MPLAB
®
ICE 2000
Processor Module and Device Adapter Specification
CONTENTS
1.0 Introduction ......................................................... 1
2.0 MPLAB ICE 2000 System................................... 1
3.0 Emulator-Related Issues .................................... 2
4.0 Processor Modules ............................................. 2
5.0 Device Adapters ................................................. 4
6.0 Device Adapter Target Footprints ....................... 9
2.0
MPLAB ICE 2000 SYSTEM
A brief overview of the different components of the
system is shown in the figure below. Each component
is discussed in the following subsections.
FIGURE 2-1:
MPLAB
®
ICE 2000
EMULATOR SYSTEM
Emulator Pod
Processor Module
with Cable
Communications Cable
1.0
INTRODUCTION
Power Supply
Cable
Logic Probe
Connector
The processor modules for MPLAB
®
ICE 2000 are
interchangeable personality modules that allow
MPLAB ICE 2000 to be reconfigured for emulation of
different PIC
®
microcontrollers (MCUs). This modular-
ity allows the emulation of many different devices with
the addition of a processor module and device adapter,
which provides a very cost effective multiprocessor
emulation system.
The device adapters for MPLAB ICE 2000 are inter-
changeable assemblies that allow the emulator system
to interface to a target application system. Device
adapters also have control logic that allows the target
application to provide a clock source and power to the
processor module. The device adapters support PIC
MCUs in DIP, SDIP and PLCC packages.
Transition sockets, used along with a device adapter,
provide a method of accommodating all PIC MCU
packages, including SOIC, SSOP, PQFP and TQFP
packages.
Device Adapter
Transition Socket
2.1
Host to Pod Cable
This is a standard parallel interface cable. MPLAB ICE
2000 is tested with a 6-foot cable. A longer cable may
work, but is not ensured. The cable connects to a par-
allel port on the PC. If a PC has a printer connected to
an LPT device, it is recommended that an additional
interface card be installed, rather than using a splitter
or an A/B switch.
2.2
Emulator Pod
The Emulator Pod contains emulator memory and
control logic. MPLAB ICE 2000 contains a main board
and an additional board for expanded trace memory
and complex control logic. There are no field service-
able parts in the pod. For more information on the pod,
see the MPLAB ICE 2000 on-line help file in MPLAB
IDE (Help>Topics) or the “MPLAB
®
ICE 2000
In-Circuit Emulator User’s Guide”
(DS51488).
The MPLAB ICE 2000 processor module is inserted
into the pod for operation.
2.3
Processor Module
The processor module contains the emulator chip, logic
and low-voltage circuitry. There are no field-serviceable
parts mounted on the printed circuit board housed
within the processor module enclosure.
©
2007 Microchip Technology Inc.
DS51140N-page 1
MPLAB
®
ICE 2000
2.4
Flex Circuit Cable
3.0
EMULATOR-RELATED ISSUES
Once the processor module is inserted into the
emulator pod, the flex circuit cable extends the
emulator system to the target application. This is a
custom cable that is attached inside the processor
module enclosure, and can be replaced in the field by
removing the end cap of the processor module
enclosure.
Please, DO NOT PULL on the flex circuit cable to
remove the processor module from the pod. Use the
fins of the processor module end cap to leverage the
module from the pod.
Emulator analog functions may not operate within the
performance specifications published in the device
data sheet due to parasitic capacitance (up to 120 pf)
of the flex cable.
General limitations that apply to the MPLAB ICE 2000
emulator may be found in the on-line help. Select
Help>Topics
and then select “MPLAB ICE 2000” under
“Debuggers”.
Device-specific limitations can be found as above or by
selecting
Debugger>Settings,
clicking the
Limitations
tab, and then clicking the
Details
button.
4.0
PROCESSOR MODULES
2.5
Device Adapter
Processor modules are identified on the top of the
assembly (e.g., PCM18XA0). To determine which
processors are supported by a specific module, refer to
the file “Readme for MPLAB ICE 2000.txt” in the
MPLAB IDE installation directory or the latest “Product
Selector Guide”
(DS00148), which can be found on the
Microchip web site at www.microchip.com.
A typical processor module contains a special bond-out
version of a PIC MCU, with device buffers to control
data flow and control logic. It provides the means of
configuring the MPLAB ICE 2000 emulator for a
specific PIC MCU family and handles low-voltage emu-
lation when needed.
