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1.5KCD200

Description
cellular die package
CategoryDiscrete semiconductor    diode   
File Size123KB,2 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

1.5KCD200 Overview

cellular die package

1.5KCD200 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicrosemi
Parts packaging codeDIE
package instructionO-MEDB-N2
Contacts2
Reach Compliance Codeunknown
ECCN codeEAR99
Is SamacsysN
Maximum breakdown voltage220 V
Minimum breakdown voltage180 V
Breakdown voltage nominal value180 V
Maximum clamping voltage287 V
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeTRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 codeO-MEDB-N2
JESD-609 codee0
Maximum non-repetitive peak reverse power dissipation1500 W
Number of components1
Number of terminals2
Package body materialMETAL
Package shapeROUND
Package formDISK BUTTON
Peak Reflow Temperature (Celsius)NOT SPECIFIED
polarityUNIDIRECTIONAL
Certification statusNot Qualified
Maximum repetitive peak reverse voltage182 V
surface mountYES
technologyAVALANCHE
Terminal surfaceTIN LEAD
Terminal formNO LEAD
Terminal locationEND
Maximum time at peak reflow temperatureNOT SPECIFIED
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