86749 Nickel/Copper
Innovative
Technology
for a
Connected
World
Fabric Tape
NI/CU POLYESTER CONDUCTIVE FABRIC TAPE
Laird Technologies’ Conductive Fabric Tape 86749 offers exceptional conformability and
conductivity for dynamic flex applications. It is constructed of nickel/copper metallized fabric with
a conductive pressure sensitive adhesive (PSA). This reliable tape design provides outstanding
shielding performance while offering superior abrasion and corrosion resistance under high
dynamic flex conditions. The 86749 is a halogen free product and can be supplied in tape or
further customized to application by die-cutting or hole punching.
FEATURES
• RoHS compliant
• Halogen-free per IEC-61249-2-21 standard
• Low surface resistivity of < 0.06 Ω/□
provides excellent conductivity
• Shielding effectiveness of >62 dB across
a wide spectrum of frequencies
MARKETS
• Cabinet applications
• LCD and Plasma TV
• Medical equipment
• Servers
• Printers
• Laptop computers
global
solutions:
local
support
USA: +1.866.928.8181
Europe: +49.0.8031.2460.0
Asia: +86.755.2714.1166
TM
www.lairdtech.com
86749 Nickel/Copper
Fabric Tape
Test Method
-
PSTC 101*
PSTC 107
#
PSTC 107
#
Innovative
Technology
for a
Connected
World
Item
Thickness
Peel Adhesion
Shear Adhesion
at R.T.
at 80°C
Tensile Strength
Operation Temperature
Surface Resistivity (Fabric Side)
Z-axial Resistance
Shielding Effectiveness
+
at 100 MHz
at 1GHz
Package Dimensions
(Max. Width: 1000 mm)
Shelf Life (Under 23°C/65% R.H.)
dB
dB
M
62
68
W: Dimension by Customer Spec
L: Standard Length of 20 M
Six Months
Hrs
Hrs
Kgf / 25 mm
°C
Ω/□
Ω
>72
>5
>7
0-80
<0.06
<0.04
ASTM D4935
ASTM F390
Unit
mm
Kgf / 25 mm
Value
0.060 mm ± 0.01
>0.8
*:Test Method A, dwell time 30 min. #:Contact area 25 mm by 25 mm +:Typical value
COMPOSITION OF PRODUCT
Conductive layer (metallized fabric)
Adhesive layer (acrylic conductive pressure sensitive adhesive)
Release paper
APPLICATION TECHNIQUES
1. Bond strength is dependent upon the amount of adhesive-to-surface contact developed.
Firm application pressure develops better adhesive contact & thus improves bond strength.
2. To obtain optimum adhesion, the bonding surfaces must be clean, dry and well unified.
A typical surface cleaning solvent is isopropyl alcohol. Use proper safety precautions for
handling solvents.
3. Ideal tape application temperature range is 21°C to 38°C. Initial tape application to surfaces
at temperatures below 10°C is not recommended because the adhesive becomes too firm to
adhere readily. However, once properly applied, low temperature holding is generally satisfactory.
EMI-DS-FOF-86749 1112
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of
Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non-infringement of any Laird Technologies materials or products for
any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and
Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2012 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies
Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein
provides a license under any Laird Technologies or any third party intellectual property rights.
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