Junction Temperature ..................................................................................................................................................... +150
°C
•
Maximum Power Dissipation
Total Power Dissipation (T
C
=25°C)...................................................................................................................................... 10 W
•
Maximum Voltages and Currents
BV
CBO
Collector to Base Voltage .......................................................................................................................................... 40 V
BV
CEO
Collector to Emitter Voltage ....................................................................................................................................... 30 V
BV
EBO
Emitter to Base Voltage ............................................................................................................................................... 5 V
I
C
Collector Current (DC) ........................................................................................................................................................ 3 A
I
C
Collector Current (Pulse) .................................................................................................................................................... 7 A
I
B
Base Current (DC) ....................................................................................................................................................... 600 mA
Thermal Characteristic
Characteristic
Thermal Resistance, junction to case
Symbol
R
θ
jc
Max
12.5
Unit
o
C/W
Electrical Characteristics
(T
A
=25°C)
Symbol
BV
CBO
BV
CEO
BV
EBO
I
CBO
I
EBO
*V
CE(sat)
*V
BE(sat)
*h
FE1
*h
FE2
f
T
Cob
Min.
40
30
5
-
-
-
-
30
100
-
-
Typ.
-
-
-
-
-
-
1
-
-
90
45
Max.
-
-
-
1
1
0.5
2
-
500
-
-
MHz
pF
Unit
V
V
V
uA
uA
V
V
I
C
=100uA, I
E
=0
I
C
=1mA, I
B
=0
I
E
=10uA, I
C
=0
V
CB
=30V, I
E
=0
V
EB
=3V, I
C
=0
I
C
=2A, I
B
=0.2A
I
C
=2A, I
B
=0.2A
V
CE
=2V, I
C
=20mA
V
CE
=2V, I
C
=1A
V
CE
=5V, I
C
=0.1A, f=100MHz
V
CB
=10V, f=1MHz
*Pulse Test: Pulse Width
≤380us,
Duty Cycle≤2%
Test Conditions
Classification Of h
FE2
Rank
Range
P
160-320
HJ882
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000
1000
Spec. No. : HE6014
Issued Date : 1996.04.12
Revised Date : 2006.12.06
Page No. : 2/5
Saturation Voltage & Collector Current
125 C
o
75 C
o
25 C
o
Saturation Voltage (mV)
75 C
100
o
hFE
100
25 C
o
hFE @ V
CE
=2V
10
1
10
100
1000
10000
10
1
125 C
V
CE(s at)
@ I
C
=10I
B
o
10
100
1000
10000
Collector Current-I
C
(mA)
Collector Current-I
C
(mA)
Saturation Voltage & Collector Current
1000
1000
Saturation Voltage & Collector Current
Saturation Voltage (mV)
75 C
o
Saturation Voltage (mV)
75 C
o
100
125 C
o
100
25 C
o
125 C
o
25 C
o
V
CE(s at)
@ I
C
=40I
B
10
1
10
100
1000
10000
10
1
10
100
V
CE(sat)
@ I
C
=20I
B
1000
10000
Collector Current-I
C
(mA)
Collector Current-I
C
(mA)
Saturation Voltage & Collector Current
10000
100
Capacitance & Reverse-Biased Voltage
Saturation Voltage (mV)
75 C
1000
25 C
o
o
125 C
V
BE(s at)
@ I
C
=10I
B
100
1
10
100
1000
10000
10
0.1
1
10
o
Capacitance (pF)
Cob
100
Collector Current-I
C
(mA)
Reverse-Biased Voltage (V)
HJ882
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6014
Issued Date : 1996.04.12
Revised Date : 2006.12.06
Page No. : 3/5
Cutoff Frequency & Collector Current
1000
10
Safe Operating Area
P
T
=1ms
P
T
=100ms
Cutoff Frequency (MHz)
..
.
Collector Current (A)
P
T
=1s
1
V
CE
=5V
100
1
10
100
1000
0.1
1
10
100
Collector Current (mA)
Forward Biased Voltage (V)
PD - Ta
1.6
1.4
10
12
PD - Tc
PD(W), Power Dissipation
1.2
1
0.8
0.6
0.4
0.2
0
0
50
100
o
PD(W), Power Dissipation
150
200
8
6
4
2
0
0
20
40
60
80
100
o
120
140
160
Ambient Temperature-Ta ( C )
Ambient Temperature-Tc ( C )
HJ882
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-252 Dimension
M
A
F
C
G
1
2
3
Date Code
Spec. No. : HE6014
Issued Date : 1996.04.12
Revised Date : 2006.12.06
Page No. : 4/5
Marking:
a1
Pb Free Mark
Pb-Free: "
.
"
(Note)
H
Normal: None
J
8 8 2
Control Code
Note: Green label is used for pb-free packing
Pin Style: 1.Base 2.Collector 3.Emitter
N
H
a5
L
a2
Material:
•
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
•
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM
A
C
F
G
H
L
M
N
a1
a2
a5
Min.
6.35
4.80
1.30
5.40
2.20
0.40
2.20
0.90
0.40
-
0.65
Max.
6.80
5.50
1.70
6.25
3.00
0.90
2.40
1.50
0.65
*2.30
1.05
*: Typical, Unit: mm
a1
3-Lead TO-252 Plastic
Surface Mount Package
HSMC Package Code: J
A
B
C
D
a1
E
Marking:
M
F
y1
a1
Pb-Free: "
.
"
(Note)
H
Normal: None
Pb Free Mark
J
8 8 2
Date Code
Control Code
GI
y1
y1
Note: Green label is used for pb-free packing
Pin Style: 1.Base 2.Collector 3.Emitter
Material:
•
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
•
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
J
K
a2
y2
H
N
L
a2
y2
3-Lead TO-252 Plastic
Surface Mount Package
HSMC Package Code: J
a1
O
DIM
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
a1
a2
y1
y2
Min.
6.40
-
5.04
-
0.40
0.50
5.90
2.50
9.20
0.60
-
0.66
2.20
0.70
0.82
0.40
2.10
-
-
Max.
6.80
6.00
5.64
*4.34
0.80
0.90
6.30
2.90
9.80
1.00
0.96
0.86
2.40
1.10
1.22
0.60
2.50
5
o
3
o
*: Typical, Unit: mm
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
•
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
•
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HJ882
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Soldering Methods for HSMC’s Products
1. Storage environment: Temperature=10 C~35 C Humidity=65%±15%
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