Note the following details of the code protection feature on Microchip devices:
•
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
•
•
•
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, K
EE
L
OQ
, K
EE
L
OQ
logo, MPLAB, PIC, PICmicro,
PICSTART, rfPIC, SmartShunt and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
FilterLab, Linear Active Thermistor, MXDEV, MXLAB,
SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, In-Circuit Serial
Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM,
PICDEM.net, PICtail, PIC
32
logo, PowerCal, PowerInfo,
PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total
Endurance, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2008, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC
®
MCUs and dsPIC
®
DSCs, K
EE
L
OQ
®
code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS51763A-page ii
©
2008 Microchip Technology Inc.
MCP6031 PHOTODIODE PICtail™
PLUS DEMO BOARD USER’S GUIDE
Table of Contents
Preface ........................................................................................................................... 1
Introduction............................................................................................................ 1
Document Layout .................................................................................................. 1
Conventions Used in this Guide ............................................................................ 2
Recommended Reading........................................................................................ 3
The Microchip Web Site ........................................................................................ 3
Customer Support ................................................................................................. 3
Document Revision History ................................................................................... 3
Chapter 1. Product Overview
1.1 Introduction ..................................................................................................... 5
1.2 MCP6031 Photodiode PICtail™ Plus Demo Board Kit Contents ................... 5
1.3 MCP6031 Photodiode PICtail™ Plus Demo Board Description .................... 6
Chapter 2. Installation and Operation
2.1 Introduction ..................................................................................................... 9
2.2 Required Tool ................................................................................................. 9
2.3 MCP6031 Photodiode PICtail™ Plus Demo Board Set-up ........................... 9
2.4 MCP6031 Photodiode PICtail™ Plus Demo Board Operation .................... 10
Appendix A. Schematic and Layouts
A.1 Introduction .................................................................................................. 11
A.2 Board - Schematic ....................................................................................... 12
A.3 Board - Top Silk Layer ................................................................................ 13
A.4 Board - Top Metal And Top Silk Layers ....................................................... 13
A.5 Board - Bottom Metal Layer ......................................................................... 14
Appendix B. Bill of Materials (BOM)
Worldwide Sales and Service .................................................................................... 16
©
2008 Microchip Technology Inc.
DS51763A-page iii
MCP6031 PHOTODIODE PICtail™
PLUS DEMO BOARD USER’S GUIDE
Preface
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our web site
(www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the page number. The numbering convention for the DS number is
“DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the
document.
For the most up-to-date information on development tools, see the MPLAB
®
IDE on-line help.
Select the Help menu, and then Topics to open a list of available on-line help files.
INTRODUCTION
This chapter contains general information that will be useful to know before using the
MCP6031 Photodiode PICtail™ Plus Demo Board . Items discussed in this chapter
include:
•
•
•
•
•
•
Document Layout
Conventions Used in this Guide
Recommended Reading
The Microchip Web Site
Customer Support
Document Revision History
DOCUMENT LAYOUT
This document describes how to use the MCP6031 Photodiode PICtail™ Plus Demo
Board as a development tool to emulate and debug firmware on a target board. The
manual layout is as follows:
•
Chapter 1. “Product Overview”
– Provides the important information about the
MCP6031 Photodiode PICtail™ Plus Demo Board .
•
Chapter 2. “Installation and Operation”
– Covers the installation and operation
of the MCP6031 Photodiode PICtail™ Plus Demo Board .
•
Appendix A. “Schematic and Layouts”
– Shows the schematic and board
layouts for the MCP6031 Photodiode PICtail™ Plus Demo Board .
•
Appendix B. “Bill of Materials (BOM)”
– Lists the parts used to build the
MCP6031 Photodiode PICtail™ Plus Demo Board .
©
2008 Microchip Technology Inc.
DS51763A-page 1
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