EEWORLDEEWORLDEEWORLD

Part Number

Search
 PDF

895-018-560-802

Description
18 位置 母头 连接器 非指定 - 双边 镀金 0.100"(2.54mm) 黑色
CategoryThe connector    Card edge connector   
File Size318KB,4 Pages
ManufacturerEDAC
Environmental Compliance
Download Datasheet Parametric View All

895-018-560-802 Online Shopping

Suppliers Part Number Price MOQ In stock  
895-018-560-802 - - View Buy Now

895-018-560-802 Overview

18 位置 母头 连接器 非指定 - 双边 镀金 0.100"(2.54mm) 黑色

895-018-560-802 Parametric

Parameter NameAttribute value
category
MakerEDAC
series895
PackageBulk
card typeUnspecified - Bilateral
genderfemale head
针位/格/排数9
Number of needles18
Card thickness0.054" ~ 0.070"(1.37mm ~ 1.78mm)
Number of rows2
spacing0.100"(2.54mm)
readingpair
characteristicadapter board
Installation typeBoard edge, straddle mounted
Terminationwelding
Contact materialcopper alloy
触头表面处理gold plated
触头表面处理厚度10.0µin(0.25µm)
Contact typecantilever
colorblack
法兰特征Top mounting opening, unthreaded, 0.128" (3.25mm) diameter
Operating temperature-40°C ~ 125°C
Material - InsulationPolyphenylene sulfide (PPS)
Termination Rows2
Basic product number895-018
Take a look at Keysight's IoT device functional test solution. This question is too easy!
[size=4]Event details>>[/size][url=https://www.eeworld.com.cn/huodong/Keysight-20180730/index.html][size=4][color=blue]See Keysight Technologies X8711A IoT device functional test solution, answer ques...
EEWORLD社区 Test/Measurement
Xunwei 4418 development board Linux system TFTP transfer file
TFTP (Trivial File Transfer Protocol) is a protocol based on UDP protocol for simple file transfer between client and server. It is suitable for low-cost and uncomplicated applications. TFTP protocol ...
遥寄山川 ARM Technology
How to use the amplifier?
[size=16px]I would like to ask an expert. Amplifiers are used in circuits. These amplifiers are marked with the model number, but why are some amplifiers not marked with the model number but only with...
狗尾草 Embedded System
Thermal Design of Semiconductor Components: Heat Transfer and Heat Dissipation Paths
Heat is transferred through objects and space. Transfer is the movement of heat from a source to another location.Three forms of heat transferThere are three main forms of heat transfer: conduction, c...
btty038 RF/Wirelessly
STM32 Help
I now have a RTC routine, how can I display the date and time on the screen! ! Help! ! !...
wkiddw stm32/stm8
Waiting for the experts to enlighten me, talk about the characteristics of each version of wince, and its relationship with the net framework, and recommend a few books
Waiting for the experts to enlighten me, talk about the characteristics of each version of wince, and its relationship with the net framework, and recommend a few books...
osoon2008 Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1446  1273  2041  1541  2525  30  26  42  32  51 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号