MUR1620CTRG,
MURB1620CTRG,
NRVUB1620CTRT4G
SWITCHMODE
Power Rectifier
These state−of−the−art devices are designed for use in negative
switching power supplies, inverters and as free wheeling diodes. Also,
used in conjunction with common cathode dual Ultrafast Rectifiers,
makes a single phase full−wave bridge.
Features
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ULTRAFAST RECTIFIER
16 AMPERES, 200 VOLTS
•
•
•
•
•
•
•
•
Common Anode Dual Rectifier (8.0 A per Leg or 16 A per Package)
Ultrafast 35 Nanosecond Reverse Recovery Times
Exhibits Soft Recovery Characteristics
High Temperature Glass Passivated Junction
Low Leakage Specified @ 150°C Case Temperature
Current Derating @ Both Case and Ambient Temperatures
Epoxy Meets UL 94 V−0 @ 0.125 in
Complement to MUR1620CT and MURB1620CT Common Cathode
Device
•
ESD Ratings:
♦
Machine Model = C (> 400 V)
♦
Human Body Model = 3B (> 16,000 V)
•
NRVU Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
•
All Packages are Pb−Free*
Mechanical Characteristics:
TO−220AB
CASE 221A
STYLE 7
1
D
2
PAK
CASE 418AJ
2, 4
3
MARKING DIAGRAMS
•
Case: Epoxy, Molded
•
Weight: MUR1620CTR: 1.9 Grams (Approximately)
MURB1620CTR: 1.7 Grams (Approximately)
•
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
•
Lead Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
AYWW
U1620RG
KAK
AYWW
U1620RG
KAK
TO−220AB
D
2
PAK
U1620R = Device Code
KAK
= Diode Polarity
A
= Assembly Location
Y
= Year
WW
= Work Week
G
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2012
February, 2012
−
Rev. 8
1
Publication Order Number:
MUR1620CTR/D
MUR1620CTRG, MURB1620CTRG, NRVUB1620CTRT4G
MAXIMUM RATINGS
(Per Leg)
Rating
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
(Rated V
R
, T
C
= 160°C)
Per Leg
Per Total Device
Peak Repetitive Surge Current
(Rated V
R
, Square Wave, 20 kHz, T
C
= 140°C)
Per Diode
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
Operating Junction and Storage Temperature Range
Symbol
V
RRM
V
RWM
V
R
I
F(AV)
8.0
16
I
FM
16
I
FSM
T
J
, T
stg
100
−65
to +175
A
°C
A
Value
200
Unit
V
A
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
THERMAL CHARACTERISTICS
(Per Leg)
Characteristic
Thermal Resistance, Junction−to−Case
Thermal Resistance, Junction−to−Ambient (D
2
PAK)
Symbol
R
qJC
R
qJA
Value
2.0
45
Unit
°C/W
°C/W
ELECTRICAL CHARACTERISTICS
(Per Leg)
Characteristic
Maximum Instantaneous Forward Voltage (Note 1)
(i
F
= 8.0 Amps, T
C
= 25°C)
(i
F
= 8.0 Amps, T
C
= 150°C)
Maximum Instantaneous Reverse Current (Note 1)
(Rated dc Voltage, T
C
= 25°C)
(Rated dc Voltage, T
C
= 150°C)
Maximum Reverse Recovery Time
(I
F
= 1.0 Amp, di/dt = 50 Amps/ms)
1. Pulse Test: Pulse Width = 5.0 ms, Duty Cycle
≤
10%.
Symbol
v
F
Value
1.2
1.1
5.0
500
85
Unit
V
i
R
mA
t
rr
ns
ORDERING INFORMATION
Device
MUR1620CTRG
MURB1620CTRG
MURB1620CTRT4G
NRVUB1620CTRT4G
Package
TO−220
(Pb−Free)
D
2
PAK−3
(Pb−Free)
D
2
PAK−3
(Pb−Free)
D
2
PAK−3
(Pb−Free)
Shipping
†
50 Units / Rail
50 Units / Rail
800 / Tape & Reel
800 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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2
MUR1620CTRG, MURB1620CTRG, NRVUB1620CTRT4G
100
70
50
30
i
F
, INSTANTANEOUS FORWARD CURRENT
(AMPS)
20
1000
500
200
100
50
20
10
5
2
1
0.5
0.2
0.1
0.05
0.02
0.01
I
R
, REVERSE CURRENT (mA)
T
J
= 175°C
150°C
100°C
* The curves shown are typical for the highest
voltage device in the voltage grouping. Typical
reverse current for lower voltage selections can
be estimated from these same curves if V
R
is
sufficiently below rated V
R
.
