SOT-89 packages. A SOT-86 version is also available as
the EC1019C. All devices are 100% RF and DC tested.
The broadband MMIC amplifier can be directly applied to
various current and next generation wireless technologies
such as GPRS, GSM, CDMA, and W-CDMA. In addition,
the EC1019B will work for other various applications
within the DC to 4 GHz frequency range such as CATV
and mobile wireless.
Functional Diagram
GND
4
1
RF IN
2
GND
3
RF OUT
Applications
•
•
•
•
•
Mobile Infrastructure
CATV / FTTX
W-LAN / ISM
RFID
WiMAX / WiBro
Function
Input
Output/Bias
Ground
Pin No.
1
3
2, 4
Specifications
(1)
Parameter
Operational Bandwidth
Test Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3
(2)
Noise Figure
Device Voltage
Device Current
Typical Performance
(1)
Units
MHz
MHz
dB
dB
dB
dBm
dBm
dB
V
mA
Min
DC
16.5
Typ
2000
18.4
16.5
10.5
+19.5
+31
2.9
4.7
70
Max
4000
20.5
Parameter
Frequency
S21
S11
S22
Output P1dB
Output IP3
(2)
Noise Figure
Units
MHz
dB
dB
dB
dBm
dBm
dB
500
20.9
-21.5
-17.3
+19
+34
2.5
Typical
900
20.4
-19.2
-15.1
+19
+34
2.6
1900
18.5
-16.6
-10.6
+19.5
+31
2.8
2140
18.2
-16.9
-10.2
+19
+31
2.9
+14.5
4.2
5.2
1. Test conditions unless otherwise noted: 25 ºC, Supply Voltage = +6V, Rbias = 16.5Ω, 50Ω syystem.
2. 3OIP measured with two tones at an output power of +4 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Absolute Maximum Rating
Parameter
Storage Temperature
Device Current
RF Input Power (continuous)
Junction Temperature
Thermal Resistance, Rth
-55 to +150
°C
130 mA
+12 dBm
+160
°C
128
°C/W
Rating
Ordering Information
Part No.
EC1019B-G
EC1019B-PCB
Description
InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-89 package)
700 – 2400 MHz Fully Assembled Eval. Board
Specifications and information are subject to change without notice
Operation of this device above any of these parameters may cause permanent damage.
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com, www.TriQuint.com
Page 1 of 4 January 2008
EC1019B
Frequency
S21
S11
S22
Output P1dB
Output IP3
Noise Figure
MHz
dB
dB
dB
dBm
dBm
dB
InGaP HBT Gain Block
Typical Device RF Performance
Supply Bias = +6 V, R
bias
= 15
Ω,
I
cc
= 70 mA
100
21.2
-23.7
-19.0
+19.4
+33
2.9
500
20.9
-21.5
-17.3
+19.4
+33.2
2.5
900
20.4
-19.2
-15.1
+19.4
+33.6
2.6
1900
18.5
-16.6
-10.6
+19.5
+31
2.8
2140
18.2
-16.9
-10.2
+19.0
+31
2.9
2400
17.6
-18.2
-10.2
+18.8
+30.7
3500
15.6
-11.2
-8.1
+16.2
5800
11.3
-9.5
-6.2
1. Test conditions: T = 25º C, Supply Voltage = +6 V, Device Voltage = 4.7 V, Rbias = 16.5
Ω,
Icc = 70 mA typical, 50
Ω
System.
2. 3OIP measured with two tones at an output power of +4 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit.
