DS21FT42 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Wireless rf/communication> Telecom circuit> DS21FT42

DS21FT42: DescriptionDATACOM, FRAMER, PBGA300; CategoryWireless rf/communication Telecom circuit; File Size508KB，145 Pages; ManufacturerDALLAS; Websitehttp://www.dalsemi.com

Download Datasheet Parametric Compare View All

DS21FT42 Online Shopping

Suppliers	Part Number	Price	MOQ	In stock
	DS21FT42	-	-	View	Buy Now

DS21FT42 Overview

DATACOM, FRAMER, PBGA300

DS21FT42 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	DALLAS
package instruction	27 X 27 MM, BGA-300
Reach Compliance Code	unknow
JESD-30 code	S-PBGA-B300
JESD-609 code	e0
Number of functions	12
Number of terminals	300
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA300,20X20,50
Package shape	SQUARE
Package form	GRID ARRAY
power supply	3.3 V
Certification status	Not Qualified
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Telecom integrated circuit types	FRAMER
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM

Preview

Download Datasheet

View All

DALLAS

SEMICONDUCTOR

DS21FT42 / DS21FF42

4 X 3 Twelve Channel T1 Framer

4 X 4 Sixteen Channel T1 Framer

•

IEEE 1149.1 JTAG-Boundary Scan

Architecture

DS21FF42 and DS21FT42 are Pin

Compatible with DS21FF44 and

DS21FT44, respectively, to allow the

Same Footprint to Support T1 and E1

Applications

300–pin MCM BGA package (27mm X

27mm)

Low Power 3.3V CMOS with 5V Tolerant

Input & Outputs

FEATURES

•

Sixteen (16) or Twelve (12) Completely

Independent T1 Framers in One Small

27mm x 27mm Package

•

Each Multi-Chip Module (MCM) Contains

Four (FF) or Three (FT) DS21Q42 Die.

Each Quad Framer Can be Concatenated

into a Single 8.192MHz Backplane Data

Stream

•

1. MULTI-CHIP MODULE (MCM) DESCRIPTION

The Four x Four and Four x Three MCMs offer a high density packaging arrangement for

the DS21Q42 T1 Enhanced Quad Framer. Either three (DS21FT42) or four (DS21FF42)

silicon die of these devices is packaged in a Multi-Chip Module (MCM) with the electrical

connections as shown in Figure 1-1.

All of the functions available on the DS21Q42 are also available in the MCM packaged

version. However, in order to minimize package size, some signals have been deleted or

combined. These differences are detailed in Table 1-1. In the Four x Three (FT) version,

the fourth quad framer is not populated and hence all of the signals to and from this fourth

framer are absent and should be treated as No Connects (NC). Table 2-1 lists all of the

signals on the MCM and it also lists the absent signals for the Four x Three.

The availability of both a twelve and a sixteen channel version allow the maximum framer

density with the lowest cost. For example, in a T3 application, two devices (one

DS21FF42 and one DS21FT42) provide a total of 28 framers without the additional cost

and power consumption of any unused framers that appear in an octal approach.

101899

/123

DALLAS SEMICONDUCTOR

DS21FF42/DS21FT42

TABLE OF CONTENTS

FEATURES ................................ ................................ ............................... 1

1. MULTI-CHIP MODULE (MCM) DESCRIPTION................................ .... 1

2. MCM LEAD DESCRIPTION ................................ ................................ . 7

3. DS21FF42 (FOUR X FOUR) PCB LAND PATTERN ............................... 13

4. DS21FT42 (FOUR X THREE) PCB LAND PATTERN ............................14

5. DS21Q42 FEATURES ................................ ................................ ..........15

6. DS21Q42 INTRODUCT ION ................................ ................................ .16

7. DS21Q42 PIN FUNCT ION DESCRIPTION ................................ ...........20

8. DS21Q42 REGISTER MAP................................ ................................ ..29

9. PARALLEL PORT ................................ ................................ ..............33

10.

11.

12.

