V
mA
°C
°C
Caution 1:
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2:
Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance
(Note 5)
Parameter
SOP8
Junction to Ambient
Junction to Top Characterization Parameter
(Note 6)
SOP-J8
Junction to Ambient
Junction to Top Characterization Parameter
(Note 6)
TSSOP-B8
Junction to Ambient
Junction to Top Characterization Parameter
(Note 6)
MSOP8
Junction to Ambient
Junction to Top Characterization Parameter
(Note 6)
θ
JA
Ψ
JT
284.1
21
135.4
11
°C/W
°C/W
θ
JA
Ψ
JT
251.9
31
152.1
20
°C/W
°C/W
θ
JA
Ψ
JT
149.3
18
76.9
11
°C/W
°C/W
θ
JA
Ψ
JT
197.4
21
109.8
19
°C/W
°C/W
Symbol
Thermal Resistance (Typ)
1s
(Note 7)
2s2p
(Note
8)
Unit
(Note 5)
Based on JESD51-2A(Still-Air)
(Note 6)
The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 7)
Using a PCB board based on JESD51-3.
(Note 8)
Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Single
Top
Copper Pattern
Footprints and Traces
Layer Number of
Measurement Board
4 Layers
Top
Copper Pattern
Footprints and Traces
Material
FR-4
Board Size
114.3 mm x 76.2 mm x 1.57 mmt
Thickness
70 µm
Material
FR-4
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
Thickness
70 µm
Copper Pattern
74.2 mm x 74.2 mm
Thickness
35 µm
Bottom
Copper Pattern
74.2 mm x 74.2 mm
Thickness
70 µm
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BR24H256xxx-5AC Series
Thermal Resistance
(Note 9)
- continued
Parameter
VSON008X2030
Junction to Ambient
Junction to Top Characterization Parameter
(Note 10)
θ
JA
Ψ
JT
308.3
43
69.6
10
°C/W
°C/W
Symbol
Thermal Resistance (Typ)
1s
(Note 11)
2s2p
(Note
12)
Unit
(Note 9)
Based on JESD51-2A(Still-Air)
(Note 10)
The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 11)
Using a PCB board based on JESD51-3.
(Note 12)
Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Single
Top
Copper Pattern
Footprints and Traces
Layer Number of
Measurement Board
4 Layers
Top
Copper Pattern
Footprints and Traces
Material
FR-4
Board Size
114.3 mm x 76.2 mm x 1.57 mmt
Thickness
70 µm
Material
FR-4
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
Thickness
70 µm
Copper Pattern
74.2 mm x 74.2 mm
Thickness
35 µm
Thermal Via
(Note 13)
Pitch
Diameter
1.20 mm
Φ0.30 mm
Bottom
Copper Pattern
74.2 mm x 74.2 mm
Thickness
70 µm
(Note 13)
This thermal via connects with the copper pattern of all layers.
Operating Conditions
Parameter
Supply Voltage
Ambient Operating Temperature
Bypass Capacitor
(Note 14)
Symbol
V
CC
Ta
C
Min
1.7
-40
0.1
Typ
-
-
-
Max
5.5
+125
-
Unit
V
°C
µF
(Note 14)
Connect a bypass capacitor between the IC’s VCC and GND pin.
Input / Output Capacitance (Ta=25 °C, f=1 MHz)
Parameter
Input / Output Capacitance
(SDA)
(Note 15)
Input Capacitance
(SCL, A0, A1, A2, WP)
(Note 15)
(Note 15)
Not 100% TESTED.
Symbol
C
I/O
C
IN
Min
-
-
Typ
-
-
Max
8
8
Unit
pF
pF
V
I/O
=GND
V
IN
=GND
Conditions
Input Impedance (Unless otherwise specified, Ta=-40 °C to +125 °C, V
CC
=1.7 V to 5.5 V)
Parameter
Input Impedance 1
Input Impedance 2
Symbol
Z
IH
Z
IL
Min
500
30
Typ
-
-
Max
-
-
Unit
kΩ
kΩ
Conditions
0.7V
CC
≤V
IN
(A0, A1, A2, WP)
V
IN
≤0.3V
CC
(A0, A1, A2, WP)
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