TYPE
PRODUCT SPECIFICATION
NUMBER
PAGE
GS-12-175
1 OF 7
REV: B
DATE
05/20/'04
TITLE
SMART PLUS B CONNECTOR
1.0 OBJECTIVE
AUTHORIZED BY
KENNY TAI
1.1 This specification defines the performance, test, quality and reliability requirements of the
smart card connector product.
2.0 SCOPE
This specifies is applicable to the termination characteristics of the smart card connector
family of products which provides interconnection between smart card printed wiring boards.
3.0 GENERAL
This document is composed of the following sections :
1.0 Objective
2.0 Scope
3.0 General
4.0 Applicable Documents
5.0 Requirements
5.1 Qualification
5.2 Material
5.3 Finish
5.4 Design and Construction
6.0 Electrical Characteristics
7.0 Mechanical characteristics
8.0 Environmental Conditions
9.0 Quality assurance provisions
9.1 Equipment Calibration
9.2 Inspection Conditions
9.3 Sample Quantity and Description
9.4 Acceptance
9.5 Qualification Testing
E-3005 REV 4/7/93
9.6 Requalification Testing
10.0 Reference Documents
TABLE 1
Qualification testing matrix
NOTE THIS DOCUMENT IS THE PROPERTY OF AND EMBODIES PROPRIETARY INFORMATION OF THE BERG ELECTRONICS COMPANY.
NO PART OF THE INFORMATION SHOWN ON THIS DOCUMENT MAY BE USED IN ANY WAY WITHOUT THE WRITTEN CONSENT OF BERG ELECTRONICS.
PDM: Rev:B
STATUS:
Released
Printed: Nov 28, 2010
.
TYPE
PRODUCT SPECIFICATION
NUMBER
PAGE
GS-12-175
2 OF 7
REV: B
DATE
05/20/'04
TITLE
SMART PLUS B CONNECTOR
4.0 APPLICABLE DOCUMENTS
4.1 Specifications
4.1.1 Engineering drawings 55640
4.2 Other Standards and Specifications
4.2.1 UL94-HB: Flammability
AUTHORIZED BY
KENNY TAI
4.2.2 EIA 364: Electrical Connector/Socket Test Procedures Including Environmental
Classifications.
4.2.3 ANSI-J-002: Joint Industry Standard, Solderability Test for Component Leads,
Terminations, Lugs, and Terminals and Wires.
4.2.4 IEC 68-2: International Electrotechnical Commission for Environmental testing.
4.2.5 ISO 7816: Smart card standard
4.3 FCI Specifications
VGN 11428/A
BUS-02-055; BUS-02-056; BUS-02-057; BUS-02-058
5.0 REQUIREMENT
5.1 Qualification
Connectors furnished under this specification shall be capable of meeting the qualification
test requirements specified herein.
5.2 Material
The material for each component shall be as specified herein or equivalent. Reference
BUS-02-055; BUS-02-056; and BUS-02-058.
5.2.1 Terminal: The base material shall be phosphor bronze.
5.2.2 Insulating Housing: The insulators shall be high performance PCB that are
rated 94V-0 or better in accorclance with UL-94.
5.3 Finish
The finish for applicable components shall be as specified herein or equivalent.
Reference BUS-02-057.
E-3005 REV 4/7/93
5.3.1 Terminals Contact coating ( 0.8
µm
Gold), over 1.3µm Nickel.
5.4 Design and Construction
Connectors shall be of the design, construction, and physical dimensions specified on the
applicable product drawing and the card standard described in ISO 7816, GSM 11.11
NOTE THIS DOCUMENT IS THE PROPERTY OF AND EMBODIES PROPRIETARY INFORMATION OF THE BERG ELECTRONICS COMPANY.
NO PART OF THE INFORMATION SHOWN ON THIS DOCUMENT MAY BE USED IN ANY WAY WITHOUT THE WRITTEN CONSENT OF BERG ELECTRONICS.
PDM: Rev:B
STATUS:
Released
Printed: Nov 28, 2010
.
TYPE
PRODUCT SPECIFICATION
NUMBER
PAGE
GS-12-175
3 OF 7
REV: B
DATE
05/20/'04
TITLE
SMART PLUS B CONNECTOR
6.0 ELECTRICAL CHARACTERISTICS
AUTHORIZED BY
KENNY TAI
6.1 Contact Resistance, Low Level (LLCR) - The low level Loop contact resistance shall not exceed
200 mΩ (reference Drawing No. 1) ( 200 mΩ after environmental exposure ) when measured in
accordance with EIA 364-23. Single terminal contact resistance shall not exceed 20 mΩ
(reference
Drawing No.2) The following details shall apply:
a. Method of Connection - The resistance shall be measured from the card contacts
to a point on the PCB as near the solder tail as possible.
b. Test Voltage - 20 millivolts DC max open circuit.
c. Test Current - Not to exceed 100 milliamperes.
6.2 Insulation Resistance - The insulation resistance of connectors shall not be less than 1000 megohms
after environmental exposure when measured in accordance with EIA 364-21. The following
details shall apply:
a. Test Voltage - 500 volts DC.
b. Electrification Time - 1 minutes, unless otherwise specified.
c. Points of Measurement - Between adjacent contacts.
7.0 MECHANICAL CHARACTERISTICS
7.1 Mating/Unmating Force - The force to insert the card is n500g~700g. The force to pull the
card out is 500g ~ 700g.
7.2 Normal Force - The single terminal contact normal force is 15g ~ 25g when tested in accordance
with FCI Test Specification BUS-03-404.
7.3 Peeling Force - The FPC horzontal peeling force exceed 8.5kg, vertical peeling force exceed
1.8 kg.
