The ECP052 is a high dynamic range driver amplifier in
a low-cost surface mount package. The InGaP/GaAs
HBT is able to achieve high performance for various
narrowband-tuned application circuits with up to +44
dBm OIP3 and +28.5 dBm of compressed 1dB power. It
is housed in an industry standard SOIC-8 or 16-pin
4x4mm QFN SMT package. All devices are 100% RF
and DC tested.
The ECP052 is targeted for use as a driver amplifier in
wireless infrastructure where high linearity and medium
power is required. An internal active bias allows the
ECP052 to maintain high linearity over temperature and
operate directly off a single +5V supply.
This
combination makes the device an excellent candidate for
transceiver line cards in current and next generation
multi-carrier 3G base stations.
Functional Diagram
Vbias
N/C
16
Vref 1
N/C 2
RF IN 3
N/C 4
5
N/C
6
N/C
7
N/C
8
N/C
15
N/C
14
N/C
13
12 N/C
11 RF OUT
10 RF OUT
9 N/C
ECP052D
Vref 1
8
Vbias
Applications
•
Final stage amplifiers for
Repeaters
•
Mobile Infrastructure
N/C 2
7
RF OUT
RF IN 3
6
RF OUT
N/C 4
5
N/C
ECP052G
Specifications
(1)
Parameter
Operational Bandwidth
Test Frequency
Gain
Output P1dB
Output IP3
(2)
Test Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3
(2)
IS-95A Channel Power
@ -45 dBc ACPR, 1960 MHz
Units Min
MHz
MHz
dB
dBm
dBm
MHz
dB
dB
dB
dBm
dBm
dBm
dB
mA
V
200
800
15.5
+27
+42.5
15.5
Typ
850
17
+28
+44
900
17.8
18
7
+28.7
+43
+23
7
250
+5
Max
1000
+27
+42.5
Noise Figure
Operating Current Range, Icc
(3)
Device Voltage, Vcc
300
1. Test conditions unless otherwise noted: 25ºC, Vsupply = +5 V, in tuned application circuit.
2. 3OIP measured with two tones at an output power of +11 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. This corresponds to the quiescent current or operating current under small-signal conditions into pins 6, 7, and 8. It is expected that the current can increase by an additional 50 mA at P1dB. Pin 1 is used as a
reference voltage for the internal biasing circuitry. It is expected that Pin 1 will pull 12mA of current when used with a series bias resistor of R1=100Ω. (ie. total device current typically will be 262 mA.)
Absolute Maximum Rating
Parameters
Operating Case Temperature
Storage Temperature
RF Input Power (continuous)
Device Voltage
Device Current
Device Power
-40 to +85
°C
-65 to +150
°C
+28 dBm
+8 V
400 mA
2W
Ordering Information
Part No.
ECP052D
ECP052G
ECP052D-PCB900
ECP052G-PCB900
Rating
Description
½ Watt InGaP HBT Amplifier (16p 4mm Pkg)
½ Watt InGaP HBT Amplifier (SOIC-8 Pkg)
900 MHz Evaluation Board
900 MHz Evaluation Board
Operation of this device above any of these parameters may cause permanent damage.
Specifications and information are subject to change without notice
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
August 2004
ECP052
40
The Communications Edge
TM
Product Information
½ Watt, High Linearity InGaP HBT Amplifier
Typical Device Data
S-Parameters (V
cc
= +5 V, I
cc
= 250 mA, T = 25°C, unmatched 50 ohm system)
Gain / Maximum Stable Gain
6
0.
S11
1.0
S22
1.0
6
0.
DB(|S[2,1]|)
35
30
Gain (dB)
0.2
0.
4
Swp Max
1GHz
2.
0
Swp Max
1GHz
2.
0
0
3.
0
4.
10.0
10.0
0.2
0.4
0.6
0.8
1.0
2.0
3.0
4.0
5.0
15
10
5
.0
-2
0
10.0
20
0.2
0.4
0.6
0.8
1.0
2.0
3.0
4.0
5.0
0
-0.8
-0.8
0
0.2
Notes:
The gain for the unmatched device in 50 ohm system is shown as the trace in black color. For a tuned circuit for a particular frequency,
it is expected that actual gain will be higher, up to the maximum stable gain. The maximum stable gain is shown in the dashed red line.
The return loss plots are shown from 50 – 1000 MHz, with markers placed at 0.2 – 1 GHz in 0.1 GHz increments.
