IBM14P13724DPA-9 datasheet, PDF

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IBM14P13724DPA-9: DescriptionCache Tag SRAM Module, 128KX72, 9ns, CMOS; Categorystorage storage; File Size603KB，21 Pages; ManufacturerIBM; Websitehttp://www.ibm.com

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IBM14P13724DPA-9 Overview

Cache Tag SRAM Module, 128KX72, 9ns, CMOS

IBM14P13724DPA-9 Parametric

Parameter Name	Attribute value
package instruction	DIMM, DIMM182
Reach Compliance Code	unknown
ECCN code	3A991.B.2.A
Maximum access time	9 ns
Other features	32K X 15 TAG
I/O type	COMMON
JESD-30 code	R-XDMA-N182
memory density	9437184 bit
Memory IC Type	CACHE TAG SRAM MODULE
memory width	72
Number of functions	1
Number of ports	1
Number of terminals	182
word count	131072 words
character code	128000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX72
Output characteristics	3-STATE
Exportable	YES
Package body material	UNSPECIFIED
encapsulated code	DIMM
Encapsulate equivalent code	DIMM182
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Parallel/Serial	PARALLEL
power supply	3.3,5 V
Certification status	Not Qualified
Maximum standby current	0.1 A
Minimum standby current	3.14 V
Maximum slew rate	1.05 mA
Maximum supply voltage (Vsup)	3.465 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	DUAL
Base Number Matches	1

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IBM14P13724DPA-9 Related Products

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Description	Cache Tag SRAM Module, 128KX72, 9ns, CMOS	Cache Tag SRAM Module, 64KX72, 9ns, CMOS	Cache Tag SRAM Module, 32KX72, 9ns, CMOS	Cache Tag SRAM Module, 32KX72, 11ns, CMOS	Cache Tag SRAM Module, 128KX72, 11ns, CMOS	Cache Tag SRAM Module, 32KX72, 12ns, CMOS	Cache Tag SRAM Module, 64KX72, 12ns, CMOS	Cache Tag SRAM Module, 128KX72, 12ns, CMOS	Cache Tag SRAM Module, 64KX72, 11ns, CMOS
package instruction	DIMM, DIMM182	DIMM, DIMM182	DIMM, DIMM182	DIMM, DIMM182	DIMM, DIMM182	DIMM, DIMM182	DIMM, DIMM182	DIMM, DIMM182	DIMM, DIMM182
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknow	unknow
ECCN code	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	9 ns	9 ns	9 ns	11 ns	11 ns	12 ns	12 ns	12 ns	11 ns
Other features	32K X 15 TAG	16K X 15 TAG	16K X 15 TAG	16K X 15 TAG	32K X 15 TAG	16K X 15 TAG	16K X 15 TAG	32K X 15 TAG	16K X 15 TAG
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-XDMA-N182	R-XDMA-N182	R-XDMA-N182	R-XDMA-N182	R-XDMA-N182	R-XDMA-N182	R-XDMA-N182	R-XDMA-N182	R-XDMA-N182
memory density	9437184 bit	4718592 bit	2359296 bit	2359296 bit	9437184 bit	2359296 bit	4718592 bit	9437184 bi	4718592 bi
Memory IC Type	CACHE TAG SRAM MODULE	CACHE TAG SRAM MODULE	CACHE TAG SRAM MODULE	CACHE TAG SRAM MODULE	CACHE TAG SRAM MODULE	CACHE TAG SRAM MODULE	CACHE TAG SRAM MODULE	CACHE TAG SRAM MODULE	CACHE TAG SRAM MODULE
memory width	72	72	72	72	72	72	72	72	72
Number of functions	1	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1	1
Number of terminals	182	182	182	182	182	182	182	182	182
word count	131072 words	65536 words	32768 words	32768 words	131072 words	32768 words	65536 words	131072 words	65536 words
character code	128000	64000	32000	32000	128000	32000	64000	128000	64000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	128KX72	64KX72	32KX72	32KX72	128KX72	32KX72	64KX72	128KX72	64KX72
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	YES	YES	YES	YES	YES	YES	YES	YES	YES
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM
Encapsulate equivalent code	DIMM182	DIMM182	DIMM182	DIMM182	DIMM182	DIMM182	DIMM182	DIMM182	DIMM182
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	3.3,5 V	3.3,5 V	3.3,5 V	3.3,5 V	3.3,5 V	5 V	5 V	5 V	3.3,5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.1 A	0.05 A	0.05 A	0.05 A	0.1 A	0.29 A	0.29 A	0.58 A	0.05 A
Minimum standby current	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V	4.75 V	4.75 V	4.75 V	3.14 V
Maximum slew rate	1.05 mA	0.9 mA	0.9 mA	0.9 mA	1.05 mA	1.68 mA	1.68 mA	1.97 mA	0.9 mA
Maximum supply voltage (Vsup)	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	5.25 V	5.25 V	5.25 V	3.465 V
Minimum supply voltage (Vsup)	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	4.75 V	4.75 V	4.75 V	3.135 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	5 V	5 V	5 V	3.3 V
surface mount	NO	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	1	1	1	-	-	-

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