Note:
When removing the processor module, DO
NOT PULL on the flex cable. Use the tabs
on the processor module or damage to the
flex cable may occur.
The device adapter provides a common interface for
the device being emulated. It is provided in standard
DIP and PLCC styles. The adapter also contains a spe-
cial device that provides an oscillator clock to accu-
rately emulate the oscillator characteristics of the PIC
MCU.
Due to components on the device adapter, which
require target power, the device adapter should be
removed from the flex circuit cable (see Figure 2-1)
when emulator power is being used and the processor
module is not connected to the target. This will
eliminate any loading effects on I/O pins.
4.1
Power
2.6
Transition Socket
Transition Sockets are available in various styles to
allow a common device adapter to be connected to one
of the supported surface mount package styles. Transi-
tion sockets are available for various pin counts and
pitches for SOIC, QFP and other styles. For more infor-
mation on transition sockets, see the “MPLAB
®
ICE
2000/4000 Transition Socket Specification”
(DS51194).
An emulator system consists of the following
components which can be ordered separately:
• An emulator pod (including the host-to-pod cable
and power supply)
• A processor module (including the flex circuit
cable)
• A device adapter
• An optional transition socket (for surface mount
emulation)
The operating voltage for most of the control logic and
buffering on the processor module is +5V and is
supplied by the emulator pod. Power to the emulator
processor and some of its surrounding buffers is user-
selectable, and can be powered by the emulator pod
(at +5V only) or the target application system (from
2.0V to 5.5V). This is software selectable and is
configurable through the MPLAB IDE software. At no
time will the emulator system directly power the target
application system. ALWAYS insert the processor
module into the emulator pod before applying power to
the pod.
When connecting to a target application system, there
may be a voltage level on the target application even
though power has not yet been applied to the target
application circuit. This is normal, and is due to current
leakage through V
CC
of the device adapter. The current
leakage will typically be less than 20 mA. However, if
the target application is using a voltage regulator, it
should be noted that some regulators require the use of
an external shunt diode between V
IN
and V
OUT
for
reverse-bias protection. Refer to the manufacturer’s
data sheets for additional information.
DS51140N-page 2
©
2007 Microchip Technology Inc.
4.1.1
EMULATOR PROCESSOR POWER
SUPPLIED BY EMULATOR SYSTEM
4.1.4
OPERATING VOLTAGE OF 2.0 TO 4.6
VOLTS
If the emulator system is selected to power the emula-
tor processor in the processor module, the emulator
system can be operated without being connected to a
target application. If the system is being connected to a
target application, the power to the pod should be
applied before applying power to the target application.
The target application system’s V
CC
will experience a
small current load (10 mA typical) when the emulator
system is connected via a device adapter. This is
because the target system must always power the
clock chip in the processor module.
4.1.2
EMULATOR PROCESSOR POWER
SUPPLIED BY TARGET APPLICATION
SYSTEM
If the target application system’s operating voltage is
between 2.0V and 4.55V (±120 mV), the processor
module will consider this a LOW VOLTAGE condition.
In this mode, the processor is limited to its rated speed
at a given voltage level (as indicated in its data sheet).
To minimize the amount of reverse current that the
target system is exposed to, the recommended
power-up sequence is:
1.
2.
3.
4.
Apply power to the PC host.
Apply power to the emulator pod and processor
module assembly.
Invoke MPLAB IDE.
Select
Debugger > Settings
and click the
Power
tab. Configure system for “Processor Power
Supplied by Target Board”.
At the error message, apply power to the target
application circuit. Then acknowledge the error.
Issue a System Reset (from the debugger
menu) before proceeding.
Select
Debugger > Settings
and click the
Power
tab. Verify that the dialog says “Low Voltage
Enabled.” Click
Cancel
to close the dialog.
When the MPLAB IDE software is brought up, the
emulator system is first initialized with the emulator
system powering the emulator processor. The
“Processor Power Supplied by Target Board” option
may then be selected using the
Power
tab of the
Settings dialog (Debugger>Settings) to power the
processor module from the target board.
When operating from external power, the processor
module will typically represent a current load equivalent
to the device being emulated (according to its data
sheet) plus approximately 100 mA. Keep in mind that
the target application will affect the overall current load
of the processor module, dependent upon the load
placed upon the processor I/O.
