Freescale Semiconductor
Technical Data
MPXV7007G
Rev 0, 05/2005
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
The MPXV7007G series piezoresistive transducers are state-of-the-art
monolithic silicon pressure sensors designed for a wide range of applications, but
particularly those employing a microcontroller or microprocessor with A/D inputs.
This transducer combines advanced micromachining techniques, thin-film
metallization, and bipolar processing to provide an accurate, high level analog
output signal that is proportional to the applied pressure.
Features
•
•
•
•
•
•
5.0% Maximum Error over 0° to 85°C
Ideally Suited for Microprocessor or Microcontroller-Based Systems
Thermoplastic (PPS) Surface Mount Package
Temperature Compensated over –40° to +125°C
Patented Silicon Shear Stress Strain Gauge
Available in Differential and Gauge Configurations
MPXV7007G
SERIES
INTEGRATED
PRESSURE SENSOR
-7 to 7 kPa (-1 to 1 psi)
0.5 to 4.5 V OUTPUT
SMALL OUTLINE PACKAGE
MPXV7007GC6U
CASE 482A-01
Typical Applications
•
•
•
•
Hospital Beds
HVAC
Respiratory Systems
Process Control
ORDERING INFORMATION
Device
Type
Options
Case
No.
MPX Series
Order No.
Packing
Options
Device
Marking
1
2
Rails
MPXV7007G
3
4
MPXV7007GP
CASE 1369-01
MPXV7007DP
CASE 1351-01
SMALL OUTLINE PACKAGE
PIN NUMBERS
(1)
N/C
V
S
Gnd
V
out
5
6
7
8
N/C
N/C
N/C
N/C
SMALL OUTLINE PACKAGE (MPXV7007G SERIES)
Ported Gauge, Axial Port, SMT
Elements
Gauge, Axial Port, SMT
Gauge, Side Port, SMT
Gauge, Dual Port, SMT
482A
482A
1369
1351
MPXV7007GC6U
MPXV7007GC6T1 Tape & MPXV7007G
Reel
MPXV7007GP
MPXV7007DP
Trays MPXV7007G
Trays MPXV7007G
V
S
1. Pins 1, 5, 6, 7, and 8 are internal device
connections. Do not connect to external
circuitry or ground. Pin 1 is noted by the
notch in the lead.
Sensing
Element
Thin Film
Temperature
Compensation
and
Gain Stage #1
Gain Stage #2
and
Ground
Reference
Shift Circuitry
V
out
GND
Pins 1 and 5 through 8 are NO CONNECTS
for surface mount package
Figure 1. Fully Integrated Pressure Sensor Schematic
© Freescale Semiconductor, Inc., 2005. All rights reserved.
Table 1. Maximum Ratings
(1)
Rating
Maximum Pressure (P1
>
P2)
Storage Temperature
Operating Temperature
Symbol
P
max
T
stg
T
A
Value
75
–40 to +125
–40 to +125
Unit
kPa
°C
°C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Table 2. Operating Characteristics
(
V
S
= 5.0 Vdc, T
A
= 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in
Figure 3 required to meet specification.)
Characteristic
Pressure Range
(1)
Supply Voltage
(2)
Supply Current
Minimum Pressure Offset
(3)
@ V
S
= 5.0 Volts
Full Scale Output
(4)
@ V
S
= 5.0 Volts
Full Scale Span
(5)
@ V
S
= 5.0 Volts
Accuracy
(6)
Sensitivity
Response Time
(7)
Output Source Current at Full Scale Output
Warm-Up Time
(8)
Offset Stability
(9)
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range.
3. Offset (V
off
) is defined as the output voltage at the minimum rated pressure.
4. Full Scale Output (V
FSO
) is defined as the output voltage at the maximum or full rated pressure.
5. Full Scale Span (V
FSS
) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
6. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
• TcSpan:
Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
• TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to
25°C.
• Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of V
FSS
, at 25°C.
