5962-9218401MSA datasheet, PDF

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5962-9218401MSA: DescriptionBus Driver, ACT Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDFP20, CERPACK-20; Categorylogic logic; File Size273KB，20 Pages; Manufacturere2v technologies

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5962-9218401MSA Overview

Bus Driver, ACT Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDFP20, CERPACK-20

5962-9218401MSA Parametric

Parameter Name	Attribute value
Parts packaging code	DFP
package instruction	DFP, FL20,.3
Contacts	20
Reach Compliance Code	compliant
ECCN code	EAR99
Control type	ENABLE LOW
series	ACT
JESD-30 code	R-GDFP-F20
JESD-609 code	e0
Load capacitance (CL)	50 pF
Logic integrated circuit type	BUS DRIVER
MaximumI(ol)	0.024 A
Number of digits	4
Number of functions	2
Number of ports	2
Number of terminals	20
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output characteristics	3-STATE
Output polarity	INVERTED
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DFP
Encapsulate equivalent code	FL20,.3
Package shape	RECTANGULAR
Package form	FLATPACK
power supply	5 V
Prop。Delay @ Nom-Sup	9 ns
propagation delay (tpd)	9 ns
Certification status	Qualified
Filter level	MIL-STD-883
Maximum seat height	2.286 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
width	6.731 mm
Base Number Matches	1

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REVISIONS

LTR

DESCRIPTION

Changes in accordance with notice of revision (NOR) 5962-R108-93. - wlm

Update the boilerplate to current requirements as specified in MIL-PRF-38535.

Editorial changes throughout. – jak

Updated DC output current

, I

GND

) in section 1.3, add source of supply

information cage 0C7V7. Update the boilerplate paragraphs to current

requirements as specified in MIL-PRF-38535. – jwc

DATE (YR-MO-DA)

93-03-26

06-09-01

APPROVED

Monica L. Poelking

Thomas M. Hess

13-03-07

Thomas M. Hess

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

Wanda L. Meadows

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

CHECKED BY

Thomas J. Ricciuti

DLA LAND AND MARITIME

COLUMBUS, OHIO 43218-3990

http://www.landandmaritime.dla.mil

APPROVED BY

Monica L. Poelking

DRAWING APPROVAL DATE

93-02-08

MICROCIRCUIT, DIGITAL, ADVANCED

CMOS, BUFFER LINE/DRIVER WITH

INVERTING THREE-STATE OUTPUTS, TTL

COMPATIBLE INPUTS, MONOLITHIC

SILICON

SIZE

CAGE CODE

AMSC N/A

REVISION LEVEL

67268

SHEET

1 OF

5962-92184

5962-E252-13

DSCC FORM 2233

APR 97

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part

of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the

solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATION

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883 -

MIL-STD-1835 -

Test Method Standard Microcircuits.

Interface Standard Electronic Component Case Outlines.

DEPARTMENT OF DEFENSE HANDBOOKS

MIL-HDBK-103 -

MIL-HDBK-780 -

List of Standard Microcircuit Drawings.

Standard Microcircuit Drawings.

(Copies of these documents are available online at

https://assist.dla.mil/quicksearch/

or from the Standardization Document

Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein.

Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.

JEDEC – SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC)

JESD20 - Standard for Description of 54/74ACXXXX and 54/74ACTXXXX Advanced High-Speed

CMOS Devices.

(Copies of these documents are available online at http://www.jedec.org or from JEDEC – Solid State Technology

Association, 3103 North 10th Street, Suite 240–S, Arlington, VA 22201-2107.)

2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text

of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with

MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The

modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for

device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified

herein.

STANDARD

MICROCIRCUIT DRAWING

DLA LAND AND MARITIME

COLUMBUS, OHIO 43218-3990

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-92184

SHEET

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified

in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.

3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.

3.2.3 Truth table. The truth table shall be as specified on figure 2.

3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3.

3.2.5 Ground bounce waveforms and test circuit. The ground bounce waveforms and test circuit shall be as specified on

figure 4.

3.2.6 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 5.

3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the

electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full

case operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical

tests for each subgroup are defined in table I.

3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be

marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer

has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be

marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be

in accordance with MIL-PRF-38535, appendix A.

3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in

MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.

3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535

listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of

compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see

6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime -VA prior to listing as an approved source of

supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-

PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.

3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for

device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.

3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime -VA of change of

product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing.

3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritime 's agent,

and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore

documentation shall be made available onshore at the option of the reviewer.

3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in

microcircuit group number 37 (see MIL-PRF-38535, appendix A).

STANDARD

MICROCIRCUIT DRAWING

DLA LAND AND MARITIME

COLUMBUS, OHIO 43218-3990

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-92184

SHEET

5962-9218401MSA Related Products

	5962-9218401MSA	5962-9218401M2A	5962-9218401MRA
Description	Bus Driver, ACT Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDFP20, CERPACK-20	Bus Driver, ACT Series, 2-Func, 4-Bit, Inverted Output, CMOS, CQCC20, CERAMIC, LCC-20	Bus Driver, ACT Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDIP20, CERDIP-20
Parts packaging code	DFP	QLCC	DIP
package instruction	DFP, FL20,.3	CERAMIC, LCC-20	DIP, DIP20,.3
Contacts	20	20	20
Reach Compliance Code	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99
Control type	ENABLE LOW	ENABLE LOW	ENABLE LOW
series	ACT	ACT	ACT
JESD-30 code	R-GDFP-F20	S-CQCC-N20	R-GDIP-T20
JESD-609 code	e0	e0	e0
Load capacitance (CL)	50 pF	50 pF	50 pF
Logic integrated circuit type	BUS DRIVER	BUS DRIVER	BUS DRIVER
MaximumI(ol)	0.024 A	0.024 A	0.024 A
Number of digits	4	4	4
Number of functions	2	2	2
Number of ports	2	2	2
Number of terminals	20	20	20
Maximum operating temperature	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C
Output characteristics	3-STATE	3-STATE	3-STATE
Output polarity	INVERTED	INVERTED	INVERTED
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED
encapsulated code	DFP	QCCN	DIP
Encapsulate equivalent code	FL20,.3	LCC20,.35SQ	DIP20,.3
Package shape	RECTANGULAR	SQUARE	RECTANGULAR
Package form	FLATPACK	CHIP CARRIER	IN-LINE
power supply	5 V	5 V	5 V
Prop。Delay @ Nom-Sup	9 ns	9 ns	9 ns
propagation delay (tpd)	9 ns	9 ns	9 ns
Certification status	Qualified	Qualified	Qualified
Filter level	MIL-STD-883	MIL-STD-883	MIL-STD-883
Maximum seat height	2.286 mm	1.905 mm	5.08 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V
surface mount	YES	YES	NO
technology	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD
Terminal form	FLAT	NO LEAD	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	2.54 mm
Terminal location	DUAL	QUAD	DUAL
width	6.731 mm	8.89 mm	7.62 mm
Base Number Matches	1	1	1
Maker	-	e2v technologies	e2v technologies
length	-	8.89 mm	24.51 mm

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