When the processor power is supplied by the target
application system, an external clock (from the target
board) may also be provided. MPLAB IDE will not allow
use of an external clock without the use of external
power.
4.1.3
OPERATING VOLTAGE OF 4.6 TO 5.5
VOLTS
5.
6.
7.
4.2
Operating Frequency
The processor modules will support the maximum
frequency (except where noted in
Section 3.0
“Emulator-Related Issues”)
of the device under
emulation. The maximum frequency of a PIC MCU
device is significantly lower when the operating volt-
age is less than 4.5V.
The processor modules will support a minimum
frequency of 32 kHz. When operating at low
frequencies, response to the screen may be slow.
4.3
Clock Options
If the target application system’s operating voltage is
between 4.55V (±120 mV) and 5.5V, the processor
module will consider this a STANDARD VOLTAGE
condition. In this mode, the processor can run to its
highest rated speed (as indicated in its data sheet).
The recommended power-up sequence is:
1.
2.
3.
4.
Apply power to the PC host.
Apply power to the emulator pod and processor
module assembly.
Invoke MPLAB IDE.
Select
Debugger > Settings
and click the
Power
tab. Configure system for “Processor Power
Supplied by Target Board”.
At the error message, apply power to the target
application circuit. Then acknowledge the error.
Issue a System Reset (from the debugger
menu) before proceeding.
MPLAB ICE 2000 allows internal and external clocking.
When set to internal, the clock is supplied from the
internal programmable clock, located in the emulator
pod. When set to external, the oscillator on the target
application system will be utilized.
4.3.1
CLOCK SOURCE FROM EMULATOR
Refer to the MPLAB ICE 2000 on-line help file in
MPLAB IDE (Help>Topics) or the “MPLAB
®
ICE 2000
In-Circuit Emulator User’s Guide”
(DS51488), “Using
the On-Board Clock”, for configuring MPLAB IDE to
supply the clock source.
5.
6.
©
2007 Microchip Technology Inc.
DS51140N-page 3
MPLAB
®
ICE 2000
4.3.2
CLOCK SOURCE FROM THE TARGET
APPLICATION
4.5
Freeze Mode
If the target application is selected to provide the clock
source, the target board must also be selected to
power the emulator processor (see the MPLAB ICE
2000 on-line help file in MPLAB IDE (Help>Topics) or
the “MPLAB
®
ICE 2000 In-Circuit Emulator User’s
Guide”
(DS51488), “Using a Target Board Clock”).
At low voltage, the maximum speed of the processor
will be limited to the rated speed of the device under
emulation.
An oscillator circuit on the device adapter generates a
clock to the processor module and buffers the clock
circuit on the target board. In this way, the MPLAB ICE
2000 emulator closely matches the oscillator options of
the actual device. All oscillator modes are supported
(as documented in the device’s data sheet) except as
noted in
Section 3.0 “Emulator-Related Issues”.
The
OSC1 and OSC2 inputs of the device adapter have a
5 pF to 10 pF load. Be aware of this when using a
crystal in HS, XT, LP or LF modes, or an RC network in
RC mode.
The frequency of the emulated RC network may vary
relative to the actual device due to emulator circuitry.
If a specific frequency is important, adjust the RC val-
ues to achieve the desired frequency. Another alterna-
tive would be to allow the emulator to provide the
clock as described in
Section 4.3.1 “Clock Source
from Emulator”.
When using the target board clock, the system’s
operating voltage is between 2.5V and 5.5V.
The MPLAB ICE 2000 system allows the option of
“freezing” peripheral operation or allowing them to
continue operating when the processor is halted. This
option is configured in the MPLAB IDE. The Freeze
function is available on all processor modules except
the PCM16XA0.
This function is useful to halt an on-board timer while at
a break point. At a break point and while single
stepping, interrupts are disabled.
5.0
DEVICE ADAPTERS
Device adapters are identified by a DVA number (e.g.,
DVA16XP180, DVA1003). To determine which device
adapters support which processor modules, refer to the
file “Readme for MPLAB ICE 2000.txt” in the MPLAB
IDE installation directory.
Components on the device adapter are powered by the
target board, even when the emulator processor
module is being powered by the emulator system and
running an internal clock. This will cause a maximum
10 mA current draw from the target system.
