The ML501 high linearity upconverter or downconverter
combines a passive GaAs MESFET mixer with an
integrated HBT LO driver in a low-cost lead-
free/green/RoHS-compliant SOIC-8 package.
WJ’s
ML501 uses patented techniques to realize +30 dBm Input
IP3 with 8 dB conversion loss using an LO drive level of 0
dBm in a downconverting application. The on-chip
diplexer in the mixers allows for good matching on the RF
and IF ports. The dual-stage LO driver provides a stable
input power level into the mixer to allow for consistent
performance over a wide range of LO power levels.
Typical applications include frequency up/down
conversion, modulation and demodulation for receivers and
transmitters used in 2.5G and 3G GSM/CDMA/WCDMA
systems in the PCS, or UMTS frequency bands. They can
also be used for WiBro/WiLAN/WiMAX infrastructure
requiring high linearity frequency conversion.
Functional Diagram
LO
1
8
RF
7
GND
6
GND
5
IF
The backside paddle is Ground.
GND
2
Vcc1
3
Vcc2
4
Applications
•
2.5/3G GSM/CDMA/WCDMA
•
PCS/UMTS-band Mobile
Infrastructure
•
WiBro / WiLAN / WiMAX
Specifications
(1)
Parameter
RF Frequency Range
LO Frequency Range
IF Frequency Range
SSB Conversion Loss
Input IP3
(2)
Input P1dB
LO – RF Isolation
(3)
LO – IF Isolation
(3)
RF – IF Isolation
Return Loss: RF Port
Return Loss: IF Port
Return Loss: LO Port
LO Drive Level
Supply Voltage
Operating Current
(4)
1.
2.
3.
4.
Units
MHz
MHz
MHz
dB
dBm
dBm
dB
dB
dB
dB
dB
dB
dBm
V
mA
Min
Typ
1900 – 2200
1600 – 2150
50 – 300
8
+30
+21
9
27
20
16
20
15
0
+5
110
Max
Min
Typ
2200 – 2400
1900 – 2350
50 – 300
8.1
+30
+20
8
27
21
17
20
12
0
+5
120
Max
Min
Typ
2400 – 2700
1900 – 2500
200 – 500
8.4
+28
+20
7
25
21
17
20
11
0
+5
130
Max
9
+28
-2.5
85
2.5
135
-2.5
2.5
-2.5
2.5
Min / max limits are tested for the mixer in downconverting application with a low-side LO at 0 dBm at 25 °C with RF/IF = 1900/50, 2200/50, and 1900/300 MHz.
IIP3 is measured with
Δf
= 1 MHz with RFin = 0 dBm / tone.
LO is injected with 0 dBm.
This refers to the operating current under LO drive. The current can be reduced by increasing the value of the R2 resistor slightly.
Absolute Maximum Rating
Parameter
Operating Case Temperature
Storage Temperature
DC Voltage
LO Power
Input IF / RF Power
-40 to +85
°C
-55 to +150 °C
+5.5 V
+10 dBm
+20 dBm
Rating
Ordering Information
Part No.
ML501-G
ML501-PCB
Description
1.9–2.7 GHz High IP3 Mixer w/ Integrated LO Amp
(lead-free/green/RoHS-compliant SOIC-8 package)
Full Assembled Evaluation Board
Specifications and information are subject to change without notice
Operation of this device above any of these parameters may cause permanent damage.
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
Page 1 of 4 June 2006
ML501
The Communications Edge
TM
Product Information
1.9–2.7 GHz High IP3 Mixer with Integrated LO Amp
Typical Downconversion Performance Plots
Performance using the circuitry on the ML501-PCB Evaluation Board
R1 is shown in the silkscreen but is not required for the ML501. A 0Ω jumper is placed in this spot on the PCB.
