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NTE2960

Description
MOSFET N-Channel, Enhancement Mode High Speed Switch
CategoryDiscrete semiconductor    The transistor   
File Size20KB,2 Pages
ManufacturerNTE
Websitehttp://www.nteinc.com
Environmental Compliance
Download Datasheet Parametric Compare View All

NTE2960 Overview

MOSFET N-Channel, Enhancement Mode High Speed Switch

NTE2960 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerNTE
package instructionFLANGE MOUNT, R-PSFM-T3
Reach Compliance Codeunknow
Shell connectionISOLATED
ConfigurationSINGLE WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage900 V
Maximum drain current (ID)7 A
Maximum drain-source on-resistance2 Ω
FET technologyMETAL-OXIDE SEMICONDUCTOR
JESD-30 codeR-PSFM-T3
Number of components1
Number of terminals3
Operating modeENHANCEMENT MODE
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formFLANGE MOUNT
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Polarity/channel typeN-CHANNEL
Maximum pulsed drain current (IDM)21 A
Certification statusNot Qualified
surface mountNO
Terminal formTHROUGH-HOLE
Terminal locationSINGLE
Maximum time at peak reflow temperatureNOT SPECIFIED
transistor applicationsSWITCHING
Transistor component materialsSILICON
NTE2960
MOSFET
N–Channel, Enhancement Mode
High Speed Switch
Applications:
D
SMPS
D
DC–DC Converter
D
Battery Charger
D
Power Supply of Printer
D
Copier
D
HDD, FDD, TV, VCR
D
Personal Computer
Absolute Maximum Ratings:
(T
C
= +25°C unless otherwise specified)
Drain–Source Voltage (V
GS
= 0V), V
DSS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 900V
Gate–Source Voltage (V
DS
= 0V), V
GS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±30V
Drain Current, I
D
Continuous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7A
Pulsed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21A
Maximum Power Dissipation, P
D
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40W
Channel Temperature Range, T
ch
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –55° to +150°C
Storage Temperature Range, T
stg
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –55° to +150°C
Thermal Resistance, Channel–to–Case, R
th(ch–c)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.13°C/W
Isolation Voltage, V
ISO
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2000V
Electrical Characteristics:
(T
ch
= +25°C unless otherwise specified)
Parameter
Drain–Source Breakdown Voltage
Gate–Source Breakdown Voltage
Gate–Source Leakage
Zero Gate Voltage Drain Current
Gate Threshold Voltage
Static Drain–Source ON Resistance
Drain–Source On–State Voltage
Forward Transfer Admittance
Symbol
Test Conditions
Min
900
±30
2.0
4.2
Typ
3.0
1.54
4.62
7.0
Max
±10
1.0
4.0
2.00
6.00
Unit
V
V
µA
mA
V
V
S
V
(BR)DSS
V
DS
= 0V, I
D
= 1mA
V
(BR)GSS
V
DS
= 0V, I
G
=
±100µA
I
GSS
I
DSS
V
GS(th)
R
DS(on)
V
DS(on)
|y
fs
|
V
GS
=
±25V,
V
DS
= 0V
V
DS
= 900V, V
GS
= 0
V
DS
= 10V, I
D
= 1mA
V
GS
= 10V, I
D
= 3A
V
GS
= 10V, I
D
= 3A
V
GS
= 10V, I
D
= 3A

NTE2960 Related Products

NTE2960 NTE2959
Description MOSFET N-Channel, Enhancement Mode High Speed Switch MOSFET N-Channel, Enhancement Mode High Speed Switch
Maker NTE NTE
package instruction FLANGE MOUNT, R-PSFM-T3 FLANGE MOUNT, R-PSFM-T3
Reach Compliance Code unknow unknow
Shell connection ISOLATED ISOLATED
Configuration SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage 900 V 900 V
Maximum drain current (ID) 7 A 5 A
Maximum drain-source on-resistance 2 Ω 2.8 Ω
FET technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JESD-30 code R-PSFM-T3 R-PSFM-T3
Number of components 1 1
Number of terminals 3 3
Operating mode ENHANCEMENT MODE ENHANCEMENT MODE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
Package shape RECTANGULAR RECTANGULAR
Package form FLANGE MOUNT FLANGE MOUNT
Polarity/channel type N-CHANNEL N-CHANNEL
Maximum pulsed drain current (IDM) 21 A 15 A
Certification status Not Qualified Not Qualified
surface mount NO NO
Terminal form THROUGH-HOLE THROUGH-HOLE
Terminal location SINGLE SINGLE
transistor applications SWITCHING SWITCHING
Transistor component materials SILICON SILICON
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