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ULC0408FC33C

Description
unbumped low capacitance flip chip array
File Size116KB,6 Pages
ManufacturerProtek Test & Measuremen
Websitehttp://www.protektest.com/
Download Datasheet Compare View All

ULC0408FC33C Overview

unbumped low capacitance flip chip array

05170
ULC0408FC3.3C
thru
Only One Name Means ProT
ek’Tion™
ULC0408FC36C
UNBUMPED LOW CAPACIT
ANCE FLIP CHIP ARRA
Y
APPLICA
TIONS
Cellular Phones
Personal Digital Assistant (PDA)
Notebook Computers
SMART Cards
IEC COMPA
TIBILITY
(EN61000-4)
61000-4-2 (ESD): Air - 15kV, Contact - 8kV
61000-4-4 (EFT): 40A - 5/50ns
FEA
TURES
ESD Protection > 25 kilovolts
Available in Voltages Ranging From 3.3V to 36V
200 Watts Peak Pulse Power per Line (tp = 8/20µs)
Low Clamping Voltage
Bidirectional Configuration & Monolithic Structure
Protects 4 to 7 Lines
LOW CAPACITANCE
LOW LEAKAGE CURRENT
RoHS Compliant
MECHANICAL CHARACTERISTICS
Standard EIA Chip Size: 0408
Weight 0.73 milligrams (Approximate)
Solder Reflow Temperature:
Tin-Lead: 240-245°C
Lead-Free: 260-270°C
Flammability Rating UL 94V-0
8mm Plastic & Paper Tape and Reel Per EIA Standard 481
Device Marking On Reel
PIN CONFIGURA
TION
U0408
(Single Chip Shown)
05170.R5 4/05
1
www.protekdevices.com

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Description unbumped low capacitance flip chip array unbumped low capacitance flip chip array unbumped low capacitance flip chip array unbumped low capacitance flip chip array unbumped low capacitance flip chip array unbumped low capacitance flip chip array unbumped low capacitance flip chip array unbumped low capacitance flip chip array
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