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TLP921

Description
Toshiba Photoreflective sensor Infrared LED + Phototransistor Inkjet printers ink-level monitoring
CategoryThe sensor    Sensor/transducer   
File Size172KB,8 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
Download Datasheet Parametric View All

TLP921 Overview

Toshiba Photoreflective sensor Infrared LED + Phototransistor Inkjet printers ink-level monitoring

TLP921 Parametric

Parameter NameAttribute value
MakerToshiba Semiconductor
Reach Compliance Codeunknow
Other features0.10V VCE, 0.10UA DARK CURRENT
body width4.1 mm
body height7.4 mm
Body length or diameter8 mm
Maximum measuring range (mm)8 mm
Minimum measuring range (mm)8 mm
Installation featuresTHROUGH HOLE MOUNT
Maximum working current20 mA
Output range0.58-2.60mA
Output typeANALOG CURRENT
Package Shape/FormRECTANGULAR
Response time38 µs
Sensor/Transducer TypeLINEAR POSITION SENSOR,PHOTOELECTRIC,DIFFUSE
Maximum supply voltage1.4 V
Minimum supply voltage1.25 V
surface mountNO
Termination typeSOLDER
TLP921
Toshiba Photoreflective sensor Infrared LED + Phototransistor
TLP921
Inkjet printer’s ink-level monitoring
TLP921 is a reflective photosensor combining a GaAs infrared LED with
a Si phototransistor.
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·
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Flush-mount package on PCB: Applied PCB thickness = 1.6 mm or
thinner
Positioning pin and single-sided screw-mount type
Short lead type: Lead length = 2.8 ± 0.3 mm
Phototransistor impermeable to visible light
Package material: polybutylene-terephthalate (UL94V-0, black)
Maximum Ratings
(Ta
=
25°C)
Characteristics
Forward current
Forward current derating
(Ta
>
25°C)
Reverse voltage
Collector-Emitter voltage
Emitter-Collector voltage
Detector
Collector power dissipation
Collector power dissipation
derating
(Ta
>
25°C)
Collector current
Operating temperature
Storage temperature
Soldering temperature
(5 s) (Note 1)
LED
Symbol
I
F
DI
F/
°C
V
R
V
CEO
V
ECO
P
C
DP
C/
°C
I
C
T
opr
T
stg
T
sol
Rating
50
-0.33
5
35
5
75
-1
50
-30~85
-40~100
260
Unit
mA
mA/°C
V
V
V
mW
mW/°C
mA
°C
°C
°C
JEDEC
JEITA
TOSHIBA
Weight: 0.35 g (typ.)
Note 1: Soldering is performed 1.5 mm from the bottom of the package.
Marking
Monthly lot
number
Month of
manufacture
Year of
manufacture
January to December
are denoted by letters
A to L respectively
Last decimal digit of
the year of
manufacture
1
2002-04-03

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