MF1PLUSx0y1
Mainstream contactless smart card IC for fast and easy
solution development
Rev. 3.1 — 19 April 2010
163531
Product short data sheet
PUBLIC
1. General description
Migrate classic contactless smart card systems to the next security level! MIFARE Plus
brings benchmark security to mainstream contactless smart card applications. It is the
only mainstream IC compatible with MIFARE Classic 1K (MF1ICS50) and MIFARE
Classic 4K (MF1ICS70) which offers an upgrade path for existing infrastructure and
services.
After the security upgrade, MIFARE Plus uses AES-128 (Advanced Encryption Standard)
for authentication, data integrity and encryption. MIFARE Plus is based on open global
standards for both air interface and cryptographic methods at the highest security level.
MIFARE Plus is available in two versions: MIFARE Plus X and MIFARE Plus S.
•
The MIFARE Plus X (MF1PLUSx0y1, described in this data sheet) offers more
flexibility to optimize the command flow for speed and confidentiality. It offers a rich
feature set including proximity checks against relay attacks.
•
The MIFARE Plus S (MF1SPLUSx0y1)is the standard version for straight forward
migration of MIFARE Classic systems. It is configured to offer high data integrity.
2. Features and benefits
2 kB or 4 kB EEPROM
Simple fixed memory structure compatible with MIFARE Classic 1K and
MIFARE Classic 4K
Memory structure identical to MIFARE Classic 4K (sectors, blocks)
Access conditions freely configurable
Supports ISO/IEC 14443-3
1
unique serial number (4-byte or 7-byte), optional support
of random IDs
Multi-sector authentication, Multi-block read and write
AES-128 used for authenticity, confidentiality and integrity
Anti-tearing mechanism for writing AES keys
Keys can be stored as MIFARE CRYPTO1 keys (2
×
48-bit per sector) and as AES
keys (2
×
128-bit per sector)
Full support of virtual card concept
Proximity check
Communication speed up to 848 kbit/s
1.
ISO/IEC 14443-x used in this data sheet refers to ISO/IEC 14443 Type A.
NXP Semiconductors
MF1PLUSx0y1
Mainstream contactless smart card IC
Number of single write operations: 200000 cycles (typical)
Common Criteria Certification: EAL4+
3. Applications
Public transportation
Access management such as employee, school or campus cards
Electronic toll collection
Closed loop micro payment
Car parking
Internet cafés
Loyalty programs
4. Quick reference data
Table 1.
C
i
f
i
t
ret
Quick reference data
Conditions
[1]
Symbol Parameter
Min
15.0
-
Typ
17.0
13.56
-
Max
19.04
-
-
Unit
pF
MHz
year
cycle
input capacitance T
amb
= 22
°C;
f
i
= 13.56
MHz; 2.8 V RMS
input frequency
retention time
T
amb
= 22
°C
T
amb
= 22
°C;
excluding
anti-tearing for AES keys or
sector trailers in security
level 3
EEPROM characteristics
10
N
endu(W)
write endurance
100000 200000 -
[1]
Measured with LCR meter.
MF1PLUSX0Y1_SDS_31
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3.1 — 19 April 2010
163531
2 of 20
NXP Semiconductors
MF1PLUSx0y1
Mainstream contactless smart card IC
5. Ordering information
Table 2.
