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FX10B-100P-10-SV171

Description
Board to Board u0026 Mezzanine Connectors HDR 100POS W/O POST SMT
CategoryThe connector   
File Size1022KB,20 Pages
ManufacturerHirose
Websitehttp://www.hirose-connectors.com/
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FX10B-100P-10-SV171 Overview

Board to Board u0026 Mezzanine Connectors HDR 100POS W/O POST SMT

FX10B-100P-10-SV171 Parametric

Parameter NameAttribute value
Product CategoryBoard to Board & Mezzanine Connectors
ManufacturerHirose
RoHSDetails
ProductHeaders
Number of Positions100 Position
Pitch0.5 mm
Number of Rows2 Row
Termination StyleSMD/SMT
Mounting AngleStraight
Current Rating300 mA
Voltage Rating50 V
PackagingTray
Contact MaterialPhosphor Bronze
Contact PlatingGold
Flammability RatingUL 94 V-0
Housing MaterialLiquid Crystal Polymer (LCP)
Insulation Resistance100 MOhms
Stack Height5 mm
Factory Pack Quantity1
Unit Weight0.035274 oz
15
+
Gbps 0.5mm pitch Stacking Connectors
FX10 Series
Electrical Interface for the OIF 100G Long-Haul DWDM Transmission Module (MSA-100GLH)
■Mechanical
Features
0.5mm Pitch
Stacking height : 4 to 8mm (2-piece type)
8 to 13mm (3-piece type)
Number of Contacts
With ground plate : 80 / 100 / 120 / 140
Without ground plate : 96 / 120 / 144 / 168
3-piece interposer : 120 / 144 /168
Dec.1.2017 Copyright 2017 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
OIF MSA-100GLH Electrical Interface
■With
GND Plate Type
FX10A-168P/S-SV(83) assembly is specified for the
OIF 100G Long-Haul DWDM Transmission Module
host line card - MSA-100GLH electrical connector.
Ground
plate
Signal contact
Housing
Suited to High-Density Applications
The 0.5 mm signal contact pitch provides a smaller
overall connector, using less mounting area on the board.
5
0.7
m
0.5
m
mm
.75
0
mm
Optional Ground Plate
An alternate style without the ground plate is available.
The space provided by the ground plate removal has
been filled with additional signal contacts.
<3-piece type>
Smooth floating with high speed transmission
capability supported by unique 3-piece floating
system
Multiple connectors are allowed on the same PCB
(Allowable Mis-alignment Range : ± 0.3mm in XY
direction)
Metal fitting
Ground plate and metal
fitting make contact
●Floating
Interposer
ing
Float
Flo
ati
n
g
■Signal
Integrity Features
●Insertion-Loss-to-Crosstalk-Ratio(ICR)
The insertion-loss-to-crosstalk-ratio (ICR) with
five-aggressor differential FEXT meets the
extrapolated IEEE 802.3ap specification for
15
+
Gbps.
ICR (dB)
60
50
40
Z (Ohm)
115
110
105
100
95
30
20
10
0
ICR
ICR spec
0
2
4
6
Frequency (GHz)
8
10
●Differential
Impedance
85ø configuration and 100ø configuration are
available.
90
S(3,3)
85
0
200
400
600
Time (ps)
800
1000
■Stack
Height
●2-piece
type
●With
ground plate
Headers
Receptacles
FX10#-*S/*-SV
FX10#-xP/x-SV
4mm
FX10#–xP/x–SV1
5mm
●Without
ground plate
Headers
Receptacles
FX10#-*S-SV
Interposer
FX10-xIP-xD(Q)-8H
FX10#-xP-SV FX10–xP–SV1 FX10#-xP-SV2
4mm
5mm
6mm
FX10#-xP-SV3
7mm
FX10#-xP-SV4
8mm
●3-piece
type
Stacking Height
8mm
9mm
10mm
11mm
12mm
13mm
Header (Mating side)
FX10#-xP-SV
FX10#-xP-SV
FX10#-xP-SV1
FX10#-xP-SV2
FX10#-xP-SV3
FX10#-xP-SV4
Header(Fixed side)
FX10#-xP-SV
FX10#-xP-SV1
FX10#-xP-SV1
FX10#-xP-SV1
FX10#-xP-SV1
FX10#-xP-SV1
( )
FX10-xIP-xD(Q)-8PH
(H) : Reference dimension
2016.12
r
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