ZSPM4551AA1W datasheet, PDF - EEWORLD Datasheet

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ZSPM4551AA1W: Descriptionbattery management charging IC 7" reel; Categorysemiconductor Other integrated circuit (IC); File Size1MB，30 Pages; ManufacturerZentrum Mikroelektronik Dresden AG (IDT); Environmental Compliance

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Data Sheet

Rev. 1.00 / December 2012

ZSPM4551

High-Efficiency Charger for Li-Ion Batteries

Power and Precision

ZSPM4551

High-Efficiency Charger for Li-Ion Batteries

Contents

ZSPM4551 Characteristics.................................................................................................................................. 6

1.1. Absolute Maximum Ratings .......................................................................................................................... 6

1.2. Thermal Characteristics ................................................................................................................................ 7

1.3. Recommended Operating Conditions .......................................................................................................... 7

1.4. Electrical Characteristics .............................................................................................................................. 8

1.5. I C™ Interface Timing Requirements ......................................................................................................... 11

Functional Description ....................................................................................................................................... 12

2.1. Internal Protection ...................................................................................................................................... 13

2.1.1. VIN Under-Voltage Lockout ................................................................................................................. 13

2.1.2. Internal Current Limit ........................................................................................................................... 13

2.1.3. Thermal Shutdown ............................................................................................................................... 13

2.1.4. VBAT Over-Voltage Protection ............................................................................................................ 13

2.2. Fault Handling............................................................................................................................................. 14

2.2.1. NFLT Pin Functionality ......................................................................................................................... 14

2.2.2. Other Faults ......................................................................................................................................... 14

2.3. Serial Interface ........................................................................................................................................... 16

2.3.1. I C™ Subaddress Definition ................................................................................................................ 16

2.3.2. I C™ Bus Operation ............................................................................................................................. 16

2.4. Status and Configuration Registers ............................................................................................................ 18

Application Circuits ............................................................................................................................................ 23

3.1. Typical Application Circuit .......................................................................................................................... 23

3.2. Selection of External Components ............................................................................................................. 23

3.2.1. C

OUT

Output Capacitor ......................................................................................................................... 23

3.2.2. L

OUT

Output Inductor ............................................................................................................................ 23

3.2.3. C

Bypass Capacitor ........................................................................................................................... 23

3.2.4. C

VDD

Bypass Capacitor for VDD Internal Reference Voltage Output .................................................. 23

3.2.5. R

SENSE

Output Sensing Resistor .......................................................................................................... 24

3.2.6. Pull-up Resistors .................................................................................................................................. 24

Pin Configuration and Package ......................................................................................................................... 24

4.1. ZSPM4551 Package Dimensions ............................................................................................................... 24

4.2. Pin-Out Assignments .................................................................................................................................. 25

4.3. Pin Description for 16-Pin PQFN (4 x 4 mm) ............................................................................................. 25

4.4. Package Markings ...................................................................................................................................... 26

Layout Recommendations................................................................................................................................. 27

5.1. Multi-Layer PCB Layout .............................................................................................................................. 27

5.2. Single-Layer PCB Layout ........................................................................................................................... 28

Ordering Information ......................................................................................................................................... 30

Related Documents ........................................................................................................................................... 30

Document Revision History ............................................................................................................................... 30

Data Sheet

December 4, 2012

prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.

4 of 30

ZSPM4551

High-Efficiency Charger for Li-Ion Batteries

List of Figures

Figure 2.1

Figure 2.2

Figure 2.3

Figure 2.4

Figure 2.5

Figure 3.1

Figure 4.1

Figure 4.2

Figure 4.3

Figure 5.1

Figure 5.2

Figure 5.3

Figure 5.4

ZSPM4551 Block Diagram .................................................................................................................. 12

Charging State Diagram ...................................................................................................................... 15

Subaddress in I C™ Transmission ...................................................................................................... 16

I C™ Start / Stop Protocol ................................................................................................................... 17

I C™ Data Transmission Timing ......................................................................................................... 17

Typical Application Circuit for Charging a Lithium-Ion Battery ............................................................ 23

PQFN-16 Package Dimensions ........................................................................................................... 24

ZSPM4551 Pin Assignments ............................................................................................................... 25

Marking Diagram 16-Pin PQFN (4 x 4 mm) ......................................................................................... 26

Package and PCB Land Configuration for Multi-Layer PCB ............................................................... 27

JEDEC Standard FR4 Multi-Layer Board – Cross-Sectional View ...................................................... 27

Conducting Heat Away from the Die using an Exposed Pad Package ............................................... 28

Application Using a Single-Layer PCB ................................................................................................ 29

List of Tables

Table 1.1

Table 1.2

Table 1.3

Table 1.4

Table 1.5

Table 2.1

Table 2.2

Table 2.3

Table 2.4

Table 2.5

Table 2.6

Table 2.7

Table 2.8

Table 2.9

Table 4.1

Absolute Maximum Ratings ................................................................................................................... 6

Thermal Characteristics ......................................................................................................................... 7

Recommended Operating Conditions ................................................................................................... 7

Electrical Characteristics ....................................................................................................................... 8

I C™ Interface Timing Characteristics ................................................................................................. 11

HEX

) ................................................................................. 18

STATUS Register—Address 00

HEX

..................................................................................................... 18

Configuration Register CONFIG1—Address 02

HEX

............................................................................. 19

Configuration Register CONFIG2—Address 03

HEX

............................................................................. 19

Configuration Register CONFIG3—Address 04

HEX

............................................................................. 20

Configuration Register CONFIG4—Address 05

HEX

............................................................................. 20

Configuration Register CONFIG5—Address 06

HEX

............................................................................. 21

Enable Configuration Register CONFIG_ENABLE—Address 11

HEX

................................................... 22

EEPROM Control Register EEPROM_CTRL—Address 12

HEX

........................................................... 22

Pin Description ..................................................................................................................................... 25

Data Sheet

December 4, 2012

prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.

5 of 30

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