25°C
0
20
40
60
80
100 120 140 160 180 200
10
7.0
5.0
150°C
3.0
2.0
25°C
1.0
0.7
0.5
0.3
0.2
100°C
T
J
= 175°C
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 2. Typical Reverse Current* (Per Leg)
I
F(AV)
, AVERAGE FORWARD CURRENT (AMPS)
16
14
12
10
8.0
6.0
4.0
2.0
0
140
150
160
170
180
SQUARE WAVE
RATED V
R
APPLIED
R
qJC
= 2°C/W
dc
0.1
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
v
F,
INSTANTANEOUS VOLTAGE (VOLTS)
T
C
, CASE TEMPERATURE (°C)
Figure 1. Typical Forward Voltage (Per Leg)
Figure 3. Current Derating, Case (Per Leg)
P
F(AV)
, AVERAGE POWER DISSIPATION (WATTS)
16
14
12
10
8.0
6.0
4.0
2.0
0
0
T
J
= 175°C
SQUARE
WAVE
dc
2.0
4.0
6.0
8.0
10
12
14
16
I
F(AV)
, AVERAGE FORWARD CURRENT (AMPS)
Figure 4. Power Dissipation (Per Leg)
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3
MUR1620CTRG, MURB1620CTRG, NRVUB1620CTRT4G
1.0
r(t), TRANSIENT THERMAL RESISTANCE
(NORMALIZED)
0.5
0.2
0.1
0.05
0.02
0.01
0.01 0.02
0.01
SINGLE PULSE
D = 0.5
0.1
0.05
P
(pk)
t
1
t
2
DUTY CYCLE, D = t
1
/t
2
0.05
0.1
0.2
0.5
1.0
2.0
t, TIME (ms)
5.0
10
20
Z
qJC(t)
= r(t) R
qJC
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT T
1
T
J(pk)
−
T
C
= P
(pk)
Z
qJC(t)
50
100
200
500 1000
Figure 5. Thermal Response
100
50% Duty Cycle
10
1
20%
10%
5%
2%
1%
0.1
Single Pulse
R(t) (°C/W)
0.01
0.001
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
PULSE TIME (sec)
Figure 6. Thermal Response, Junction−to−Ambient
1000
900
800
C, CAPACITANCE (pF)
700
600
500
400
300
200
100
0
0.1
0.2 0.3
0.5 0.7 1.0
0.2 0.3
0.5 0.7 10
V
R
, REVERSE VOLTAGE (VOLTS)
20
30
50
70 100
Figure 7. Typical Capacitance (Per Leg)
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4
MUR1620CTRG, MURB1620CTRG, NRVUB1620CTRT4G
PACKAGE DIMENSIONS
D
2
PAK−3 (TO−263, 3−LEAD)
CASE 418AJ
ISSUE A
B
E
E2
A
NOTE 3
SEATING
PLANE
A
c2
A
D1
L1
L1
H
D
DETAIL C
E1
0.10
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. CHAMFER OPTIONAL
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH. MOLD FLASH SHALL NOT EXCEED 0.005
PER SIDE. THESE DIMENSIONS ARE MEASURED
AT THE OUTERMOST EXTREMES OF THE
PLASTIC BODY AT DATUM H.
5. THERMAL PAD CONTOUR IS OPTIONAL WITHIN
DIMENSIONS E, L1, D1 AND E1.
6. OPTIONAL MOLD FEATURE
B A
M
L2
e
NOTE 6
2X
c
b
0.10
SIDE VIEW
M
A
VIEW A−A
M
TOP VIEW
B A
GAUGE
PLANE
H
L3
L
M
A1
DETAIL C
B
SEATING
PLANE
DIM
A
A1
b
c
c2
D
D1
E
E1
e
H
L
L1
L2
L3
M
INCHES
MIN
MAX
0.160 0.190
0.000 0.010
0.020 0.039
0.012 0.029
0.045 0.065
0.330 0.380
0.260
−−−−
0.380 0.420
0.245
−−−−
0.100 BSC
0.575 0.625
0.070
0.110
−−−−
0.066
−−−−
0.070
0.010 BSC
0
°
8
°
MILLIMETERS
MIN
MAX
4.06
4.83
0.00
0.25
0.51
0.99
0.30
0.74
1.14
1.65
8.38
9.65
6.60
−−−−
9.65 10.67
6.22
−−−−
2.54 BSC
14.60 15.88
1.78
2.79
−−−−
1.68
−−−−
1.78
0.25 BSC
0
°
8
°
OPTIONAL CONSTRUCTIONS
VIEW A−A
RECOMMENDED
SOLDERING FOOTPRINT*
0.436
0.366
0.653
0.169
0.063
0.100
PITCH
DIMENSIONS: INCHES
2X
2X
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
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