7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
(0 to 85°C)
Symbol
P
OP
V
S
I
o
V
off
Min
-7
4.75
—
0.33
Typ
—
5.0
7.0
0.5
Max
+7
5.25
10
0.67
Unit
kPa
Vdc
mAdc
Vdc
(0 to 85°C)
V
FSO
4.3
4.5
4.7
Vdc
(0 to 85°C)
V
FSS
—
4.0
—
Vdc
(0 to 85°C)
—
V/P
t
R
I
O+
—
—
—
—
—
—
—
—
—
286
1.0
0.1
20
±0.5
±5.0
—-
—-
—-
—-
—-
%V
FSS
mV/kPa
ms
mAdc
ms
%V
FSS
MPXV7007G
2
Sensors
Freescale Semiconductor
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
The performance over temperature is achieved by
integrating the shear-stress strain gauge, temperature
compensation, calibration and signal conditioning circuitry
onto a single monolithic chip.
Figure 2
illustrates the Differential or Gauge configuration
in the basic chip carrier (Case 482). A fluorosilicone gel
isolates the die surface and wire bonds from the environment,
while allowing the pressure signal to be transmitted to the
sensor diaphragm.
The MPXV7007G series pressure sensor operating
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
Figure 3
shows the recommended decoupling circuit for
interfacing the integrated sensor to the A/D input of a
microprocessor or microcontroller. Proper decoupling of the
power supply is recommended.
Figure 4
shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in
Figure 3.
The output will saturate outside of the specified pressure
range.
Fluoro Silicone
Gel Die Coat
P1
Wire Bond
Lead
Frame
Die
Stainless
Steel Cap
+5 V
Thermoplastic
Case
V
out
V
s
IPS
1.0
µF
0.01
µF
GND
OUTPUT
470 pF
P2
Differential Sensing
Element
Die Bond
Figure 2. Cross-Sectional Diagram SOP
(not to scale)
Figure 3. Recommended Power Supply Decoupling
and Output Filtering
(For additional output filtering, please refer to
Application Note AN1646.)
5.0
4.5
4.0
3.5
3.0
Output (V)
2.5
2.0
1.5
1.0
0.5
0
-7
0
Differential Pressure (kPa)
7
MAX
MIN
TYPICAL
Transfer Function:
V
out
= V
S
*(0.057*P+0.5) ± ERROR
V
S
= 5.0 Vdc
TEMP = 0 to 85°C
Figure 4. Output versus Pressure Differential
MPXV7007G
Sensors
Freescale Semiconductor
3
Transfer Function (MPXV7007G)
Nominal Transfer Value:
V
out
= V
S
x (0.057 x P + 0.5)
± (Pressure Error x Temp. Factor x 0.057 x V
S
)
V
S
= 5.0 V
±
0.25 Vdc
Temperature Error Band
MPXV7007G SERIES
4.0
3.0
Temperature
Error
Factor
2.0
1.0
0.0
–40
–20
0
20
40
60
80
100
120
140
Temperature in °C
NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C.
Temp
–40
0 to 85
+125
Multiplier
3
1
3
Pressure Error Band
0.5
0.4
0.3
Pressure
Error
(kPa)
0.2
0.1
0
–0.1
–0.2
–0.3
–0.4
–0.5
Pressure
- 7 to 7 (kPa)
Error (Max)
±0.5 (kPa)
-7
0
+7
Pressure (kPa)
MPXV7007G
4
Sensors
Freescale Semiconductor
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluoro silicone gel
which protects the die from harsh media. The MPX pressure
Part Number
MPXV7007GC6U/C6T1
MPXV7007GP
MPXV7007DP
sensor is designed to operate with positive differential
pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below:
Case Type
482A
1369
1351
Pressure (P1)
Side Identifier
Side with Port Attached
Side with Port Attached
Side with Part Marking
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must
be the correct size to ensure proper solder connection
interface between the board and the package. With the
correct footprint, the packages will self align when subjected
to a solder reflow process. It is always recommended to
design boards with a solder mask layer to avoid bridging and
shorting between solder pads.
0.660
16.76
0.100 TYP 8X
2.54
0.060 TYP 8X
1.52
0.300
7.62
0.100 TYP 8X
2.54
inch
mm
SCALE 2:1
Figure 5. Small Outline Package Footprint
MPXV7007G
Sensors
Freescale Semiconductor
5
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