S-Parameters (V
cc
= +5 V, I
cc
= 250 mA, T = 25°C, unmatched 50 ohm system, calibrated to device leads)
Freq (MHz)
S11 (dB)
S21 (dB)
S21 (ang)
S12 (dB)
S12 (ang)
S22 (dB)
S22 (ang)
50
100
200
400
600
800
1000
1200
1400
1600
1800
2000
2200
2400
2600
2800
3000
-2.72
-2.25
-2.31
-3.08
-5.79
-19.72
-6.06
-2.34
-1.28
-0.91
-0.71
-0.60
-0.58
-0.55
-0.51
-0.51
-0.54
24.16
20.33
17.23
15.63
15.58
15.22
11.91
6.92
2.28
-1.17
-4.40
-6.78
-8.70
-9.87
-10.59
-11.66
-13.08
133.35
124.95
119.37
98.28
69.70
25.60
-22.67
-56.59
-78.59
-96.56
-112.20
-128.36
-146.80
-169.80
160.74
128.82
95.01
-36.72
-35.31
-34.90
-33.62
-32.10
-31.19
-33.26
-38.16
-41.14
-42.62
-40.78
-40.27
-37.79
-39.90
-37.66
-35.78
-35.88
29.75
13.96
2.32
-16.36
-37.73
-78.95
-129.67
176.95
132.98
113.65
98.57
74.44
53.03
53.88
41.18
31.88
27.61
-2.23
-3.08
-3.32
-3.48
-2.87
-2.27
-1.40
-1.49
-1.96
-2.53
-2.92
-3.29
-3.72
-3.96
-3.25
-1.97
-1.09
-102.97
-137.03
-159.63
-172.70
-176.25
-179.74
173.15
165.12
160.84
160.80
157.57
155.77
155.24
158.19
160.80
158.05
149.64
Application Circuit PC Board Layout
Circuit Board Material: .014” Getek, 4 - layer, 1 oz copper, Microstrip line details: width = .026”, spacing = .026”
The silk screen markers ‘A’, ‘B’, ‘C’, etc. and ‘1’, ‘2’, ‘3’, etc. are used as placemarkers for the input and output tuning
Shunt capacitors – C8 and C9. The markers and vias are spaced in .050” increments.
Specifications and information are subject to change without notice
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
August 2004
-1.0
-1.0
0.4
0.6
Frequency (GHz)
0.8
1
-0
.6
-0
.6
.0
-2
0
.4
-0
.4
-0
Swp Min
0.05GHz
Swp Min
0.05GHz
-4
.0
-5.
0
-3
.0
-4
.0
-5.
0
2
-0.
2
-0.
-10.0
0.2
25
5.0
0.
4
DB(GMax)
0.8
0.8
0
3.
0
4.
5.0
10.0
-10.0
-3
.0
ECP052
Typical RF Performance at 25°C
Frequency
S21 – Gain
S11 – Input Return Loss
S22 – Output Return Loss
Output P1dB
Output IP3
(+11 dBm / tone, 1 MHz spacing)
The Communications Edge
TM
Product Information
½ Watt, High Linearity InGaP HBT Amplifier
900 MHz Application Circuit (ECP052G-PCB900)
900 MHz
17.5 dB
-18 dB
-7 dB
+28.7 dBm
+43 dBm
+23 dBm
7 dB
+5 V
250 mA
Channel Power
(@-45 dBc ACPR, IS-95 9 channels fwd)
Noise Figure
Device / Supply Voltage
Quiescent Current
S21 vs Frequency
20
18
S 2 1 (d B )
S 1 1 (d B )
16
14
12
10
840
+25°C
+85°C
-40°C
860
880
900
920
940
0
-5
-10
-15
-20
-25
-30
-35
840
860
S11 vs. Frequency
0
-5
-10
S 2 2 (d B )
-15
-20
-25
-30
940
-35
840
S22 vs. Frequency
+25°C
+85°C
-40°C
880
900
920
+25°C
+85°C
-40°C
860
880
900
920
940
Frequency (MHz)
Frequency (MHz)
Frequency (MHz)
Noise Figure vs. Frequency
10
8
P 1 d B (d B m )
N F (d B )
6
4
2
0
840
+25°C
+80°C
-40°C
860
880
900
920
940
20
840
860
30
28
26
24
22
P1 dB vs. Frequency
-40
-45
-50
-55
-60
-65
-70
-75
-80
18
19
ACPR vs. Channel Power
IS-95, 9 Ch. Fwd, ±885KHz Meas BW, 900 MHz
+25°C
+85°C
-40°C
A C P R (d B m )
+25°C
+85°C
-40°C
20
21
22
23
24
880
900
920
940
Frequency (MHz)
Frequency (MHz)
Output Channel Power (dBm)
OIP3 vs. Temperature
freq. = 900, 901 MHz, +13 dBm /tone
OIP3 vs. Output Power
freq. = 900, 901 MHz, +25°C
OIP3 vs. Frequency
+25°, +13 dBm / tone
45
43
O I P 3 (d B m )
45
O IP 3 (d B m )
45
43
41
39
37
35
840
43
O IP 3 (d B m )
41
39
37
35
-40
-15
10
35
Temperature (°C)
60
85
41
39
37
35
8
10
12
14
16
18
20
Output Power (dBm)
860
880
900
920
940
Frequency (MHz)
Specifications and information are subject to change without notice
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
August 2004
ECP052
The Communications Edge
TM
Product Information
½ Watt, High Linearity InGaP HBT Amplifier
ECP052G (SOIC-8 Package) Mechanical Information
Outline Drawing
Product Marking
The component will be marked with an
“ECP052G” designator with an alphanumeric
lot code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating:
Value:
Test:
Standard:
Class 1B
Passes between 500 and 1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +235° C convection reflow
Standard:
JEDEC Standard J-STD-020
Functional Diagram
1
8
2
7
3
6
Land Pattern
4
5
Function
Vref
Input
Output
Vbias
GND
N/C or GND
Pin No.
