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93L451DM

Description
OTP ROM, 1KX8, 75ns, TTL, CDIP24,
Categorystorage    storage   
File Size207KB,6 Pages
ManufacturerFairchild
Websitehttp://www.fairchildsemi.com/
Download Datasheet Parametric Compare View All

93L451DM Overview

OTP ROM, 1KX8, 75ns, TTL, CDIP24,

93L451DM Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerFairchild
package instructionDIP, DIP24,.6
Reach Compliance Codecompliant
Maximum access time75 ns
JESD-30 codeR-XDIP-T24
JESD-609 codee0
memory density8192 bit
Memory IC TypeOTP ROM
memory width8
Humidity sensitivity level2A
Number of terminals24
word count1024 words
character code1000
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize1KX8
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.6
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)250
power supply5 V
Certification statusNot Qualified
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyTTL
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
Base Number Matches1
This Material Copyrighted By Its Respective Manufacturer

93L451DM Related Products

93L451DM 93L451FM 93L451FC 93L450FC 93L451DC 93L450DM 93L450DC 93L450FM 93L450PC 93L451PC
Description OTP ROM, 1KX8, 75ns, TTL, CDIP24, OTP ROM, 1KX8, 75ns, TTL, CDFP24, OTP ROM, 1KX8, 60ns, TTL, CDFP24, OTP ROM, 1KX8, TTL, CDFP24, OTP ROM, 1KX8, 60ns, TTL, CDIP24, OTP ROM, 1KX8, TTL, CDIP24, OTP ROM, 1KX8, TTL, CDIP24, OTP ROM, 1KX8, TTL, CDFP24, OTP ROM, 1KX8, TTL, PDIP24, OTP ROM, 1KX8, 60ns, TTL, PDIP24,
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker Fairchild Fairchild Fairchild Fairchild Fairchild Fairchild Fairchild Fairchild Fairchild Fairchild
package instruction DIP, DIP24,.6 DFP, FL24,.4 DFP, FL24,.4 DFP, FL24,.4 DIP, DIP24,.6 DIP, DIP24,.6 DIP, DIP24,.6 DFP, FL24,.4 DIP, DIP24,.6 DIP, DIP24,.6
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant compliant compli
JESD-30 code R-XDIP-T24 R-XDFP-F24 R-XDFP-F24 R-XDFP-F24 R-XDIP-T24 R-XDIP-T24 R-XDIP-T24 R-XDFP-F24 R-PDIP-T24 R-PDIP-T24
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0 e0
memory density 8192 bit 8192 bit 8192 bit 8192 bit 8192 bit 8192 bit 8192 bit 8192 bit 8192 bit 8192 bi
Memory IC Type OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM
memory width 8 8 8 8 8 8 8 8 8 8
Number of terminals 24 24 24 24 24 24 24 24 24 24
word count 1024 words 1024 words 1024 words 1024 words 1024 words 1024 words 1024 words 1024 words 1024 words 1024 words
character code 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000
Maximum operating temperature 125 °C 125 °C 70 °C 70 °C 70 °C 125 °C 70 °C 125 °C 70 °C 70 °C
organize 1KX8 1KX8 1KX8 1KX8 1KX8 1KX8 1KX8 1KX8 1KX8 1KX8
Package body material CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DFP DFP DFP DIP DIP DIP DFP DIP DIP
Encapsulate equivalent code DIP24,.6 FL24,.4 FL24,.4 FL24,.4 DIP24,.6 DIP24,.6 DIP24,.6 FL24,.4 DIP24,.6 DIP24,.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE FLATPACK FLATPACK FLATPACK IN-LINE IN-LINE IN-LINE FLATPACK IN-LINE IN-LINE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
surface mount NO YES YES YES NO NO NO YES NO NO
technology TTL TTL TTL TTL TTL TTL TTL TTL TTL TTL
Temperature level MILITARY MILITARY COMMERCIAL COMMERCIAL COMMERCIAL MILITARY COMMERCIAL MILITARY COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE FLAT FLAT FLAT THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE FLAT THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 1.27 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL

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