Conversion Loss vs RF Frequency vs IF Frequency
+25 °C, LO = 0 dBm, low-side LO
Input IP3 vs RF Frequency vs IF Frequency
+25 °C, LO = 0 dBm, low-side LO
10
Conversion Loss (dB)
34
Input IP3 (dBm)
32
30
28
26
24
1800
IF=50MHz
IF=150MHz
IF=250MHz
IF=100MHz
IF=200MHz
IF=300MHz
9
8
7
6
5
1800
IF=50MHz
IF=150MHz
IF=250MHz
1900
2000
2100
IF=100MHz
IF=200MHz
IF=300MHz
2200
2300
1900
2000
2100
2200
2300
RF Frequency (MHz)
Conversion Loss vs RF Frequency vs Temperature
LO = 0 dBm, IF = 50 MHz, low-side LO
RF Frequency (MHz)
Conversion Loss vs RF Frequency vs Temperature
LO = 0 dBm, IF = 250 MHz, low-side LO
Conversion Loss vs RF Frequency vs Temperature
LO = 0 dBm, IF = 150 MHz, low-side LO
10
Conversion Loss (dB)
Conversion Loss (dB)
9
8
7
6
-40 °C
+25 °C
+85 °C
10
10
Conversion Loss (dB)
9
8
7
6
-40 °C
+25 °C
+85 °C
9
8
7
6
-40 °C
+25 °C
+85 °C
5
1800
1900
2000
2100
2200
2300
5
1800
1900
2000
2100
2200
2300
5
1800
1900
2000
2100
2200
2300
RF Frequency (MHz)
Conversion Loss vs RF Frequency vs LO Power
+25 °C, IF = 50 MHz, low-side LO
RF Frequency (MHz)
Conversion Loss vs RF Frequency vs LO Power
+25 °C, IF = 150 MHz, low-side LO
RF Frequency (MHz)
Conversion Loss vs RF Frequency vs LO Power
+25 °C, IF = 250 MHz, low-side LO
10
Conversion Loss (dB)
Conversion Loss (dB)
9
8
7
6
5
1800
LO = -3 dBm
LO = 0 dBm
LO = 3 dBm
10
10
Conversion Loss (dB)
9
8
7
6
5
1800
LO = -3 dBm
LO = 0 dBm
LO = 3 dBm
9
8
7
6
5
1800
LO = -3 dBm
LO = 0 dBm
LO = 3 dBm
1900
2000
2100
2200
2300
1900
2000
2100
2200
2300
1900
2000
2100
2200
2300
RF Frequency (MHz)
RF Frequency (MHz)
RF Frequency (MHz)
Specifications and information are subject to change without notice
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
Page 2 of 4 June 2006
ML501
LO = 0 dBm, IF = 50 MHz, low-side LO
The Communications Edge
TM
Product Information
1.9–2.7 GHz High IP3 Mixer with Integrated LO Amp
Typical Downconversion Performance Plots (cont’d)
Performance using the circuitry on the ML501-PCB Evaluation Board
Input IP3 vs RF Frequency vs Temperature
Input IP3 vs RF Frequency vs Temperature
LO = 0 dBm, IF = 150 MHz, low-side LO
Input IP3 vs RF Frequency vs Temperature
LO = 0 dBm, IF = 250 MHz, low-side LO
34
Input IP3 (dBm)
Input IP3 (dBm)
32
30
28
26
-40 °C
+25 °C
+85 °C
34
34
Input IP3 (dBm)
32
30
28
26
-40 °C
+25 °C
+85 °C
32
30
28
26
-40 °C
+25 °C
+85 °C
24
1800
1900
2000
2100
2200
2300
24
1800
1900
2000
2100
2200
2300
24
1800
1900
2000
2100
2200
2300
RF Frequency (MHz)
Input IP3 vs RF Frequency vs LO Power
+25 °C, IF = 50 MHz, low-side LO
RF Frequency (MHz)
Input IP3 vs RF Frequency vs LO Power
+25 °C, IF = 150 MHz, low-side LO
RF Frequency (MHz)
Input IP3 vs RF Frequency vs LO Power
+25 °C, IF = 250 MHz, low-side LO
34
Input IP3 (dBm)
Input IP3 (dBm)
32
30
28
26
24
1800
LO = -3 dBm
LO = 0 dBm
LO = 3 dBm
34
34
Input IP3 (dBm)
32
30
28
26
24
1800
LO = -3 dBm
LO = 0 dBm
LO = 3 dBm
32
30
28
26
24
1800
LO = -3 dBm
LO = 0 dBm
LO = 3 dBm
1900
2000
2100
2200
2300
1900
2000
2100
2200
2300
1900
2000
