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W523A025

Description
high fidelity power speech
CategoryAnalog mixed-signal IC    Consumption circuit   
File Size776KB,19 Pages
ManufacturerWinbond Electronics Corporation
Websitehttp://www.winbond.com.tw
Download Datasheet Parametric View All

W523A025 Overview

high fidelity power speech

W523A025 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerWinbond Electronics Corporation
Parts packaging codeDIE
package instructionDIE, DIE OR CHIP
Contacts29
Reach Compliance Codeunknown
applicationVOICE SYNTHESIS; Q AND A GAMES; EDUTAINMENT TOYS
Commercial integrated circuit typesSPEECH SYNTHESIZER
JESD-30 codeR-XUUC-N29
JESD-609 codee0
Number of functions1
Number of terminals29
On-chip memory typeROM
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialUNSPECIFIED
encapsulated codeDIE
Encapsulate equivalent codeDIE OR CHIP
Package shapeRECTANGULAR
Package formUNCASED CHIP
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3/5 V
Certification statusNot Qualified
Maximum read time25 s
Maximum slew rate1 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)2.4 V
surface mountYES
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formNO LEAD
Terminal locationUPPER
Maximum time at peak reflow temperatureNOT SPECIFIED
W523AXXX
HIGH FIDELITY
PowerSpeech
TM
Table of Contents-
1.
2.
3.
4.
5.
GENERAL DESCRIPTION ......................................................................................................... 2
FEATURES ................................................................................................................................. 2
BLOCK DIAGRAM ...................................................................................................................... 3
PIN DESCRIPTION..................................................................................................................... 4
FUNCTIONAL DESCRIPTION.................................................................................................... 5
5.1
5.2
5.3
5.4
6.
6.1
6.2
6.3
7.
8.
Register Definition and Control........................................................................................ 5
Option Control Function................................................................................................... 8
Interrupt Vector Allocation ............................................................................................... 8
CPU Interface ................................................................................................................ 10
Absolute Maximum Ratings........................................................................................... 13
DC Characteristics......................................................................................................... 13
AC Characteristics......................................................................................................... 14
ELECTRICAL CHARACTERISTICS......................................................................................... 13
BONDING PAD DIAGRAM ....................................................................................................... 15
TYPICAL APPLICATION CIRCUIT........................................................................................... 17
8.1
8.2
DAC Output ................................................................................................................... 17
PWM Output .................................................................................................................. 18
9.
REVISION HISTORY ................................................................................................................ 19
-1-
Publication Release Date: May 20, 2003
Revision A3
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