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E28F002BL-T150

Description
2-MBIT (128K x 16, 256K x 8)LOW-POWER BOOT BLOCK FLASH MEMORY FAMILY
Categorystorage    storage   
File Size507KB,42 Pages
ManufacturerIntel
Websitehttp://www.intel.com/
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E28F002BL-T150 Overview

2-MBIT (128K x 16, 256K x 8)LOW-POWER BOOT BLOCK FLASH MEMORY FAMILY

E28F002BL-T150 Parametric

Parameter NameAttribute value
Parts packaging codeTSOP
package instructionSOP, TSSOP40,.8,20
Contacts40
Reach Compliance Codeunknow
ECCN codeEAR99
Maximum access time150 ns
Other featuresALSO OPERATES WITH 4.5 V-5.5 V SUPPLY, TOP BOOT BLOCK
startup blockTOP
command user interfaceYES
Data pollingNO
Durability10000 Write/Erase Cycles
JESD-30 codeR-PDSO-G40
length18.4 mm
memory density2097152 bi
Memory IC TypeFLASH
memory width8
Number of functions1
Number of departments/size1,2,1,1
Number of terminals40
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature-20 °C
organize256KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeTSSOP40,.8,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialPARALLEL
power supply3.3/5 V
Programming voltage12 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Department size16K,8K,96K,128K
Maximum standby current0.0000012 A
Maximum slew rate0.07 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
switch bitNO
typeNOR TYPE
width10 mm
Base Number Matches1
2-MBIT (128K x 16 256K x 8)
LOW-POWER BOOT BLOCK
FLASH MEMORY FAMILY
28F200BL-T B 28F002BL-T B
Y
Low Voltage Operation for Very Low
Power Portable Applications
V
CC
e
3 0V– 3 6V
Expanded Temperature Range
b
20 C to
a
70 C
x8 x16 Input Output Architecture
28F200BL-T 28F200BL-B
For High Performance and High
Integration 16-bit and 32-bit CPUs
x8-only Input Output Architecture
28F002BL-T 28F002BL-B
For Space Constrained 8-bit
Applications
Upgradeable to Intel’s SmartVoltage
Products
Optimized High-Density Blocked
Architecture
One 16-KB Protected Boot Block
Two 8-KB Parameter Blocks
One 96-KB Main Block
One 128-KB Main Block
Top or Bottom Boot Locations
Extended Cycling Capability
10 000 Block Erase Cycles
Automated Word Byte Write and Block
Erase
Command User Interface
Status Registers
Erase Suspend Capability
Y
Y
SRAM-Compatible Write Interface
Automatic Power Savings Feature
0 8 mA Typical I
CC
Active Current in
Static Operation
Very High-Performance Read
150 ns Maximum Access Time
65 ns Maximum Output Enable Time
Low Power Consumption
15 mA Typical Active Read Current
Reset Deep Power-Down Input
0 2
mA
I
CC
Typical
Acts as Reset for Boot Operations
Write Protection for Boot Block
Hardware Data Protection Feature
Erase Write Lockout during Power
Transitions
Industry Standard Surface Mount
Packaging
28F200BL JEDEC ROM Compatible
44-Lead PSOP
56-Lead TSOP
28F002BL 40-Lead TSOP
12V Word Byte Write and Block Erase
V
PP
e
12V
g
5% Standard
ETOX
TM
III Flash Technology
3 3V Read
Independent Software Vendor Support
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Other brands and names are the property of their respective owners
Information in this document is provided in connection with Intel products Intel assumes no liability whatsoever including infringement of any patent or
copyright for sale and use of Intel products except as provided in Intel’s Terms and Conditions of Sale for such products Intel retains the right to make
changes to these specifications at any time without notice Microcomputer Products may have minor variations to this specification known as errata
COPYRIGHT
INTEL CORPORATION 1995
December 1995
Order Number 290449-006