Ordering information
Package
Commercial
name
MF1PLUS8001DUD/03
FFC
Name
-
Description
8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
Ref. 3,
4 kB EEPROM, 7-byte UID, L1 card
plastic leadless module carrier package; 35 mm
wide tape, 4 kB EEPROM, 7-byte UID, L1 card
8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
Ref. 3,
4 kB EEPROM, 4-byte UID, L1 card
8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
Ref. 3,
4 kB EEPROM, 4-byte UID, UID0 = XFh
according to ISO/IEC 14443-3, L1 card
plastic leadless module carrier package; 35 mm
wide tape, 4 kB EEPROM, 4-byte UID, L1 card
plastic leadless module carrier package; 35 mm
wide tape, 4 kB EEPROM, 4-byte UID,
UID0 = XFh according to ISO/IEC 14443-3, L1
card
8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
Ref. 3,
2 kB EEPROM, 7-byte UID, L1 card
plastic leadless module carrier package; 35 mm
wide tape, 2 kB EEPROM, 7-byte UID, L1 card
8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
Ref. 3,
2 kB EEPROM, 4-byte UID, L1 card
8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
Ref. 3,
2 kB EEPROM, 4-byte UID, UID0 = XFh
according to ISO/IEC 14443-3, L1 card
plastic leadless module carrier package; 35 mm
wide tape, 2 kB EEPROM, 4-byte UID, L1 card
plastic leadless module carrier package; 35 mm
wide tape, 2 kB EEPROM, 4-byte UID,
UID0 = XFh according to ISO/IEC 14443-3, L1
card
Version
-
Type number
MF1PLUS8001DA4/03
MF1PLUS8011DUD/03
MOA4
FFC
PLLMC
-
SOT500-2
-
MF1PLUS8021DUD/03
FFC
-
-
MF1PLUS8011DA4/03
MF1PLUS8021DA4/03
MOA4
MOA4
PLLMC
PLLMC
SOT500-2
SOT500-2
MF1PLUS6001DUD/03
FFC
-
-
MF1PLUS6001DA4/03
MF1PLUS6011DUD/03
MOA4
FFC
PLLMC
-
SOT500-2
-
MF1PLUS6021DUD/03
FFC
-
-
MF1PLUS6011DA4/03
MF1PLUS6021DA4/03
MOA4
MOA4
PLLMC
PLLMC
SOT500-2
SOT500-2
MF1PLUSX0Y1_SDS_31
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3.1 — 19 April 2010
163531
3 of 20
NXP Semiconductors
MF1PLUSx0y1
Mainstream contactless smart card IC
Table 2.
Ordering information
…continued
Package
Commercial
name
Name
-
Description
Version
Type number
MF1PLUS8001DUD/13
FFC
8 inch wafer (sawn; 120 µm thickness, on film
-
frame carrier; electronic fail die marking
according to SECS-II format) see
Ref. 3,
4 kB EEPROM, 7-byte UID, no security level 1 or
2, L3 card
plastic leadless module carrier package; 35 mm
wide tape, 4 kB EEPROM, 7-byte UID, no
security level 1 or 2, L3 card
SOT500-2
MF1PLUS8001DA4/13
MOA4
PLLMC
MF1PLUS6001DUD/13
FFC
-
8 inch wafer (sawn; 120 µm thickness, on film
-
frame carrier; electronic fail die marking
according to SECS-II format) see
Ref. 3,
2 kB EEPROM, 7-byte UID, no security level 1 or
2, L3 card
plastic leadless module carrier package; 35 mm
wide tape, 2 kB EEPROM, 7-byte UID, no
security level 1or 2, L3 card
SOT500-2
MF1PLUS6001DA4/13
MOA4
PLLMC
6. Block diagram
RF
INTERFACE
SECURITY
SENSORS
POWER ON
RESET
VOLTAGE
REGULATOR
CLOCK
INPUT FILTER
RESET
GENERATOR
UART
ISO/IEC
14443A
AES CRYPTO
CO-PROCESSOR
TRUE RANDOM
NUMBER
GENERATOR
CRYPTO1
CPU/LOGIC UNIT
CRC
ROM
RAM
EEPROM
001aah389
Fig 1.
Block diagram
MF1PLUSX0Y1_SDS_31
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3.1 — 19 April 2010
163531
4 of 20
NXP Semiconductors
MF1PLUSx0y1
Mainstream contactless smart card IC
7. Pinning information
7.1
Smart card contactless module
LA
top view
LB
001aaj820
Fig 2.
Table 3.
Contact assignments for SOT500-2 (MOA4)
Bonding pad assignments to smart card contactless module
MF1PLUSx0y1DA4/03 and /13
Description
antenna coil connection LA
antenna coil connection LB
Symbol
LA
LB
Contactless interface module
Antenna contacts
LA
LB
MF1PLUSX0Y1_SDS_31
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3.1 — 19 April 2010
163531
5 of 20
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