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BS107

Description
MOSFET 200V 250mA
CategoryDiscrete semiconductor    The transistor   
File Size94KB,4 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
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BS107 Overview

MOSFET 200V 250mA

BS107 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerON Semiconductor
Parts packaging codeTO-92
package instructionCYLINDRICAL, O-PBCY-T3
Contacts3
Manufacturer packaging codeCASE 29-11
Reach Compliance Codenot_compliant
ECCN codeEAR99
ConfigurationSINGLE WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage200 V
Maximum drain current (Abs) (ID)0.13 A
Maximum drain current (ID)0.25 A
Maximum drain-source on-resistance14 Ω
FET technologyMETAL-OXIDE SEMICONDUCTOR
JEDEC-95 codeTO-226AA
JESD-30 codeO-PBCY-T3
JESD-609 codee0
Number of components1
Number of terminals3
Operating modeENHANCEMENT MODE
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeROUND
Package formCYLINDRICAL
Peak Reflow Temperature (Celsius)240
Polarity/channel typeN-CHANNEL
Maximum power dissipation(Abs)1 W
Certification statusNot Qualified
surface mountNO
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
transistor applicationsSWITCHING
Transistor component materialsSILICON
BS107A
Small Signal MOSFET
250 mAmps, 200 Volts
N−Channel TO−92
Features
http://onsemi.com
AEC Qualified
PPAP Capable
This is a Pb−Free Device*
250 mAMPS, 200 VOLTS
R
DS(on)
= 6.4
W
D
N−Channel
MAXIMUM RATINGS
Rating
Drain
−Source
Voltage
Gate−Source Voltage
Continuous
Non−repetitive (t
p
50
ms)
Drain Current
Continuous (Note 1)
Pulsed (Note 2)
Total Device Dissipation @ T
A
= 25°C
Derate above 25°C
Operating and Storage Junction
Temperature Range
Symbol
V
DS
V
GS
V
GSM
I
D
Value
200
±
20
±
30
250
500
350
−55
to
150
mW
°C
1
2
3
Unit
Vdc
Vdc
Vpk
mAdc
I
DM
P
D
T
J
, T
stg
G
S
MARKING
DIAGRAM
A
BS107A
YWW
G
G
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. The Power Dissipation of the package may result in a lower continuous drain
current.
2. Pulse Test: Pulse Width
v
300
ms,
Duty Cycle
v
2.0%.
TO−92
CASE 29−11
STYLE 30
A
Y
WW
G
= Assembly Location
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
BS107ARL1G
Package
TO−92
(Pb−Free)
Shipping
2000 / Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2011
April, 2011
Rev. 6
1
Publication Order Number:
BS107/D

BS107 Related Products

BS107 BS107G BS107AG
Description MOSFET 200V 250mA MOSFET 200V 250mA N-Channel MOSFET 200V 250mA N-Channel
Parts packaging code TO-92 TO-92 TO-92
package instruction CYLINDRICAL, O-PBCY-T3 CYLINDRICAL, O-PBCY-T3 CASE 29-11, TO-92, 3 PIN
Contacts 3 3 3
Manufacturer packaging code CASE 29-11 29-11 29-11
Reach Compliance Code not_compliant unknown unknown
ECCN code EAR99 EAR99 EAR99
Configuration SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage 200 V 200 V 200 V
Maximum drain current (Abs) (ID) 0.13 A 0.25 A 0.25 A
Maximum drain current (ID) 0.25 A 0.25 A 0.25 A
Maximum drain-source on-resistance 14 Ω 14 Ω 6.4 Ω
FET technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JEDEC-95 code TO-226AA TO-226AA TO-226AA
JESD-30 code O-PBCY-T3 O-PBCY-T3 O-PBCY-T3
JESD-609 code e0 e1 e1
Number of components 1 1 1
Number of terminals 3 3 3
Operating mode ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE
Maximum operating temperature 150 °C 150 °C 150 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
Package shape ROUND ROUND ROUND
Package form CYLINDRICAL CYLINDRICAL CYLINDRICAL
Peak Reflow Temperature (Celsius) 240 260 260
Polarity/channel type N-CHANNEL N-CHANNEL N-CHANNEL
Maximum power dissipation(Abs) 1 W 0.35 W 0.35 W
Certification status Not Qualified Not Qualified Not Qualified
surface mount NO NO NO
Terminal surface Tin/Lead (Sn/Pb) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal location BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 40 40
transistor applications SWITCHING SWITCHING SWITCHING
Transistor component materials SILICON SILICON SILICON
Maker ON Semiconductor ON Semiconductor -
Brand Name - ON Semiconductor ON Semiconductor
Is it lead-free? - Lead free Lead free
Base Number Matches - 1 1
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