13.

14.

CONTROL, ID AND TEST REGISTERS ................................ ...........33

STATUS AND INFORMAT ION REGISTERS ................................ .....45

ERROR COUNT REGISTERS ................................ ...........................54

DS0 MONITORING FUNCTION................................ ........................58

SIGNALING OPERAT ION................................ ................................ 62

14.1 PROCESSOR BASED SIGNALING ................................ ...................62

14.2 HARDWARE BASED SIGNALING................................ ....................64

15.

PER–CHANNEL CODE (IDLE) GENERATION AND LOOPBACK .....66

15.1 TRANSMIT SIDE CODE GENERATION ................................ ...........66

15.1.1 Simple Idle Code Insertion and Per–Channel Loopback

..................66

15.1.2 Per–Channel Code Insertion................................

........................67

15.2 RECEIVE SIDE CODE GENERATION ................................ ...............68

15.2.1 Simple Code Insertion................................

................................ .68

15.2.2 Per–Channel Code Insertion................................

........................69

16.

17.

CLOCK BLOCKING REGISTERS ................................ ....................71

ELASTIC STORES OPERATION ................................ .....................72

101899

/123

DS21FT42 Related Products

	DS21FT42	DS21FF42
Description	DATACOM, FRAMER, PBGA300	DATACOM, FRAMER, PBGA300
Is it Rohs certified?	incompatible	incompatible
Maker	DALLAS	DALLAS
package instruction	27 X 27 MM, BGA-300	27 X 27 MM, BGA-300
Reach Compliance Code	unknow	unknow
JESD-30 code	S-PBGA-B300	S-PBGA-B300
JESD-609 code	e0	e0
Number of functions	12	16
Number of terminals	300	300
Maximum operating temperature	70 °C	70 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA
Encapsulate equivalent code	BGA300,20X20,50	BGA300,20X20,50
Package shape	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY
power supply	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified
Nominal supply voltage	3.3 V	3.3 V
surface mount	YES	YES
technology	CMOS	CMOS
Telecom integrated circuit types	FRAMER	FRAMER
Temperature level	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	BALL	BALL
Terminal pitch	1.27 mm	1.27 mm
Terminal location	BOTTOM	BOTTOM

Recommended Resources

2½-digit digital voltmeter conversion circuit using binary digital-to-analog converter

COMPAQ 420 VGA color display power supply circuit diagram

Practical transistor inverter power supply circuit

555 contactless timing circuit

Novel telephone line timing control device circuit diagram

28.3MHz third harmonic TrL oscillator

Discussing a MSP430F5504 power supply problem: I plan to use the MSP430F5xxx series of microcontrollers to make something in the near future. I am mainly attracted by its USB interface. Now let's discuss some technical reserves. The main requireme...; jishuaihu Microcontroller MCU

International roaming charges plunge, telecom charges cut across the board to break the ice: International roaming charges plunge, telecom charges cut across the board to break the ice 2006-7-13 On June 9, China Mobile announced to reduce the international roaming charges of Global Connect ac...; hkn RF/Wirelessly

FPGA key debounce: I work in the hardware industry. Recently, while learning about FPGA, I have not yet fully grasped the knowledge about key debounce. For example, debounce processing needs to be performed when a key i...; Fred_1977 FPGA/CPLD

FPGA Timing Synthesis Tutorial: [align=center][/align][align=left]下载如下：[/align][align=center][/align]...; caicaiwoshishui FPGA/CPLD

Headhunting position: US-funded RF IC company is recruiting FAE with high salary (Beijing): I am a consultant for a headhunting company. I am currently commissioned by a well-known American RF IC company to urgently recruit a FAE in Beijing. Candidates are required to have rich experience in...; chenshitong Recruitment

Several solutions for mounting SMD on FPC: According to the requirements of mounting accuracy and the types and quantities of components, the commonly used solutions are as follows: Solution 1, multi-piece mounting: multiple FPCs are positione...; PCB Design

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

Popular Components