S21 vs. Frequency
S11, S22 vs. Frequency
Icc vs. Vde
160
120
25
0
S11,S22 (dB)
-5
20
S21 (dB)
15
10
5
+25 °C
Icc (mA)
-10
-15
-20
-25
S22
80
40
25°C
0
4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6 5.8 6.0
S11
0
0
1
2
Frequency (GHz)
OIP3 vs. Frequency
40
35
3
4
0
1
2
Frequency (GHz)
3
4
Vde (V)
P1dB vs. Frequency
24
Noise Figure vs. Frequency
5
4
OIP3 (dBm)
3
2
1
30
25
20
500
25°C
1000
1500
85°C
2000
-40°C
2500
3000
NF
P1dB (dBm)
NF (dB)
20
16
25°C
85°C
-40°C
2500
3000
0
0
500
1000
1500
2000
2500
Frequency (MHz)
12
500
1000
Frequency (MHz)
1500
2000
Frequency (MHz)
Specifications and information are subject to change without notice
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com, www.TriQuint.com
Page 2 of 4 January 2008
EC1019B
Vcc
Icc = 70 mA
InGaP HBT Gain Block
Recommended Application Circuit
R4
Bias
Resistor
C4
Bypass
Capacitor
C3
0.018 µF
L1
RF Choke
RF IN
EC1019B
C1
Blocking
Capacitor
C2
Blocking
Capacitor
RF OUT
Reference
Designator
L1
C1, C2, C4
50
820 nH
.018 µF
Recommended Component Values
Frequency (MHz)
500
900
1900
2200
220 nH
68 nH
27 nH
22 nH
1000 pF
100 pF
68 pF
68 pF
Recommended Bias Resistor Values
2500
18 nH
56 pF
3500
15 nH
39 pF
Supply
Voltage
6V
7V
8V
9V
10 V
12 V
R1 value
16.4 ohms
30.7 ohms
45 ohms
59 ohms
74 ohms
102 ohms
Size
0805
1210
1210
2010
2010
2512
1. The proper values for the components are dependent upon the intended frequency of operation.
2. The following values are contained on the evaluation board to achieve optimal broadband performance:
Ref. Desig.
L1
C1, C2
C3
C4
R4
Value / Type
39 nH wirewound inductor
56 pF chip capacitor
0.018
μF
chip capacitor
Do Not Place
15
Ω
1% tolerance
Size
0603
0603
0603
0805
The proper value for R1 is dependent upon the supply
voltage and allows for bias stability over temperature.
WJ recommends a minimum supply bias of +6 V. A
1% tolerance resistor is recommended.
Typical Device S-Parameters
S-Parameters (V
device
= +4.7 V, I
CC
= 70 mA, T = 25
°C,
calibrated to device leads)
Freq (MHz)
S11 (dB)
S11 (ang)
S21 (dB)
S21 (ang)
S12 (dB)
S12 (ang)
S22 (dB)
S22 (ang)
50
500
1000
1500
2000
2500
3000
3500
4000
4500
5000
5500
6000
-23.95
-21.49
-18.50
-16.41
-16.74
-18.80
-18.23
-11.23
-10.23
-15.66
-15.34
-10.30
-8.84
-10.27
-53.11
-96.14
-136.32
-169.66
170.71
-170.30
156.68
101.48
57.53
96.95
75.00
47.92
21.26
20.93
20.23
19.32
18.38
17.40
16.26
15.62
14.56
14.06
12.53
12.25
11.61
177.77
159.51
141.23
124.62
110.93
95.50
86.90
73.24
67.04
52.87
44.96
30.08
22.08
-23.34
-23.02
-22.37
-21.62
-20.72
-19.86
-19.10
-18.20
-17.79
-17.02
-16.79
-16.32
-15.68
1.00
8.39
14.81
19.01
22.20
22.10
22.75
21.01
19.02
14.17
10.83
6.34
4.21
-19.31
-17.25
-14.71
-12.45
-10.32
-10.16
-10.15
-8.08
-6.62
-7.84
-8.00
-6.73
-5.91
-6.11
-58.78
-100.42
-132.99
-161.53
167.27
154.27
139.29
107.37
82.18
69.95
57.27
36.46
Device S-parameters are available for download off of the website at:
http://www.wj.com
Specifications and information are subject to change without notice
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com, www.TriQuint.com
Page 3 of 4 January 2008
EC1019B
InGaP HBT Gain Block
EC1019B-G Mechanical Information
This package is lead-free/Green/RoHS-compliant. The plating material on the leads is NiPdAu.It is compatible with both lead-free
(maximum 260
°C
reflow temperature) and leaded (maximum 245
°C
reflow temperature) soldering processes.
Outline Drawing
1019G
XXXX-X
Product Marking
The component will be marked with an
“1019G” designator with an alphanumeric lot
code on the top surface of the package. The
obsolete tin-lead package is marked with an
“1019”
designator
followed
by
an
alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
Land Pattern
ESD Rating:
Value:
Test:
Standard:
Class 1A
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260
°C
convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of this
device. Vias should use a .35mm (#80 / .0135”) diameter drill and
have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near the
part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in degrees.
Specifications and information are subject to change without notice
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