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825702B05300

Description
Heat shrink 8.9 T/R TO-220 11.9 X 33 X 36.8
CategoryThermal management products   
File Size386KB,1 Pages
ManufacturerComair Rotron
Environmental Compliance
Download Datasheet View All

825702B05300 Overview

Heat shrink 8.9 T/R TO-220 11.9 X 33 X 36.8

Board Level
Heat Sinks
P/N: 825702B05300
-
220
TO-
220
-
220
-
220
PRODUCT SPECIFICATIONS
• Devices: TO-220
• Size: 11.9 x 33.0 x 36.8 mm
• Material: Aluminum, 1.2 mm thick
• Type: Stamped
• Finish: Black Anodized
• PCB Mounting: Solderable Tabs
• IC Mounting: Integrated Spring
• Package: Bulk
• Accessories: Hardware & Thermal Interface
Material
Air Velocity - LFM
0
100
Temp Rise Above Ambient -
o
C
(Mounting Surface)
80
60
40
20
0
200
400
600
800
1000
10
8
6
4
2
0
0
2
4
6
8
10
Heat Dissipated - Watts
Thermal Resistance -
o
C / Watt
(Mounting Surface to Ambient)
FEATURES & BENEFITS
• Multiple Holes for Device Attachment
• Vertical Mounting via Solderable Tabs
• RoHS Compliant
CUSTOMIZED HEATSINKS
• Specialized Tabs, Plating
• Specialized Body Configurations
• Contact Applications Engineering
COMAIR ROTRON, INC
8929 Terman Court, San Diego, CA 92121
Ph (858) 348-6200 Fax (858) 566-4577
E-mail: sales@comairrotron.com,
Web: www.comairrotron.com

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Index Files: 302  2584  2012  2035  2795  7  53  41  57  46 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
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