Heatsinks
HEATSINKS
Power Assemblies
DS5404-1.0 November 2000
The current range of heatsinks is illustrated with a brief
resumé of their characteristics. The products available are
intended for use with all our power semiconductors - from
the small stud base through to large disc devices and
modules.
All heatsinks are suitable for Natural Air Cooling (AN) and
Forced Air Cooling (FC). In addition to a vast experience of
AN and FC cooling methods we also have many years
experience in liquid and phase change cooling.
A range of coolers for 17mm to 100mm silicon diameter
devices is available, as is a range of associated clamps.
AIR COOLED HEATSINKS
All dimensions shown in mm unless stated otherwise.
0.5
0.48
THERMAL RESISTANCE (˚C/W)
0.15
THERMAL RESISTANCE (˚C/W)
0.46
0.44
0.42
0.4
0.38
0.36
0.34
0.32
0.3
125
175 225 275 325 375
HEATSINK LENGTH (mm)
200W
0.145
0.14
0.135
0.13
77.5
M8 slots
0.125
200W
0.12
125
165 205 245 285
HEATSINK LENGTH (mm)
27
175
Cross sectional area (cm
2
): 52.3
Weight kg/m: 141.2
Air natural
0.44
THERMAL RESISTANCE (˚C/W)
THERMAL RESISTANCE (˚C/W)
Forced air (5m/s)
0.1
Heatsink profile: ED
M6 slot
222
±
1
0.42
0.4
0.38
0.36
0.34
0.32
200 W
0.3
125
175 225 275 325 375
HEATSINK LENGTH (mm)
0.095
0.085
0.08
200W
50
0.075
125
175 225 275 325 375
HEATSINK LENGTH (mm)
Cross sectional area (cm
2
): 124.08
Weight kg/m: 31
Air natural
Forced air (5m/s)
Heatsink profile: EM
M8 slots
0.09
120
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Heatsinks
THERMAL RESISTANCE (˚C/W)
Notes:
1.
Thermal ratings are given per
heatsink.
2.
Comprehensive data is available
for all our heatsinks to support all
design applications.
3.
Black anodising is available on all
air cooled heatsinks for surface
protection and enhanced
performance.
1.4
1.3
1.2
1.1
M6 slots
67
0.9
0.8
0.7
0.6
60 80 100120140160180200220
HEATSINK LENGTH (mm)
80W
90
1.0
M8 slot
Cross sectional area (cm
2
): 26.21
Weight kg/m: 7.1
Air natural
Heatsink profile: EH
WATER COOLED HEATSINKS
Water cooled heatsinks are
designed for use in high
current, high power
assemblies such as single,
0.04
three or six phase bridges or
A.C. controllers. Complete
bridges of up to six devices
may be constructed.
2 heatsinks for double side
cooling, thermal resistance
heatsink surface to water
inlet.
All dimensions shown in mm
unless stated otherwise.
THERMAL RESISTANCE (˚C/W)
0.035
0.03
0.025
0.02
0.015
1
2
3
4
5
6
7
WATER FLOW (L/m)
8
9
10
Type code: D
0.03
THERMAL RESISTANCE (˚C/W)
0.028
0.026
0.024
0.022
0.02
0.018
0.016
0.014
0.012
1
2
3
4
5
6
7
WATER FLOW (L/m)
8
9
10
Type code: K
Note:
1.
For details of water connections, please contact factory.
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Heatsinks
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic
semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device
voltages and current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use
today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to
satisfy the growing needs of our customers.
Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly
Complete Solution (PACs).
DEVICE CLAMPS
Disc devices require the correct clamping force to ensure their safe operation. The PACS range includes a varied
selection of pre-loaded clamps to suit all of our manufactured devices. Types available include cube clamps for single
side cooling of ‘T’ 23mm and ‘E’ 30mm discs, and bar clamps right up to 83kN for our ‘Z’ 100mm thyristors and diodes.
Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies.
Please refer to our application note on device clamping, AN4839
HEATSINKS
The Power Assembly group has its own proprietary range of extruded aluminium heatsinks. They have been designed to
optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with
flow rates) is available on request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or
customer service office.
http://www.dynexsemi.com
e-mail: power_solutions@dynexsemi.com
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
Fax: 00-44-(0)1522-500550
DYNEX POWER INC.
Unit 7 - 58 Antares Drive,
Nepean, Ontario, Canada K2E 7W6.
Tel: 613.723.7035
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
CUSTOMER SERVICE CENTRES
Central Europe
Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 46 38 51 33.
North America
Tel: 011-800-5554-5554. Fax: 011-800-5444-5444.
UK, Scandinavia & Rest Of World
Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020.
SALES OFFICES
Central Europe
Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 46 38 51 33.
North America
Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (949) 733-3005. Fax: (949) 733-2986.
UK, Scandinavia & Rest Of World
Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020.
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2000 Publication No. DS5404-1 Issue No. 1.0 November 2000
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-
Target Information:
This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has
been started.
Preliminary Information:
The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information:
The product design is complete and final characterisation for volume production is well in hand.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor
to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product
or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide
only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability
of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose
failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
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