CYStech Electronics Corp.
Small Signal Schottky (double) diodes
Spec. No. : C302N3-H
Issued Date : 2003.04.14
Revised Date :
Page No. : 1/4
BAT54N3/BAT54AN3
BAT54CN3/BAT54SN3
Description
Planar silicon Schottky barrier diodes encapsulated in a SOT-23 small plastic SMD package.
Single diodes and double diodes with different pinning are available.
Features
•Very
small conduction losses
•Low
forward voltage drop
•Small
plastic SMD package
Applications
•Ultra
high-speed switching
•Voltage
clamping
•Protection
circuits
•Blocking
diodes
Pinning
Pin
1
2
3
BAT54
A
NC
K
3
1
2
1
Outline
Description
BAT54A
BAT54C
K1
A1
K2
A2
A1,A2
K1,K2
3
2
BAT54S
A1
K2
K1,A1
SOT-23
3
1
2
N.C.
(1) BAT54
3
1
2
1
(2)BAT54A
3
2
Marking:
Type
BAT54 N3
BAT54AN3
BAT54CN3
BAT54SN3
Marking Code
L4
L42
L43
L44
(3)BAT54C
(4)BAT54S
Diode configuration and symbol
BAT54N3/BAT54AN3/BAT54CN3/BAT54SN3
CYStek Product Specification
CYStech Electronics Corp.
Absolute Maximum Ratings
Spec. No. : C302N3-H
Issued Date : 2003.04.14
Revised Date :
Page No. : 2/4
•
Maximum Temperatures
Storage Temperature Tstg ................................................................................................... -65~+150
°C
Junction Temperature Tj .............................................................................................................. +125°C
•
Maximum Power Dissipation
Total Power Dissipation (Ta=25°C) Ptot
(Note)
......................................................................... 230 mW
•
Maximum Voltages and Currents (Ta=25°C)
Repetitive Peak Reverse Voltage V
RRM
.............................................................................................. 30 V
Continuous Forward Current I
F
................................................................................................... 200 mA
Repetitive Peak Forward Current(tp≤1s,duty cycle≤0.5)………………………………………… 300mA
Non-repetitive Peak Forward Current (tp<10ms, sinusoidal) I
FSM
............................................... 600 mA
Note:for double diodes, Ptot is the total power dissipation of both diodes.
Characteristics
(Ta=25°C)
Characteristic
Reverse Breakdown Voltage
Symbol
V
BR
V
F
(1)
V
F
(2)
Forward Voltage (Note 1)
V
F
(3)
V
F
(4)
V
F
(5)
Reverse Leakage Current (Note 2)
Diode Capacitance
Reverse Recovery Time
Notes
:
1.pulse test, tp=380µs,duty cycle<2%.
2.pulse test, tp=5ms,duty cycle<2%.
Condition
I
R
=100µA
I
F
=0.1mA
I
F
=1mA
I
F
=10mA
I
F
=30mA
I
F
=100mA
V
R
=25V,Tj=25℃
V
R
=1V, f=1MHz
I
F
=I
R
=10mA R
L
=100Ω
measured at I
R
=1mA
Min.
30
-
-
-
-
-
-
-
-
Max.
-
240
320
400
500
800
2
10
5
Unit
V
mV
mV
mV
mV
mV
µA
pF
ns
I
R
C
D
trr
BAT54N3/BAT54AN3/BAT54CN3/BAT54SN3
CYStek Product Specification
CYStech Electronics Corp.
Characteristic Curves
Forward Current & Forward Voltage
250
Spec. No. : C302N3-H
Issued Date : 2003.04.14
Revised Date :
Page No. : 3/4
100
Diode Capacitance & Reverse-Biased Voltage
200
150
Diode Capacitance-Cd (pF)
0
200
400
600
800
1000
Forward Current-I
F
(mA)
10
100
50
0
1
Forward Voltage-V
F
(mV)
0.1
1
10
100
Reverse Biased Voltage-V
R
(V)
BAT54N3/BAT54AN3/BAT54CN3/BAT54SN3
CYStek Product Specification
CYStech Electronics Corp.
SOT-23 Dimension
Diagram:
L
3
B
1
2
S
Spec. No. : C302N3-H
Issued Date : 2003.04.14
Revised Date :
Page No. : 4/4
A
Marking:
L4_
L4X
V
G
C
D
K
3-Lead SOT-23 Plastic Surface Mounted
Package.
CYStek Package Code: N3
J
H
•
BAT54 N3: Single Diode
(Marking Code L4)
•
BAT54AN3: Common Anode. (Marking Code L42)
•
BAT54CN3: Common Cathode. (Marking Code L43)
•
BAT54SN3: Series Connected. (Marking Code L44)
*: Typical
DIM
A
B
C
D
G
H
Inches
Min.
Max.
0.1102 0.1204
0.0472 0.0630
0.0335 0.0512
0.0118 0.0197
0.0669 0.0910
0.0005 0.0040
Millimeters
Min.
Max.
2.80
3.04
1.20
1.60
0.89
1.30
0.30
0.50
1.70
2.30
0.013
0.10
DIM
J
K
L
S
V
Inches
Min.
Max.
0.0034 0.0070
0.0128 0.0266
0.0335 0.0453
0.0830 0.1083
0.0098 0.0256
Millimeters
Min.
Max.
0.85
0.177
0.32
0.67
0.85
1.15
2.10
2.75
0.25
0.65
Notes:
1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
•
Lead: 42 Alloy; solder plating
•
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
•
CYStek reserves the right to make changes to its products without notice.
•
CYStek
semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BAT54N3/BAT54AN3/BAT54CN3/BAT54SN3
CYStek Product Specification
Microcontroller MCU
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