2100
2200
2300
RF Frequency (MHz)
RF Return Loss vs LO Frequency
+25 °C, LO = 0 dBm
RF Frequency (MHz)
IF Return Loss vs IF Frequency
+25 °C, LO = 0 dBm
RF Frequency (MHz)
LO Return Loss vs LO Frequency
+25 °C
0
RF Return Loss (dB)
-5
-10
-15
-20
-25
1800
IF Return Loss (dB)
IF = 50 MHz
IF = 150 MHz
IF = 300 MHz
0
-5
-10
-15
-20
-25
1900
2000
2100
2200
2300
50
100
150
200
LO Return Loss (dB)
LO = 1750 MHz
LO = 1850 MHz
LO = 1950 MHz
0
-5
-10
-15
-20
-25
1500
250
300
1700
1900
2100
2300
RF Frequency (MHz)
L-R Isolation vs LO Frequency
Referenced with LO = 0 dBm
IF Frequency (MHz)
L-I Isolation vs LO Frequency
Referenced with LO = 0 dBm
LO Frequency (MHz)
R-I Isolation vs RF Frequency
25
L-R Isolation (dB)
20
15
10
5
-40 °C
+25 °C
+85 °C
35
30
25
20
15
-40 °C
+25 °C
+85 °C
25
R-I Isolation (dB)
20
15
10
5
-40 °C
+25 °C
+85 °C
0
1500
L-I Isolation (dB)
1700
1900
2100
2300
10
1500
1700
1900
2100
2300
0
1800
1900
2000
2100
2200
2300
LO Frequency (MHz)
LO Frequency (MHz)
Input P1dB vs RF Frequency
IF = 100 MHz, low-side LO at 0 dBm
RF Frequency (MHz)
22
Input P1dB (dBm)
20
18
16
14
12
1900
-40 °C
+25 °C
+85 °C
2100
2300
2500
2700
RF Frequency (MHz)
Specifications and information are subject to change without notice
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
Page 3 of 4 June 2006
ML501
The Communications Edge
TM
Product Information
1.9–2.7 GHz High IP3 Mixer with Integrated LO Amp
ML501-G Mechanical Information
This package is lead-free/green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free
(maximum 260
°C
reflow temperature) and lead (maximum 245
°C
reflow temperature) soldering processes.
Outline Drawing
Product Marking
The component will be lasermarked with a
“ML501-G”
product
label
with
an
alphanumeric lot code on the top surface of the
package.
Tape and reel specifications for this part will be
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating:
Value:
Test:
Standard:
ESD Rating:
Value:
Test:
Standard:
Class 1B
Passes 500V to <1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Class IV
Passes 1000V
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
MSL Rating: Level 2 at +260
°C
convection reflow
Standard:
JEDEC Standard J-STD-020
Functional Pin Layout
Mounting Configuration / Land Pattern
LO
1
8
RF
7
GND
6
GND
5
IF
The backside paddle is Ground.
GND
2
Vcc1
3
Vcc2
4
1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill
and have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
4. All dimensions are in millimeters (inches). Angles are in degrees.
5. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink.
6. RF trace width depends upon the PC board material and construction.
7. Use 1 oz. Copper minimum.
Pin
1
2
3
4
5
6
7
8
Function
LO
GND
Vcc1
Vcc2
IF
GND
GND
RF
Backside paddle is RF and DC ground.
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
Rating
-40 to +85
°C
104
°C
/ W
Specifications and information are subject to change without notice
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