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IDT72V233L15PFG

Description
FIFO, 1KX18, 10ns, Synchronous, CMOS, PQFP80, PLASTIC, TQFP-80
Categorystorage    storage   
File Size324KB,45 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance
Download Datasheet Parametric View All

IDT72V233L15PFG Overview

FIFO, 1KX18, 10ns, Synchronous, CMOS, PQFP80, PLASTIC, TQFP-80

IDT72V233L15PFG Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeQFP
package instructionLQFP,
Contacts80
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time10 ns
Other featuresIT CAN ALSO BE CONFIGURED AS 2K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE
period time15 ns
JESD-30 codeS-PQFP-G80
JESD-609 codee3
length14 mm
memory density18432 bit
memory width18
Humidity sensitivity level3
Number of functions1
Number of terminals80
word count1024 words
character code1000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1KX18
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Package shapeSQUARE
Package formFLATPACK, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum supply voltage (Vsup)3.45 V
Minimum supply voltage (Vsup)3.15 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
width14 mm
Base Number Matches1
3.3 VOLT HIGH-DENSITY SUPERSYNC II™
NARROW BUS FIFO
512 x 18/1,024 x 9, 1,024 x 18/2,048 x 9
2,048 x 18/4,096 x 9, 4,096 x 18/8,192 x 9
8,192 x 18/16,384 x 9, 16,384 x 18/32,768 x 9
32,768 x 18/65,536 x 9, 65,536 x 18/131,072 x 9
PRELIMINARY
IDT72V223, IDT72V233
IDT72V243, IDT72V253
IDT72V263, IDT72V273
IDT72V283, IDT72V293
FEATURES:
Choose among the following memory organizations:
IDT72V223
512 x 18/1,024 x 9
IDT72V233
1,024 x 18/2,048 x 9
IDT72V243
2,048 x 18/4,096 x 9
IDT72V253
4,096 x 18/8,192 x 9
IDT72V263
8,192 x 18/16,384 x 9
IDT72V273
16,384 x 18/32,768 x 9
IDT72V283
32,768 x 18/65,536 x 9
IDT72V293
65,536 x 18/131,072 x 9
Functionally compatible with the IDT72V255LA/72V265LA and
IDT72V275/72V285 SuperSync FIFOs
Up to 166 MHz Operation of the Clocks
User selectable Asynchronous read and/or write ports (BGA Only)
User selectable input and output port bus-sizing
- x9 in to x9 out
- x9 in to x18 out
- x18 in to x9 out
- x18 in to x18 out
Pin to Pin compatible to the higher density of IDT72V2103/72V2113
Big-Endian/Little-Endian user selectable byte representation
5V tolerant inputs
Fixed, low first word latency
Zero latency retransmit
Auto power down minimizes standby power consumption
Master Reset clears entire FIFO
Partial Reset clears data, but retains programmable settings
Empty, Full and Half-Full flags signal FIFO status
Programmable Almost-Empty and Almost-Full flags, each flag can
default to one of eight preselected offsets
Selectable synchronous/asynchronous timing modes for Almost-
Empty and Almost-Full flags
Program programmable flags by either serial or parallel means
Select IDT Standard timing (using
EF
and
FF
flags) or First Word
Fall Through timing (using
OR
and
IR
flags)
Output enable puts data outputs into high impedance state
Easily expandable in depth and width
JTAG port, provided for Boundary Scan function (BGA Only)
Independent Read and Write Clocks (permit reading and writing
simultaneously)
Available in a 80-pin Thin Quad Flat Pack (TQFP) or a 100-pin Ball
Grid Array (BGA) (with additional features)
High-performance submicron CMOS technology
Industrial temperature range (–40°C to +85°C) is available
°
°
FUNCTIONAL BLOCK DIAGRAM
*Available on the
BGA package only.
D
0
-D
n
(x9 or x18)
WEN
WCLK/WR
*
INPUT REGISTER
LD SEN
OFFSET REGISTER
FF/IR
PAF
EF/OR
PAE
HF
FWFT/SI
PFM
FSEL0
FSEL1
*
ASYW
WRITE CONTROL
LOGIC
WRITE POINTER
RAM ARRAY
512 x 18 or 1,024 x 9
1,024 x 18 or 2,048 x 9
2,048 x 18 or 4,096 x 9
4,096 x 18 or 8,192 x 9
8,192 x 18 or 16,384 x 9
16,384 x 18 or 32,768 x 9
32,768 x 18 or 65,536 x 9
65,536 x 18 or 131,072 x 9
FLAG
LOGIC
READ POINTER
BE
IP
IW
OW
MRS
PRS
TCK
*
TRST
*
TMS
**
TDI
*
TDO
CONTROL
LOGIC
BUS
CONFIGURATION
RESET
LOGIC
OUTPUT REGISTER
READ
CONTROL
LOGIC
RT
RM
ASYR
*
RCLK/RD
JTAG CONTROL
(BOUNDARY SCAN)
*
OE
Q
0
-Q
n
(x9 or x18)
REN
*
4666 drw01
IDT and the IDT logo are a registered trademarks of Integrated Device Technology, Inc. The SuperSync II FIFO is a trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
©2001
Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
DECEMBER 2001
DSC-4666/5

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