8.0 ENVIRONMENTAL CONDITIONS
After exposure to the following environmental conditions in accordance with the specified test
procedure and/or details, the product shall show no physical damage and shall meet the electrical
and mechanical requirements per paragraphs 6.0 and 7.0 as shecified in the Table 1 test sequences.
Unless specified otherwise, assemblies shall be mated during exposure.
E-3005 REV
4/7/93
8.1 Thermal shock :-40℃ to 85℃ (0.5 hour - 6 times)
Isulation resistance 1000mΩ
MIN.
8.2 Humidity, Steady State test : 40℃-95%-96 hours
Isulation resistance 1000mΩ
MIN.
IEC 68-2-14
Requirement- After test Contact resistance change from initial value : 20 mΩMAX
MIL-STD-202F 103B
NOTE THIS DOCUMENT IS THE PROPERTY OF AND EMBODIES PROPRIETARY INFORMATION OF THE BERG ELECTRONICS COMPANY.
NO PART OF THE INFORMATION SHOWN ON THIS DOCUMENT MAY BE USED IN ANY WAY WITHOUT THE WRITTEN CONSENT OF BERG ELECTRONICS.
PDM: Rev:B
STATUS:
Released
Printed: Nov 28, 2010
.
TYPE
PRODUCT SPECIFICATION
NUMBER
PAGE
GS-12-175
4 OF 7
REV: B
DATE
05/20/'04
TITLE
SMART PLUS B CONNECTOR
8.3 High Temperature Life test : 85℃/250 hours
8.4 Salt spray : 2 days
8.5 Cold exposure test : 2℃/2 hours
AUTHORIZED BY
KENNY TAI
MIL-STD-202F 108
IEC 68-2-11
Requirement- After test contact resistance change from initial value: 20mΩ MAX
Requirement- After test contact resistance change from initial value: 20mΩ MAX
Requirement- After test contact resistance change from initial value: 20mΩ MAX
8.6 Durability - Standard laboratory procedure as applicable to the specific product.
a. Number Cycles - 10000 cycles.
b. Cycling Rate - 400~600 cycles per hour
Requirement- .No physical or mechanical damage which affects connector function.
.After test contact resistance change from initial value: 20mΩ MAX
8.7 Vibration operational test: MIL-STD-202 Method 204D Test condition B 15G, 10-2000 Hz.
The test has to be made with the customer device to have a global set.
Requirement - No physical or mechanical damage or dissassociation of parts.
No discontinuity greater than 100 nanoseconds.
8.8 Shock test:
MIL-STD-202 Method 213B 50G, 1msec. Semi-Sine wave
No discontinuity greater than 100 nanoseconds.
9.0 QUALITY ASSURANCE PROVISIONS
9.1 Equipment Calibration
All test equipment and inspection facilities used in the performance of any test shall
be maintained in a calibration system in accordance with MIL-C-45662 and QS 9000.
9.2 Inspection Conditions
Unless otherwise specified herein, all inspections shall be performed under the following
ambient conditions:
a. Temperature: 25 +/- 5 deg C
E-3005 REV 4/7/93
Requirement - No physical or mechanical damage or dissassociation of parts.
b. Relative Humidity: 30% to 60%
c. Barometric Pressure: Local ambient
9.3 Sample Quantity And Description
See Table 1
NOTE THIS DOCUMENT IS THE PROPERTY OF AND EMBODIES PROPRIETARY INFORMATION OF THE BERG ELECTRONICS COMPANY.
NO PART OF THE INFORMATION SHOWN ON THIS DOCUMENT MAY BE USED IN ANY WAY WITHOUT THE WRITTEN CONSENT OF BERG ELECTRONICS.
PDM: Rev:B
STATUS:
Released
Printed: Nov 28, 2010
.
TYPE
PRODUCT SPECIFICATION
NUMBER
PAGE
GS-12-175
5 OF 7
REV: B
DATE
05/20/'04
TITLE
SMART PLUS B CONNECTOR
9.4 Acceptance
AUTHORIZED BY
KENNY TAI
9.4.1 Electrical and mechanical requirements placed on test samples as indicated in
paragraphs 6.0 and 7.0 shall be established from test data using appropriate
statistical techniques or shall otherwise be customer specified, and all samples
tested in accordance with this product specification shall meet the stated
requirements.
9.4.2 Failures attributed to equipment, test setup, or operator error shall not disqualify
the product. If product failure occurs, corrective action shall be taken and
samples resubmitted for qualification.
9.5 Qualification Testing
Qualification testing shall be performed on sample units produced with equipment and
procedures normally used in production. The test sequence shall be as shown in Table 1.
9.6 Requalification Testing
If any of the following conditions occur, the responsible product engineer shall initiate
requalification testing consisting of all applicable parts of the qualification test matrix
Table 1.
a. A significant design change is made to the existing product which impacts the
product form, fit or function. Examples of significant changes shall include
but not be limited to, changes in the plating material composition or thickness
contact force, contact surface geometry, insulator design, contact base
material, or contact lubrication requirements.
b. A significant change is made to the manufacturing process which impacts the
product form, fit or function.
c. A significant event occurs during production or end use requiring corrective
action to be taken relative to the product design or manufacturing process.
E-3005 REV 4/7/93
NOTE THIS DOCUMENT IS THE PROPERTY OF AND EMBODIES PROPRIETARY INFORMATION OF THE BERG ELECTRONICS COMPANY.
NO PART OF THE INFORMATION SHOWN ON THIS DOCUMENT MAY BE USED IN ANY WAY WITHOUT THE WRITTEN CONSENT OF BERG ELECTRONICS.
PDM: Rev:B
STATUS:
Released
Printed: Nov 28, 2010
.
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