Pressure
Freescale Semiconductor
Data Sheet: Technical Data
MPXV7007
Rev 3, 10/2012
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
The MPXV7007 series piezoresistive transducers are state-of-the-art
monolithic silicon pressure sensors designed for a wide range of applications,
but particularly those employing a microcontroller or microprocessor with A/D
inputs. This transducer combines advanced micromachining techniques, thin-
film metallization, and bipolar processing to provide an accurate, high level
analog output signal that is proportional to the applied pressure.
MPXV7007
Series
-7 to 7 kPa (-1 to 1 psi)
0.5 to 4.5 V Output
Application Examples
•
•
•
•
Hospital Beds
HVAC
Respiratory Systems
Process Control
Features
•
•
•
•
•
•
5.0% Maximum Error Over 0 to 85C
Ideally Suited for Microprocessor or Microcontroller-Based Systems
Temperature Compensated Over –40 to +125C
Thermoplastic (PPS) Surface Mount Package
Patented Silicon Shear Stress Strain Gauge
Available in Differential and Gauge Configurations
ORDERING INFORMATION
Device Name
Small Outline Package
MPXV7007DP
MPXV7007DPT1
MPXV7007GC6U
MPXV7007GC6T1
MPXV7007GP
Package
Options
Trays
Tape & Reel
Rails
Tape & Reel
Trays
Case
No.
1351
1351
482A
482A
1369
None
# of Ports
Single
Dual
Gauge
Pressure Type
Differential Absolute
Device
Marking
MPXV7007DP
MPXV7007DP
MPXV7007G
MPXV7007G
MPXV7007GP
•
•
•
•
•
SMALL OUTLINE PACKAGE
•
•
•
•
•
MPXV7007GC6U/C6T1
CASE 482A-01
MPXV7007GP
CASE 1369-01
MPXV7007DP/DPT1
CASE 1351-01
Table 1. Pin Numbers
(1)
1
N/C
2
V
s
3
Gnd
4
V
out
5
N/C
6
N/C
7
N/C
8
N/C
1.Pins 1, 5, 6, 7 and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.
© 2005, 2009, 2011, 2012 Freescale Semiconductor, Inc. All rights reserved.
Pressure
Operating Characteristics
Table 2. Operating Characteristics
(
V
S
= 5.0 Vdc, T
A
= 25°C unless otherwise noted. Decoupling circuit shown in
Figure 3
re-
quired to meet specification.)
Characteristic
Pressure Range
(1)
Supply Voltage
(2)
Supply Current
Minimum Pressure Offset
(3)
@ V
S
= 5.0 Volts
Full Scale Output
(4)
@ V
S
= 5.0 Volts
Full Scale Span
(5)
@ V
S
= 5.0 Volts
Accuracy
(6)
Sensitivity
Response Time
(7)
Output Source Current at Full Scale Output
Warm-Up Time
(8)
Offset Stability
(9)
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range.
3. Offset (V
off
) is defined as the output voltage at the minimum rated pressure.
4. Full Scale Output (V
FSO
) is defined as the output voltage at the maximum or full rated pressure.
5. Full Scale Span (V
FSS
) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
6. Accuracy (error budget) consists of the following:
Linearity:
Temperature Hysteresis:
Pressure Hysteresis:
TcSpan:
TcOffset:
Variation from Nominal:
Output deviation from a straight line relationship with pressure over the specified pressure range.
Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25C.
Output deviation over the temperature range of 0 to 85C, relative to 25C.
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85C, relative to
25C.
The variation from nominal values, for Offset or Full Scale Span, as a percent of V
FSS
, at 25C.
(0 to 85C)
Symbol
P
OP
V
S
I
o
V
off
Min
-7
4.75
—
0.33
Typ
—
5.0
7.0
0.5
Max
7
5.25
10
0.67
Unit
kPa
Vdc
mAdc
Vdc
(0 to 85C)
V
FSO
4.3
4.5
4.7
Vdc
(0 to 85C)
V
FSS
—
4.0
—
Vdc
(0 to 85C)
—
V/P
t
R
I
O+
—
—
—
—
—
—
—
—
—
286
1.0
0.1
20
0.5
5.0
—-
—-
—-
—-
—-
%V
FSS
mV/kPa
ms
mAdc
ms
%V
FSS
7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPXV7007
2
Sensors
Freescale Semiconductor, Inc.
Pressure
Maximum Ratings
Table 3. Maximum Ratings
(1)
Rating
Maximum Pressure
Storage Temperature
Operating Temperature
Symbol
P
max
T
stg
T
A
Value
75
–40 to +125
–40 to +125
Unit
kPa
C
C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Figure 1
shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
V
S
2
Sensing
Element
Thin Film
Temperature
Compensation
and
Gain Stage #1
Gain Stage #2
and
Ground
Reference
Shift Circuitry
V
out
4
GND
3
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
for Small Outline Package Device
Figure 1. Integrated Pressure Sensor Schematic
MPXV7007
Sensors
Freescale Semiconductor, Inc.
3
Pressure
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
The performance over temperature is achieved by
integrating the shear-stress strain gauge, temperature
compensation, calibration and signal conditioning circuitry
onto a single monolithic chip.
Figure 2
illustrates the Differential or Gauge configuration
in the basic chip carrier (Case 482). A fluorosilicone gel
isolates the die surface and wire bonds from the environment,
while allowing the pressure signal to be transmitted to the
sensor diaphragm.
The MPXV7007 series pressure sensor operating
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
Fluoro Silicone
Gel Die Coat
P1
Wire Bond
Lead
Frame
Thermoplastic
Case
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
Figure 3
shows the recommended decoupling circuit for
interfacing the integrated sensor to the A/D input of a
microprocessor or microcontroller. Proper decoupling of the
power supply is recommended.
Figure 4
shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0 to 85C using the decoupling circuit shown in
Figure 3.
The
output will saturate outside of the specified pressure range.
Die
Stainless
Steel Cap
P2
Differential Sensing
Element
Die Bond
Figure 2. Cross-Sectional Diagram SOP
(not to scale)
+5 V
V
out
V
s
IPS
1.0
F
0.01
F
GND
OUTPUT
470 pF
Figure 3. Recommended Power Supply Decoupling and Output Filtering
(For additional output filtering, please refer to Application Note AN1646.)
MPXV7007
4
Sensors
Freescale Semiconductor, Inc.
Pressure
5.0
4.5
4.0
3.5
3.0
Output (V)
2.5
2.0
1.5
1.0
0.5
0 -7
0
Differential Pressure (kPa)
7
MAX
MIN
TYPICAL
Transfer Function:
V
out
= V
S
*(0.057*P+0.5) ± ERROR
V
S
= 5.0 Vdc
TEMP = 0º to 85ºC
Figure 4. Output versus Pressure Differential
Transfer Function
Nominal Transfer Value:
V
out
= V
S
x (0.057 x P + 0.5)
± (Pressure Error x Temp. Factor x 0.057 x V
S
)
V
S
= 5.0 V
0.25 Vdc
Temperature Error Band
MPXV7007 SERIES
4.0
3.0
Temperature
Error
Factor
2.0
1.0
0.0
–40
–20
0
20
40
60
80
100
120
140
Temperature in ºC
NOTE: The Temperature Multiplier is a linear response from 0º to –40ºC and from 85º to 125ºC.
Temp
–40º
0º to 85º
+125º
Multiplier
3
1
3
MPXV7007
Sensors
Freescale Semiconductor, Inc.
5
Embedded System
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