1
3
6, 7
8
Backside Paddle
2, 4, 5
Mounting Config. Notes
1.
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
(1)
Junction Temperature, Tjc
(2)
2.
MTTF vs. GND Tab Temperature
100000
-40 to +85° C
62° C / W
162° C
MTTF (million hrs)
Rating
3.
4.
10000
5.
Notes:
1. The thermal resistance is referenced from the junction-
to-case at a case temperature of 85° C. Tjc is a function
of the voltage at pins 6 and 7 and the current applied to
pins 6, 7, and 8 and can be calculated by:
Tjc = Tcase + Rth * Vcc * Icc
2. This corresponds to the typical biasing condition of +5V,
250 mA at an 85° C case temperature. A minimum
MTTF of 1 million hours is achieved for junction
temperatures below 247° C.
1000
6.
7.
8
100
60
70
80
90
100
110
120
Tab Temperature (°C)
A heatsink underneath the area of the PCB for the mounted
device is strictly required for proper thermal operation.
Damage to the device can occur without the use of one.
Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80 / .0135”)
diameter drill and have a final plated thru diameter of .25
mm (.010”).
Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
Do not put solder mask on the backside of the PC board in
the region where the board contacts the heatsink.
RF trace width depends upon the PC board material and
construction.
Use 1 oz. Copper minimum.
All dimensions are in millimeters (inches). Angles are in
degrees.
Specifications and information are subject to change without notice
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
August 2004
ECP052
The Communications Edge
TM
Product Information
½ Watt, High Linearity InGaP HBT Amplifier
ECP052D (16-pin 4x4mm Package) Mechanical Information
Outline Drawing
Product Marking
The component will be marked with an
“ECP052D” designator with an alphanumeric
lot code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating:
Value:
Test:
Standard:
Class 1B
Passes between 500 and 1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Land Pattern
0.25mm DIA. THERMAL GROUND VIA HOLE VIAS ARE PLACED
ON A 0.65mm GRID. VIAS ARE TO BE CONNECTED TO TOP,
BOTTOM, AND INTERNAL GROUND PLANES IN ORDER TO
MAXIMIZE HEAT DISSIPATION. FOR .031" THK FR4 MATERIAL,
VIA BARREL PLATING TO BE MIN. 0.0014 THICK. VIAS TO BE
PLUGGED WITH EITHER CONDUCTIVE OR NON-CONDUCTIVE
EPOXY TO PREVENT SOLDER. DRAINS THROUGH VIA IN
REFLOW PROCESS
GROUND PLANE AREA FOR VIAS
2.23mm X 2.23mm
DEVICE GROUND PAD
2.0mm X 2.0mm
RECOMMENDED PAD
0.76mm X 0.34mm
SOLDERMASK SWELL TO BE 0.5mm
FROM OUTSIDE EDGE OF ALL PADS
TYP.
4.00mm
MSL Rating: Level 3 at +235° C convection reflow
Standard:
JEDEC Standard J-STD-020
Functional Diagram
Vbias
N/C
N/C
14
16
Vref 1
N/C 2
RF IN 3
N/C 4
5
N/C
6
N/C
7
N/C
8
N/C
15
N/C
13
12 N/C
11 RF OUT
10 RF OUT
9 N/C
0.65mm
TYP.
16L 4.0mm X 4.0mm PACKAGE
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
(1)
Junction Temperature, Tjc
(2)
MTTF vs. GND Tab Temperature
100000
Function
Vref
RF Input
RF Output
Vbias
GND
N/C or GND
Pin No.
1
3
10, 11
16
Backside Paddle
2, 4-9, 12-15
-40 to +85° C
62° C / W
162° C
MTTF (million hrs)
Rating
10000
Mounting Config. Notes
1.
2.
A heatsink underneath the area of the PCB for the mounted
device is strictly required for proper thermal operation.
Damage to the device can occur without the use of one.
Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80 / .0135”)
diameter drill and have a final plated thru diameter of .25
mm (.010”).
Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
Do not put solder mask on the backside of the PC board in
the region where the board contacts the heatsink.
RF trace width depends upon the PC board material and
construction.
Use 1 oz. Copper minimum.
All dimensions are in millimeters (inches). Angles are in
degrees.
Notes:
1. The thermal resistance is referenced from the junction-
to-case at a case temperature of 85° C. Tjc is a function
of the voltage at pins 10 and 11 and the current applied
to pins 10, 11, and 16 and can be calculated by:
Tjc = Tcase + Rth * Vcc * Icc
2. This corresponds to the typical biasing condition of +5V,
250 mA at an 85° C case temperature. A minimum
MTTF of 1 million hours is achieved for junction
temperatures below 247° C.
1000
100
60
70
80
90
100
110
120
3.
4.
Tab Temperature (°C)
5.
6.
7.
8
Specifications and information are subject to change without notice
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