HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6768
Issued Date : 1994.07.29
Revised Date : 2002.02.20
Page No. : 1/3
HTIP29C
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HTIP29C is designed for use in general purpose amplifier and
switching applications.
Absolute Maximum Ratings
(Ta=25°C)
TO-220
•
Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150
°C
Junction Temperature .................................................................................... +150
°C
Maximum
•
Maximum Power Dissipation
Total Power Dissipation (Tc=25°C) ..................................................................................... 30 W
Total Power Dissipation (Ta=25°C) ....................................................................................... 2 W
•
Maximum Voltages and Currents
BVCBO Collector to Base Voltage..................................................................................... 100 V
BVCEO Collector to Emitter Voltage.................................................................................. 100 V
BVEBO Emitter to Base Voltage............................................................................................ 5 V
IC Collector Current............................................................................................................... 1 A
Characteristics
(Ta=25°C)
Symbol
BVCBO
BVCEO
ICES
ICEO
IEBO
*VCE(sat)
*VBE(on)
*hFE1
*hFE2
fT
Min.
100
100
-
-
-
-
-
40
15
3
Typ.
-
-
-
-
-
-
-
-
-
-
Max.
-
-
200
300
1
0.7
1.3
-
75
-
Unit
V
V
uA
uA
mA
V
V
Test Conditions
IC=1mA, IE=0
IC=30mA, IB=0
VCE=100V, IB=0
VCE=60V, IB=0
VEB=5V
IC=1A, IB=125mA
IC=1A, VCE=4V
IC=0.2A, VCE=4V
IC=1A, VCE=4V
IC=0.2A, VCE=10V, f=1MHz
*Pulse Test: Pulse Width
≤380us,
Duty Cycle≤2%
MHz
HTIP29C
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000
hFE @ V
CE
=4V
1000
V
CE(sat)
@ I
C
=8I
B
Spec. No. : HE6768
Issued Date : 1994.07.29
Revised Date : 2002.02.20
Page No. : 2/3
Saturation Voltage & Collector Current
Saturation Voltage (mV)
75 C
100
25 C
125 C
o
o
o
hFE
125 C
100
25 C
75 C
o
o
o
10
1
10
100
1000
10
1
10
100
1000
Collector Current I
C
(mA)
Collector Current-I
C
(mA)
ON Voltage & Collector Current
1000
25 C
o
Switching Time & Collector Current
10.0
V
CC
=30V, I
C
=10I
B1
=-10I
B2
75 C
o
Switching Times (us)
..
.
ON Voltage (mV)
1.0
125 C
V
BE(ON)
@ V
CE
=4V
o
Tstg
Ton
Tf
100
1
10
100
1000
0.1
0.1
1.0
10.0
Collector Current-I
C
(mA)
Collector Current (A)
Capacitance & Reverse-Biased Voltage
1000
100000
P
T
=1ms
P
T
=100ms
Safe Operating Area
Collector Current-I
C
(mA)
10000
Capacitance (pF)
P
T
=1s
1000
100
100
Cob
10
0.1
1
10
100
10
1
10
100
1000
Reverse-Biased Voltage (V)
Forward Voltage-V
CE
(V)
HTIP29C
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-220AB Dimension
Marking:
A
D
B
E
C
Date Code
Spec. No. : HE6768
Issued Date : 1994.07.29
Revised Date : 2002.02.20
Page No. : 3/3
H T I P
2 9 C
Control Code
H
I
G
4
P
M
3
2
1
N
K
Style: Pin 1.Base 2.Collector 3.Emitter
O
3-Lead TO-220AB Plastic Package
HSMC Package Code: E
*: Typical
DIM
A
B
C
D
E
G
H
Inches
Min.
Max.
0.2197 0.2949
0.3299 0.3504
0.1732
0.185
0.0453 0.0547
0.0138 0.0236
0.3803 0.4047
-
*
0.6398
Millimeters
Min.
Max.
5.58
7.49
8.38
8.90
4.40
4.70
1.15
1.39
0.35
0.60
9.66
10.28
-
*
16.25
DIM
I
K
M
N
O
P
Inches
Min.
Max.
-
*
0.1508
0.0295 0.0374
0.0449 0.0551
-
*
0.1000
0.5000 0.5618
0.5701 0.6248
Millimeters
Min.
Max.
-
*
3.83
0.75
0.95
1.14
1.40
-
*
2.54
12.70
14.27
14.48
15.87
Notes:
1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
•
Lead : 42 Alloy; solder plating
•
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
•
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
•
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HTIP29C
HSMC Product Specification
Embedded System
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