5.1
Emulating a .600 28-Pin Part
When emulating a .600 wide, 28-pin device, an adapter
will be needed to convert the standard .300 wide
socket on the device adapters to the .600 wide socket
on the target board.
There are many adapters available for this purpose,
such as Digi-Key part number A502-ND.
4.4
ESD Protection and Electrical
Overstress
5.2
T1OSC Jumper
All CMOS chips are susceptible to electrostatic
discharge (ESD). In the case of the processor modules,
the pins of the CMOS emulator are directly connected
to the target connector, making the chip vulnerable to
ESD. ESD can also induce latch-up in CMOS chips,
causing excessive current through the chip and
possible damage. MPLAB ICE 2000 has been
designed to minimize potential damage by implement-
ing overcurrent protection and transient suppressors.
However, care should be given to minimizing ESD
conditions while using the system.
During development, contention on an I/O pin is
possible (e.g., when an emulator pin is driving a ‘1’ and
the target board is driving a ‘0’). Prolonged contention
may cause latch-up and damage to the emulator chip.
One possible precaution is to use current limiting
resistors (~100
Ω)
during the development phase on
bidirectional I/O pins. Using limiting resistors can also
help avoid damage to modules, device adapters and
pods that occurs when a voltage source is accidentally
connected to an I/O pin on the target board.
Some device adapters are equipped with a 3-pin
jumper to force the device adapter to enable/disable
the Timer1 oscillator circuitry.
When in the “ON” position, the device adapter’s Timer1
oscillator circuitry is always enabled regardless of the
T1OSCEN bit in T1CON.
When in the “OFF” position, the device adapter’s
Timer1 oscillator circuit is enabled/disabled by software
in application code by the T1OSCEN bit in T1CON.
Note:
PCM16XB0/B1, PCM16XE0/E1,
PCM16XK0 and PCM16XL0 do not
support software enable/disable of the
Timer1 circuitry and must use the jumper
to either enable or disable the function (see
Table 5-7 for DVA16XP282, DVA16XP401,
DVA16XL441 and DVA16PQ441).
DS51140N-page 4
©
2007 Microchip Technology Inc.
5.3
Power and Ground Detection
5.4
Specific Device Adapter Issues
Two test points are provided on some device adapters
for the following: GND (black) and VCCME (red).
On certain Device Adapters, to visually indicate Target
Power mode, the “target power” LED will illuminate”
5.4.1
DVA12XP080
This section details processor-specific considerations
that have been made on device adapters. Only
adapters with special considerations are listed.
This device adapter is intended for use with PIC12C50X
8-pin DIP devices. It has four mechanical switches that
allow target pins GP2 to GP5 to be routed to the emulator
silicon on the PCM16XA0 processor module or the
oscillator chip on the device adapter, as shown in Table 5-1.
In addition, a 24C00 EEPROM (U1) is connected to
RA0 and RA1 of the emulator silicon to support the
EEPROM capabilities of the PIC12CE51X family devices.
For information on how to use EEPROM memory, see the
MPLAB IDE on-line device-specific limitations for the
PCM16XA0 (PIC12CE518/519) devices by selecting
Debugger>Settings,
clicking the
Limitations
tab, and then
clicking the
Details
button.
TABLE 5-1:
RB2
RB3
RB4
RB5
MCLR
DVA12XP080 DEVICE ADAPTER SWITCH ASSIGNMENT
Desired Function
Set S4 to
RB2
Set S3 to
RB3
Set S2 to
RB4
Set S1 to
RB5
Set S3 to
MCLR
Set S1 to
OSC1
and
set S2 to
OSC2
Set S4 to
T0CKI
Switch Positions
External Oscillator Input
TIMER0 Clock Input
5.4.2
DVA12XP081
This device adapter is intended for use with PIC12C67X
8-pin DIP devices. It has two mechanical switches that
allow target pins GP4 and GP5 to be routed to the emulator
silicon on the PCM12XA0 processor module or the
oscillator device on the device adapter, as shown in
Table 5-2.
TABLE 5-2:
GP4
GP5
DVA12XP081 DEVICE ADAPTER SWITCH ASSIGNMENT
Desired Function
Set S2 to
GP4
Set S1 to
GP5
Set S1 to
OSC1
and
set S2 to
OSC2
Switch Positions
External Oscillator Input
©
2007 Microchip Technology Inc.
DS51140N-page 5
DSP and ARM Processors
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