DS21Q554 datasheet, PDF - EEWORLD Datasheet

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DS21Q554: DescriptionDATACOM, PCM TRANSCEIVER, PBGA256; CategoryWireless rf/communication Telecom circuit; File Size109KB，13 Pages; ManufacturerDALLAS; Websitehttp://www.dalsemi.com

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DS21Q554 Overview

DATACOM, PCM TRANSCEIVER, PBGA256

DS21Q554 Parametric

Parameter Name	Attribute value
Maker	DALLAS
package instruction	MCM, BGA-256
Reach Compliance Code	unknow
JESD-30 code	S-PBGA-B256
Number of functions	4
Number of terminals	256
Package body material	PLASTIC/EPOXY
Package shape	SQUARE
Package form	GRID ARRAY
Certification status	Not Qualified
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Telecom integrated circuit types	PCM TRANSCEIVER
Terminal form	BALL
Terminal location	BOTTOM

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DALLAS SEMICONDUCTOR

Quad T1/E1 Transceiver (5V)

Quad T1/E1 Transceiver (3.3V)

FEATURES

•

Four (4) Completely Independent T1 or E1 Transceivers

In One Small 27mm x 27mm Package

•

Each Transceiver Contains a Short & Long Haul Line Interface

Plus a Full Featured Framer with Alarm Detection/Generation,

Elastic Stores, Hardware Based Signaling Support, Per DS0

Channel Control and HDLC Controller

Each Multi-Chip Module (MCM) Contains Four Die of:

DS21352 (DS21Q352)

DS21552 (DS21Q552)

DS21354 (DS21Q354)

DS21554 (DS21Q554)

Selection Guide:

Supply

3.3V

Preliminary

DS21Q552/DS21Q554

DS21Q352/DS21Q354

•

Device

DS21Q352

DS21Q552

DS21Q354

DS21Q554

See the Specific DS21352/DS21552 and DS21354/DS21554

Data Sheets for Details on their Feature Set and Operation

All Four T1 or E1 Transceivers Can be Concatenated into a Single

8.192MHz Backplane Data Stream

IEEE 1149.1 JTAG-Boundary Scan Architecture

DS21Q352/DS21Q552 and DS21Q354/DS21Q554 are Pin Compatible

to Allow the Same Footprint to Support T1 and E1 Applications

256–lead MCM BGA package (27mm X 27mm)

Low Power 5V CMOS or Low Power 3.3V CMOS with 5V

Tolerant Input & Outputs

DESCRIPTION

The Quad T1 and E1 Transceiver MCMs offer a high density packaging arrangement for the

DS21352/DS21552 T1 Single-Chip Transceivers and the DS21354/DS21554 E1 Single-Chip Transceivers.

Four silicon die of one of these devices is packaged in a Multi-Chip Module (MCM) with the electrical

connections as shown in Figure 1. All of the functions available on the DS21352/DS21552 and

DS21354/DS21554 are also available in the MCM packaged version however in order to minimize package

size, some signals have been deleted. These differences are detailed in Table 1.

This data sheet describes the electrical connections and the mechanical dimensions only. Please see the

DS21352/DS21552 and DS21354/DS21554 data sheets for full details on all of the features and the

operating characteristics of the device.

December 29, 1998

DS21Q554 Related Products

	DS21Q554	DS21Q352	DS21Q354	DS21Q552
Description	DATACOM, PCM TRANSCEIVER, PBGA256	DATACOM, PCM TRANSCEIVER, PBGA256	DATACOM, PCM TRANSCEIVER, PBGA256	DATACOM, PCM TRANSCEIVER, PBGA256
Maker	DALLAS	DALLAS	DALLAS	DALLAS
package instruction	MCM, BGA-256	MCM, BGA-256	MCM, BGA-256	MCM, BGA-256
Reach Compliance Code	unknow	unknow	unknow	unknow
JESD-30 code	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256
Number of functions	4	4	4	4
Number of terminals	256	256	256	256
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage	5 V	3.3 V	3.3 V	5 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Telecom integrated circuit types	PCM TRANSCEIVER	PCM TRANSCEIVER	PCM TRANSCEIVER	PCM TRANSCEIVER
Terminal form	BALL	BALL	BALL	BALL
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM

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