SMA27A datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Discrete semiconductor> diode> SMA27A

SMA27A: Descriptionunidirectional and bidirectional transient voltage suppressors; CategoryDiscrete semiconductor diode; File Size50KB，4 Pages; ManufacturerLITEON; Websitehttp://optoelectronics.liteon.com/en-global/Home/index; Lite-On began producing LED lamps in 1975; the company has steadily grown to become one of the world's largest manufacturers of optoelectronics products by providing customers with visible and infrared product solutions. High-volume production of commercial and application-specific products, as well as strong R&D and vertical integration capabilities have proven to be key and differentiating factors in Lite-On's success.

Download Datasheet Parametric View All

SMA27A Overview

unidirectional and bidirectional transient voltage suppressors

SMA27A Parametric

Parameter Name	Attribute value
Maker	LITEON
package instruction	R-PDSO-C2
Contacts	2
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum breakdown voltage	28.4 V
Minimum breakdown voltage	25.7 V
Configuration	SINGLE
Diode component materials	SILICON
Diode type	TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 code	R-PDSO-C2
Maximum non-repetitive peak reverse power dissipation	400 W
Number of components	1
Number of terminals	2
Package body material	PLASTIC/EPOXY
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
polarity	UNIDIRECTIONAL
Maximum power dissipation	1 W
Certification status	Not Qualified
Maximum repetitive peak reverse voltage	23.1 V
surface mount	YES
technology	AVALANCHE
Terminal form	C BEND
Terminal location	DUAL

SMA27A Preview

Download Datasheet

View All

LITE-ON

SEMICONDUCTOR

SMA SERIES

STAND-OFF VOLTAGE -

6.8

200

Volts

POWER DISSIPATION -

400

WATTS

SURFACE MOUNT

UNIDIRECTIONAL AND BIDIRECTIONAL

TRANSIENT VOLTAGE SUPPRESSORS

FEATURES

Rating to 200V VBR

For surface mounted applications

Reliable low cost construction utilizing molded plastic

technique

Plastic material has UL flammability classification

94V-O

Typical IR less than 1uA above 10V

Fast response time: typically less than 1.0ps for

Uni-direction,less than 5.0ns for Bi-direction,form 0

Volts to BV min

SMA

DIM.

MIN.

4.06

2.29

1.27

0.15

4.83

0.05

2.01

0.76

MAX.

4.57

2.92

1.63

0.31

5.59

0.20

2.62

1.52

MECHANICAL DATA

Case : Molded plastic

Polarity : by cathode band denotes uni-directional

device none cathode band denotes bi-directional

device

Weight : 0.002 ounces, 0.064 grams

All Dimensions in millimeter

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Ratings at 25

℃

ambient temperature unless otherwise specified.

Single phase, half wave, 60Hz, resistive or inductive load.

For capacitive load, derate current by 20%

CHARACTERISTICS

PEAK POWER DISSIPATION AT T

= 25 C,

= 1ms (Note 1,2)

Peak Forward Surge Current 8.3ms

single half sine-wave super imposed

on rated load (Note 3)

(JEDEC METHOD)

SYMBOLS

VALUE

UNIT

Minimum 400

WATTS

FSM

AMPS.

Steady State Power Dissipation at TL =75 C

M(AV)

1.0

WATTS

Maximum Instantaneous forward voltage

at 35A for unidirectional devices only (Note 3)

3.5

Volts

Operating Temperature Range

-55 to +150

Storage Temperature Range

STG

-55 to +175

NOTES : 1. Non-repetitive current pulse, per fig. 3 and derated above T

= 25 C per fig.1.

REV. 2, 01-Dec-2000, KSIA01

2. Thermal Resistance junction to Lead

3. 8.3ms single half-sine wave duty cycle= 4 pulses maximum per minute (unidirectional units only).

Recommended Resources

Monostable circuit with long settling time

System block diagram of high voltage power supply

845E computer motherboard circuit diagram_42

Computer motherboard circuit diagram 815 2_08

Computer motherboard circuit diagram 820 2_04

In 1979, the forecast for the year 2000: This picture ‘takes you into the living room of a house of the future. The basics will probably be similar – windows, furniture, carpet and TV. There will be one big change though – the number of elec...; dcexpert Robotics Development

1. Unboxing: [i=s]This post was last edited by wo4fisher on 2022-1-15 22:37[/i]Download resources for this article: 1. Get the GD32 MCU supporting software and hardware resource package for free to make your devel...; wo4fisher GD32 MCU

