05152
ULC0402FC3.3C
thru
Only One Name Means ProT
ek’Tion™
ULC0402FC36C
UNBUMPED LOW CAPACIT
ANCE FLIP CHIP ARRA
Y
APPLICA
TIONS
✔
Cellular Phones
✔
Personal Digital Assistant (PDA)
✔
Notebook Computers
✔
SMART Cards
IEC COMPA
TIBILITY
(EN61000-4)
✔
61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔
61000-4-4 (EFT): 40A - 5/50ns
FEA
TURES
✔
ESD Protection > 25 kilovolts
✔
Available in Voltages Ranging From 3.3V to 36V
✔
200 Watts Peak Pulse Power per Line (tp = 8/20µs)
✔
Low Clamping Voltage
✔
Bidirectional Configuration & Monolithic Structure
✔
Protects 1 Line
✔
LOW CAPACITANCE
✔
LOW LEAKAGE CURRENT
✔
RoHS Compliant
MECHANICAL CHARACTERISTICS
✔
Standard EIA Chip Size: 0402
✔
Weight 0.73 milligrams (Approximate)
✔
Solder Reflow Temperature:
Tin-Lead - Sn/Pb: 240-245°C
Lead-Free: 260-270°C
✔
Flammability Rating UL 94V-0
✔
8mm Plastic & Paper Tape and Reel Per EIA Standard 481
✔
Device Marking On Reel
PIN CONFIGURA
TION
U0402
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ULC0402FC36C
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
PARAMETER
Peak Pulse Power (t
p
= 8/20µs) - See Figure 1
Operating Temperature
Storage Temperature
SYMBOL
P
PP
T
J
T
STG
VALUE
200
-55°C to 150°C
-55°C to 150°C
UNITS
Watts
°C
°C
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PART
NUMBER
(See Note 1)
RATED
STAND-OFF
VOLTAGE
MINIMUM
BREAKDOWN
VOLTAGE
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@ I
P
= 1A
V
C
VOLTS
7.0
11.0
13.2
19.8
25.4
37.2
70.0
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
MAXIMUM
LEAKAGE
CURRENT
(See Note 2)
@V
WM
I
D
µA
75*
10**
1
1
1
1
1
TYPICAL
CAPACITANCE
V
WM
VOLTS
ULC0402FC3.3C
ULC0402FC05C
ULC0402FC08C
ULC0402FC12C
ULC0402FC15C
ULC0402FC24C
ULC0402FC36C
3.3
5.9
8.0
12.0
15.0
24.0
36.0
@ 1mA
V
(BR)
VOLTS
4.0
6.0
8.5
13.3
16.7
26.7
40.0
@8/20µs
V
C
@ I
PP
12.5V @ 16A
13V @ 15A
18V @ 11A
26.9V @ 7.4A
34.5V @ 5.8A
50.6V @ 4A
80.0V @ 2.5A
@0V, 1 MHz
C
pF
70
35
32
30
25
20
18
Note 1:
All devices are bidirectional. Electrical characteristics apply in both directions.
Note 2:
*Maximum leakage current < 5µA @ 2.8V. **Maximum leakage current <500nA @ 3.3V.
FIGURE 1
PEAK PULSE POWER VS PULSE TIME
10,000
I
PP
- Peak Pulse Current - % of I
PP
P
PP
- Peak Pulse Current - Watts
120
100
80
60
40
20
0
t
f
FIGURE 2
PULSE WAVE FORM
Peak Value I
PP
TEST
WAVEFORM
PARAMETERS
t
f
= 8µs
t
d
= 20µs
1,000
200W, 8/20µs Waveform
100
e
-t
t
d
= t I /2
PP
10
0.01
1
10
100
t
d
- Pulse Duration - µs
1,000
10,000
0
5
10
15
t - Time - µs
20
25
30
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ULC0402FC3.3C
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ULC0402FC36C
GRAPHS
FIGURE 3
POWER DERATING CURVE
Peak Pulse Power
8/20µs
100
80
% Of Rated Power
60
40
20
Average Power
0
0
25
50
75
100
125
T
L
- Lead Temperature - °C
150
FIGURE 4
OVERSHOOT & CLAMPING VOLTAGE FOR ULC0402FC05C
35
5 Volts per Division
25
15
5
-5
ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)
FIGURE 5
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR ULC0402FC05C
14
12
10
8
6
4
2
0
0
5
10
I
PP
- Peak Pulse Current - Amps
05152.R7 4/05
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15
20
V
C
- Clamping Voltage - Volts
ULC0402FC3.3C
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ULC0402FC36C
APPLICA
TION INFORMA
TION
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP(Entek Cu Plus 106A)
±50µm
±20µm
60 Seconds
270°C
VALUE
REQUIREMENTS
Temperature:
T
P
for Lead-Free (SnAgCu): 260-265°C
T
P
for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
T
P
Ramp-up
Temperature - °C
Ramp-down
T
L
T
SMAX
155°
T
SMIN
140°
T
S
- Preheat
t 25°C to Peak
30-60 seconds
Ramp-up
15 seconds
Solder Time
15-20 seconds
Ramp-down
05152.R7 4/05
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ULC0402FC36C
PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
U0402
TOP
SIDE
A
C
B
PACKAGE DIMENSIONS
DIM
A
B
C
D
E
F
I
MILLIMETERS
0.46 NOM
0.86 NOM
0.99 ± 0.0254
0.10 NOM
0.35 NOM
0.483 ± 0.0254
0.406 NOM
INCHES
0.018 NOM
0.034 NOM
0.039 ± 0.001
0.004 NOM
0.014 NOM
0.019 ± 0.001
0.016 NOM
E
F
Metalized Die Contacts
D
END
I
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and outline:
.xxx ± 0.05mm (± 0.002”).
3. Maximum chip size: 1.02 (0.040”) by 0.51(0.020”).
MOUNTING PAD
DIM
C
B
A
D
PAD DIMENSIONS
MILLIMETERS
0.23
0.48
0.69
0.46
0.99
0.20
0.20
0.66
0.13
INCHES
0.009
0.019
0.027
0.018
0.039
0.008
0.008
0.026
0.005
SOLDER PAD
DIE
CONTACTS
A
B
C
D
E
F
G
H
I
DIE
H
E
NOTE:
1. Top view of tape. Metal contacts are face down in tape
package.
F
I
T
APE & REEL ORIENT TION
A
SOLDER PRINT
DIAMETER 0.010” -
0.012”
G
Single Die - 0402
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and reeled in accordance with EIA 481.
2.
8mm Plastic Tape:
7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., ULC0402FC05C-T75-1).
3.
8mm Paper Tape:
7 Inch Reels -10,000 pieces per reel. Ordering Suffix: -T710-2 (i.e., ULC0402FC05C-T710-2).
NOTE:
1.
Preferred:
Using 0.1mm (0.004”) stencil.
Outline & Dimensions: Rev 3 - 11/02, 06020
COPYRIGHT © ProTek Devices 2005
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and
specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or
specifications of such products.
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail:
sales@protekdevices.com
Web Site:
www.protekdevices.com
www.protekdevices.com
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