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AND4OA

Description
ingaalp ultra bright orange light emission surface mount package
CategoryLED optoelectronic/LED    photoelectric   
File Size44KB,2 Pages
ManufacturerPurdy Electronics Corporation
Websitehttp://www.purdyelectronics.com/
Download Datasheet Parametric View All

AND4OA Overview

ingaalp ultra bright orange light emission surface mount package

AND4OA Parametric

Parameter NameAttribute value
MakerPurdy Electronics Corporation
Objectid100928181
Reach Compliance Codeunknown
compound_id181967995
color@wavelengthAmber
Maximum forward current0.025 A
Maximum forward voltage2.4 V
Maximum operating temperature80 °C
Minimum operating temperature-25 °C
total height1.1 mm
peak wavelength612 nm
Maximum reverse voltage4 V
perspective150 deg
AND4OA
Ultra Bright LED Lamps: Type 2
Weight: 2.0 mg
Unit: mm
AND4OA
Cathode
Index
1.25
1.1
0.6
InGaAlP Ultra Bright Orange Light
Emission
Surface Mount Package
Features
• RoHS Compliant
• Small package size
• 2.0 (l) x 1.25 (w) x 1.1 (h) size
• Suitable for DIP and REFLOW soldering
• Recommended Forward Current: 10 mA
Maximum Ratings (T
a
= 25°C)
Characteristics
Symbol
I
F
V
R
P
D
T
Opr
T
Stg
2.0
1.4
Rating
25
4
62.5
-30 to 85
-30 to 85
Unit
mA
V
mW
°C
°C
0.4±0.2
Forward Current
Reverse Voltage
Power Dissipation
Polarity
R0.2
Operating Temperature Range
Storage Temperature Range
Electro-Optical Characteristics (T
a
= 25°C)
Characteristics
Forward Voltage
Reverse Current
Luminous Intensity
Peak Emission Wavelength
Spectral Line Half Width
Dominant Wavelength
Full Viewing Angle
Precaution
Symbol
V
F
I
R
I
V
l
P
∆λ
λ
d
θ
Test Condition
I
F
= 20 mA
V
R
= 4 V
I
F
= 20 mA
I
F
= 20 mA
I
F
= 20 mA
I
F
= 20 mA
I
V
= 1/2 Peak
Minimum
27
Typical
2.0
60
612
15
605
140
Maximum
2.8
100
Unit
V
µA
mcd
nm
nm
nm
degree
Please be careful of the following:
1. Manual soldering: maximum temperature of iron tip: 260°C max.
Soldering time: within 5 sec. per solder-land
Soldering portion of lead: up to 1.6 mm from the body of the device
2. Reflow solder: recommended condition is as follows:
10 sec. max.
Temperature
140 - 160°C
230°C max.
Product specifications contained herein may be
changed without prior notice. It is therefore
advisable to contact Purdy Electronics before
proceeding with the design of equipment
incorporating this product.
The following soldering patterns are
recommended for reflow and dip soldering
Reflow
Dip
1.75
1.25
1.1
1.25
6/12/07
more than 2 min.
Time
4°C/sec.
max.
1.25
1.1
1.25
Purdy Electronics Corporation • 720 Palomar Avenue • Sunnyvale, CA 94085
Tel: 408.523.8200 • Fax: 408.733.1287 • sales@purdyelectronics.com • www.purdyelectronics.com
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