FLASH erase problem: This question is very strange. It makes me feel sick. I feel so unlucky recently.... Ok, let's get to the point. My goal is to erase the entire infoA segment of FLASH. The code is like this (the same ...; yl20084784 Microcontroller MCU

I would like to ask why the software made by WCE Application cannot drag the window under wince?: I would like to ask why the software made by WCE Application cannot drag the window under wince? Or is there any way to drag the window?...; sucuiqin Embedded System

Please tell me why the system resets when I press the external interrupt button: Please tell me why the system resets when I press the external interrupt button...; simonprince MCU

Regarding the packaging issues in Allegro PCB.: For example, if you need to draw an 8-layer PCB board (TOP GND ART03 POWER GND ART06 GND BOT) in practice, when drawing the plug-in package, in the parameter settings of each layer of the pad, do you ...; feaven PCB Design

Better, Stronger, Faster: The Evolution of Timing Analysis and Extraction

Better, Stronger, Faster. For some, this phrase may evoke memories of the 1970s American TV series The Six Million Dollar Man. But today, it describes the evolution that timing analysis and extract...[Details]
Application of B2900A in semiconductor laser testing

Semiconductor lasers are core components in the fields of optical fiber communication, laser display, gas detection, etc., and have attracted extensive attention from scientific and technological p...[Details]
dismantling, ON Semiconductor, photovoltaic, device, energy efficiency,

Solar inverters come in a wide variety of types, categorized by type (centralized, string, micro) or end-use scenario (residential, commercial, utility). Currently, string inverters are the most wi...[Details]
Design of LED Chinese Character Scrolling Display Using EDA

摘要：本文主要讨论了使用EDA工具设计汉字滚动显示器的技术问题。文中首先描述了基于现场可编程门阵列（FPGA）的硬件电路；然后研究了在8%26;#215;8LED发光二极管点阵上显示滚动汉字的原理，并给出了基于ALTERA的参数化模型库LPM描述其功能的VHDL语言程序设计；最后对使用EDA工具软件加工被显示数据文件的方法进行了讨论。关键词：虚拟器件 VHDL语言及应用 EDA技术采用传统...[Details]
Design of a Calendar Clock Chip with 48 Bytes of RAM

Abstract: This paper introduces the design of a calendar clock chip with 48 bytes of RAM. The chip has the functions of oscillation, frequency division, programmable timing counting, timed alarm and i...[Details]
Using Protel99SE to implement the simulation of pulse circuit

Abstract: In view of the defect that the digital circuit model of Protel99SE is not suitable for pulse circuit simulation, this paper discusses the use of creating subcircuit models and creating hiera...[Details]
IGBT Gate Driver FAN8800 and Its Application

Abstract: FAN8800 is a monolithic IGBT driver IC produced by Fairchild. It can be used to drive discrete and modular IGBTs, and can also be used to drive power MOSFETs. This article intr...[Details]
Low-cost high-speed difference amplifier AD8132

Abstract: AD8132 is a new type of low-cost high-speed differential amplifier launched by ADI. It has resistance to control gain characteristics, unique internal feedback, and can adjust ...[Details]
SoC Design Methodology (II)

SoC Design Methodology The content of SoC design methodology can be simply summarized into the following three points: software-hardware co-design technology, IP core generation and reuse ...[Details]
Low Voltage Amplifier AD8517

1 Main Features of AD8517 AD8517 is a low voltage amplifier produced by AD. It can operate at a power supply voltage as low as 1.8V. Since it can operate under the discharge termination vo...[Details]
Application of AD603 in signal acquisition system

Abstract: AD603 is a low-noise gain programmable integrated operational amplifier produced by ADI of the United States using patented technology. It can be widely used in RF automatic ga...[Details]
SOC Design Methodology (I)

Abstract: This paper discusses the current status and historical development of integrated circuit (IC) technology, especially the development trend of electronic system design technolog...[Details]
Design experience and guidelines for PCB footprint of surface mount devices

By following these design rules and guidelines, you can create footprints for any PCB layout component . These rules of thumb will reduce your worries and increase your first-pas...[Details]
Research on A-ultrasound digital flaw detection system based on FPGA

Abstract: The basic principle of ultrasonic flaw detection is briefly introduced, and on this basis, a type A digital ultrasonic system based on FPGA is proposed, focusing on the hardware composition ...[Details]
TSMC JASM has signed a site selection agreement with Kikuyo Town, Kumamoto Prefecture, for its second wafer fab in Japan.

On October 24, according to a report from the Nihon Keizai Shimbun, TSMC's subsidiary responsible for operating its wafer fab in Japan, JASM, signed a site selection agreement with the Kikuyo Town ...[Details]

Popular Components