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BSA40

Description
0.2 A, 40 V, 2 ELEMENT, SILICON, SIGNAL DIODE
Categorysemiconductor    Discrete semiconductor   
File Size114KB,2 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
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BSA40 Overview

0.2 A, 40 V, 2 ELEMENT, SILICON, SIGNAL DIODE

BSA40 Parametric

Parameter NameAttribute value
Number of terminals3
Number of components2
Processing package descriptionGREEN, PLASTIC PACKAGE-3
stateACTIVE
packaging shapeRECTANGULAR
Package SizeSMALL OUTLINE
surface mountYes
Terminal formGULL WING
terminal coatingMATTE TIN OVER NICKEL
Terminal locationDUAL
Packaging MaterialsPLASTIC/EPOXY
CraftsmanshipSCHOTTKY
structureCOMMON CATHODE, 2 ELEMENTS
Diode component materialsSILICON
Maximum power consumption limit0.2000 W
Diode typeSIGNAL DIODE
Maximum reverse recovery time0.0050 us
Maximum repetitive peak reverse voltage40 V
Maximum average forward current0.2000 A
BAS40
8700 E. Thomas Road
Scottsdale, AZ 85251
Tel: (480) 941-6300
Fax: (480) 947-1503
and
BAS70
SCHOTTKYarray™ SERIES
DESCRIPTION
Various configurations of Schottky barrier's diodes in SOT-23 packages are
provided for general-purpose use in high-speed switching, mixers and
detector applications. They may also be used for signal terminations at the
board level. This helps maintain signal integrity and counteract the
transmission-line effects with (PC) board traces by clamping over/and
undershoot from signal reflections with the schottky-low-threshold voltages.
This type of termination also does not depend on matching the transmission
line characteristic impedance, making it particularly useful where line
impedance is unknown or a variable. This method of termination can
control distortions of clock, data, address, and control lines as well as
provides a stabilizing effect on signal jitter. It can also significantly reduce
power consumption compared to standard resistor- based termination methods.
FEATURES
Protects from line to V
CC
and line to ground
Clamps within one forward diode threshold voltage
Low forward voltage and reverse recovery
characteristics
Bidirectional-low-forward available with “-04” suffix (Figure 2)
SOT-23 Surface Mount packaging for small foot print
PACKAGING
Tape & Reel EIA Standard 481
7 inch reel 3,000 pieces
13 inch reel 10,000 pieces
MAXIMUM RATINGS
Operating Temperatures: -55 C to +125 C
Storage Temperature: -55
0
C to +150
0
C
Power dissipation at T
amb
= 25
0
C is 200 mW
Forward Continuous Current at T
amb
= 25
0
C is 200 mA
Surge Forward Current At t
p
< 1 s, T
amb
= 25
0
C is 600 mA
0
0
MECHANICAL
Molded SOT-23 Surface Mount
Weight: .008 grams (approximate)
Body Marked with device number
ELECTRICAL CHARACTERISTICS PER DIODE @ 25
0
C Unless otherwise specified
Repetitive
Peak Reverse
Voltage
DEVICE
TYPE
DEVICE
FIGURE
MARKING
V
RRM
(VOLTS)
TYP
BAS40
BAS40-04
BAS40-05
BAS40-06
BAS70
BAS70-04
BAS70-05
BAS70-06
43
44
45
46
73
74
75
76
1
2
3
4
1
2
3
4
40
40
40
40
70
70
70
70
V
(BR)R
(VOLTS)
MIN
40
40
40
40
70
70
70
70
Reverse
Breakdown
Voltage
Tested with
10µA Pulse
Leakage Current
Pulse test
tp < 300µs @
For BAS40
V
R
= 30 V
For BAS70
V
R
= 50 V
I
R
(nA)
TYP
20
20
20
20
20
20
20
20
MAX
100
100
100
100
100
100
100
100
I
F
=1mA
380
380
380
380
410
410
410
410
1000
1000
1000
1000
I
F
=15mA I
F
=40mA
1000
1000
1000
1000
MAX
5
5
5
5
5
5
5
5
MAX
430
430
430
430
430
430
430
430
MAX
5
5
5
5
2
2
2
2
Forward Voltage Pulse Test
tp < 300µs
at I
F
= 1 mA
at I
F
= 40 mA
Reverse
Recovery
Time from
I
F
= 10 mA
through
I
R
=10mA to
I
R
=1mA
t
rr
(ns)
Thermal
Resistance
Junction to
Ambient Air
Capacitance
At V
R
= 0V
F = 1 MHz
C
tot
V
F
(mV)
R
thJA
(K/W)
pF
MSC1380.PDF
ISO 9001 CERTIFIED
REV C 2/02/2000

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BSA40 BAS40-05 BAS40-04 BAS40-06 BAS70-06 BAS70-04 BAS70-05 BAS40 BAS70
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Number of terminals 3 3 3 3 3 3 3 3 3
Number of components 2 2 2 2 2 2 2 1 1
surface mount Yes YES YES YES YES YES YES YES YES
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Diode component materials SILICON SILICON SILICON SILICON SILICON SILICON SILICON SILICON SILICON
Diode type SIGNAL DIODE RECTIFIER DIODE RECTIFIER DIODE RECTIFIER DIODE RECTIFIER DIODE RECTIFIER DIODE RECTIFIER DIODE RECTIFIER DIODE RECTIFIER DIODE
Maximum reverse recovery time 0.0050 us 0.005 µs 0.005 µs 0.005 µs 0.005 µs 0.005 µs 0.005 µs 0.005 µs 0.005 µs
Maximum repetitive peak reverse voltage 40 V 40 V 40 V 40 V 70 V 70 V 70 V 40 V 70 V
Is it lead-free? - Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? - incompatible incompatible incompatible incompatible incompatible incompatible conform to incompatible
Maker - Microsemi Microsemi Microsemi Microsemi Microsemi Microsemi Microsemi -
Reach Compliance Code - unknown unknown unknown unknown unknown unknown compli compli
ECCN code - EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Configuration - COMMON CATHODE, 2 ELEMENTS SERIES CONNECTED, CENTER TAP, 2 ELEMENTS COMMON ANODE, 2 ELEMENTS COMMON ANODE, 2 ELEMENTS SERIES CONNECTED, CENTER TAP, 2 ELEMENTS COMMON CATHODE, 2 ELEMENTS SINGLE SINGLE
JESD-30 code - R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3
JESD-609 code - e0 e0 e0 e0 e0 e0 e0 e0
Maximum output current - 0.2 A 0.2 A 0.2 A 0.2 A 0.2 A 0.2 A 0.2 A 0.2 A
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
Package shape - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form - SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Celsius) - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Maximum power dissipation - 0.2 W 0.2 W 0.2 W 0.2 W 0.2 W 0.2 W 0.2 W 0.2 W
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
technology - SCHOTTKY SCHOTTKY SCHOTTKY SCHOTTKY SCHOTTKY SCHOTTKY SCHOTTKY SCHOTTKY
Terminal surface - TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD
Maximum time at peak reflow temperature - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
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