MEMORY MODULE
SDRAM 128Mx24-SOP
3D SD3G24VS6262
Synchronous Dynamic Ram
MODULE
3Gbit SDRAM organized as 128Mx24, based on 128Mx4
Pin Assignment (Top View)
SOP 68 (Pitch : 0.80 mm)
Features
- Organized as 128Mx24-bit based on 128Mx4-bit
- Single +3.3 power supply
- Clock frequency: 133MHz (Max)
- LVTTL interface
- Single pulsed /RAS
- Burst Read/Write operation and burst read/single write
operation capability.
- Programmable burst lengths (BL): 1, 2, 4, 8 or full page.
- 2 Variations of burst sequence
-
Sequential ( BL = 1, 2, 4, 8, full page)
-
Interleave ( BL =1, 2, 4, 8 )
- 2 Variations of refresh
-
Auto refresh
-
Self refresh
- Available Temperature Range:
0°C to 70°C
-40°C to+85°C
-
Available with screening option for high reliability
application (Space, etc…)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
NC
DQ20
DQ16
DQ12
V
DD
DQ4
V
DDQ
DQ8
DQ0
V
SSQ
DQ5
DQ9
V
DDQ
DQ13
DQ1
V
SSQ
DQ17
V
DD
DQ21
#WE0
#CAS
#RAS
#CS
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
BA0
BA1
A10
A0
A1
A2
A3
V
DD
CKE4
CKE5
#WE1
CKE3
CKE2
CKE1
V
SS
A4
A5
A6
A7
A8
A9
A11
A12
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
CKE0
CLK
DQM
DQ22
V
SS
DQ18
V
DDQ
DQ2
DQ14
V
SSQ
DQ10
DQ6
V
DDQ
DQ3
DQ11
V
SSQ
DQ7
V
SS
DQ15
DQ19
DQ23
#WE2
FUNCTIONAL BLOCK DIAGRAM
General Description
The 3D SD3G24VS6262 is a high-speed highly integrated
Synchronous Dynamic Random Access Memory containing
3,298,534,823,328 bits.
It is organized as a 24-bit bank, each basic die has 6
separate clock enable signals CKE0 ~ CKE5 and 3
separate #WE0 ~#WE2.
The device is manufactured using 3D-PLUS well known
MCM-V patented technology designed for high speed circuit
applications. It is particularity well suited for use in high
reliability, high performance and high density system
applications, such as solid state mass recorder, server or
workstation.
The 3D SD3G24VS6262 is packaged in a 68 pin SOP.
(All other signals are common to the five devices)
SDRAM Memory Module
PRELIMINARY / MMSD24510406S-C
3D Plus SA reserves the right to cancel product or specifications without notice
3DFP-0262-REV 2-DEC. 2008
MEMORY MODULE
SDRAM 128Mx24-SOP
3D SD3G24VS6262
Synchronous Dynamic Ram
MODULE
3Gbit SDRAM organized as 128Mx24, based on 128Mx4
Mechanical Drawing
A
A2
D
E
E1
b
e
Min
11.70
10.45
29.40
13.30
10.85
0.35
0.8
Dimension (mm)
Max. weight : 6.70gr.
Max
12.30
11.05
29.80
13.70
11.05
DC OPERATING CONDITIONS
Parameter
Supply Voltage
Ground
Input High Voltage
Input Low Voltage
Output High Voltage
Output Low Voltage
ABSOLUTE MAXIMUM RATINGS
Min
3.0
0
2.0
-0.3
2.4
-
Symbol
V
DD
V
SS
V
IH
V
IL
V
OH
V
OL
Max
3.6
0
V
DD
+0.3
0.8
-
0.4
Unit
V
V
V
V
V
Parameter
Voltage on any pin relative to V
SS
Storage temperature
Power dissipation
Symbol
V
T
T
STG
P
D
Value
-0.5 to
V
DD
+0.5
-55 to +125
TBD
Unit
V
°C
W
Note
:
Permanent device damage may occur if "ABSOLUTE MAXIMUM RATINGS"
are exceeded.
Functional operation should be restricted to recommended operating condition.
Exposure to higher than recommended voltage for extended periods of time
could affect device reliability
DC Characteristics
Parameter
Symbol Value
Unit
mA
mA
mA
I
CC1
Operating Current
990
I
SB
TTL Standby Current
240
I
CC2
Refresh current per die
320
Note:
Auto Refresh operation shall be executed separately (2 basic dies
maximum)
3D SD3G24VS6262
Temperature Range
C = (0°C ~ +70°C)
I = (-40°C ~ +85°C)
M = (-55°C to + 125°C)
S = Specific
Quality Level
N = Commercial Grade
B = Industrial Grade
S = Space Grade
C = Custom
Main Sales Office
FRANCE
3D PLUS
408, rue Hélène Boucher
ZI.
78532 BUC Cedex
3D PLUS USA, Inc
6633 Eldorado Parkway
Suite 420
Mckinney, TX 75070
X
X
Tel : 33 (0)1 30 83 26
50
Fax : 33 (0)1 39 56 25
89
Web :
www.3d-plus.com
e-mail :
sales@3d-
plus.com
e-mail :
sales@3d-
plus.com
DISTRIBUTOR
USA
Tel : (241) 733-8505
Tel : (241) 733-8506
SDRAM Memory Module
PRELIMINARY / MMSD24510406S-C
3D Plus SA reserves the right to cancel product or specifications without notice
3DFP-0262-REV 2-DEC. 2008
Microchip MCU
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