E28F002BL-T150 Related Products

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Description 2-MBIT (128K x 16, 256K x 8)LOW-POWER BOOT BLOCK FLASH MEMORY FAMILY 2-MBIT (128K x 16, 256K x 8)LOW-POWER BOOT BLOCK FLASH MEMORY FAMILY 2-MBIT (128K x 16, 256K x 8)LOW-POWER BOOT BLOCK FLASH MEMORY FAMILY 2-MBIT (128K x 16, 256K x 8)LOW-POWER BOOT BLOCK FLASH MEMORY FAMILY 2-MBIT (128K x 16, 256K x 8)LOW-POWER BOOT BLOCK FLASH MEMORY FAMILY 2-MBIT (128K x 16, 256K x 8)LOW-POWER BOOT BLOCK FLASH MEMORY FAMILY 2-MBIT (128K x 16, 256K x 8)LOW-POWER BOOT BLOCK FLASH MEMORY FAMILY
Parts packaging code TSOP - SOIC SOIC TSOP TSOP TSOP
package instruction SOP, TSSOP40,.8,20 - 1.110 X 0.525 INCH, PLASTIC, SOP-44 1.110 X 0.525 INCH, PLASTIC, SOP-44 20 X 10 MM, TSOP-40 SOP, TSSOP56,.25,20 SOP, TSSOP56,.25,20
Contacts 40 - 44 44 40 56 56
Reach Compliance Code unknow - unknow unknow unknow unknow unknow
ECCN code EAR99 - EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 150 ns - 150 ns 150 ns 150 ns 150 ns 150 ns
Other features ALSO OPERATES WITH 4.5 V-5.5 V SUPPLY, TOP BOOT BLOCK - ALSO OPERATES WITH 4.5 V-5.5 V SUPPLY, TOP BOOT BLOCK ALSO OPERATES WITH 4.5 V-5.5 V SUPPLY, BOTTOM BOOT BLOCK ALSO OPERATES WITH 4.5 V-5.5 V SUPPLY, BOTTOM BOOT BLOCK ALSO OPERATES WITH 4.5 V-5.5 V SUPPLY, TOP BOOT BLOCK ALSO OPERATES WITH 4.5 V-5.5 V SUPPLY, BOTTOM BOOT BLOCK
startup block TOP - TOP BOTTOM BOTTOM TOP BOTTOM
command user interface YES - YES YES YES YES YES
Data polling NO - NO NO NO NO NO
JESD-30 code R-PDSO-G40 - R-PDSO-G44 R-PDSO-G44 R-PDSO-G40 R-PDSO-G56 R-PDSO-G56
length 18.4 mm - 28.2 mm 28.2 mm 18.4 mm 18.4 mm 18.4 mm
memory density 2097152 bi - 2097152 bi 2097152 bi 2097152 bi 2097152 bi 2097152 bi
Memory IC Type FLASH - FLASH FLASH FLASH FLASH FLASH
memory width 8 - 16 16 8 16 16
Number of functions 1 - 1 1 1 1 1
Number of departments/size 1,2,1,1 - 1,2,1,1 1,2,1,1 1,2,1,1 1,2,1,1 1,2,1,1
Number of terminals 40 - 44 44 40 56 56
word count 262144 words - 131072 words 131072 words 262144 words 131072 words 131072 words
character code 256000 - 128000 128000 256000 128000 128000
Operating mode ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS SYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C - 70 °C 70 °C 70 °C 70 °C 70 °C
Minimum operating temperature -20 °C - -20 °C -20 °C -20 °C -20 °C -20 °C
organize 256KX8 - 128KX16 128KX16 256KX8 128KX16 128KX16
Output characteristics 3-STATE - 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP - SOP SOP SOP SOP SOP
Encapsulate equivalent code TSSOP40,.8,20 - SOP44,.63 SOP44,.63 TSSOP40,.8,20 TSSOP56,.25,20 TSSOP56,.25,20
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE - SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL - PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
power supply 3.3/5 V - 3.3/5 V 3.3/5 V 3.3/5 V 3.3/5 V 3.3/5 V
Programming voltage 12 V - 12 V 12 V 12 V 12 V 12 V
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm - 2.95 mm 2.95 mm 1.2 mm 1.2 mm 1.2 mm
Department size 16K,8K,96K,128K - 16K,8K,96K,128K 16K,8K,96K,128K 16K,8K,96K,128K 16K,8K,96K,128K 16K,8K,96K,128K
Maximum standby current 0.0000012 A - 0.0000012 A 0.0000012 A 0.0000012 A 0.0000012 A 0.0000012 A
Maximum slew rate 0.07 mA - 0.07 mA 0.07 mA 0.07 mA 0.07 mA 0.07 mA
Maximum supply voltage (Vsup) 3.6 V - 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V - 3 V 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V - 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES - YES YES YES YES YES
technology CMOS - CMOS CMOS CMOS MOS CMOS
Temperature level OTHER - OTHER OTHER OTHER OTHER OTHER
Terminal form GULL WING - GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.5 mm - 1.27 mm 1.27 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location DUAL - DUAL DUAL DUAL DUAL DUAL
switch bit NO - NO NO NO NO NO
type NOR TYPE - NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
width 10 mm - 13.3 mm 13.3 mm 10 mm 14 mm 14 mm
Base Number Matches 1 - 1 - 1 1 -
Spare memory width - - 8 8 - 8 8
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