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AFS600-1FGG256I

CategoryProgrammable logic devices    Programmable logic   
File Size18MB,331 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Environmental Compliance
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AFS600-1FGG256I Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicrosemi
package instructionLBGA,
Reach Compliance Codecompliant
JESD-30 codeS-PBGA-B256
JESD-609 codee1
length17 mm
Humidity sensitivity level3
Equivalent number of gates600000
Number of terminals256
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize600000 GATES
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius)260
Programmable logic typeFIELD PROGRAMMABLE GATE ARRAY
Certification statusNot Qualified
Maximum seat height1.7 mm
Maximum supply voltage1.575 V
Minimum supply voltage1.425 V
Nominal supply voltage1.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature40
width17 mm
Revision 6
Fusion Family of Mixed Signal FPGAs
Features and Benefits
High-Performance Reprogrammable Flash
Technology
• Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS
Process
• Nonvolatile, Retains Program when Powered Off
• Instant On Single-Chip Solution
• 350 MHz System Performance
In-System Programming (ISP) and Security
• ISP with 128-Bit AES via JTAG
• FlashLock
®
Designed to Protect FPGA Contents
Advanced Digital I/O
• 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
• Bank-Selectable I/O Voltages – Up to 5 Banks per Chip
• Single-Ended I/O Standards: LVTTL, LVCMOS
3.3 V / 2.5 V /1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X, and
LVCMOS 2.5 V / 5.0 V Input
• Differential I/O Standards: LVPECL, LVDS, B-LVDS,
M-LVDS
– Built-In I/O Registers
– 700 Mbps DDR Operation
• Hot-Swappable I/Os
• Programmable Output Slew Rate, Drive Strength, and
Weak Pull-Up/Down Resistor
• Pin-Compatible Packages across the Fusion
®
Family
Embedded Flash Memory
• User Flash Memory – 2 Mbits to 8 Mbits
– Configurable 8-, 16-, or 32-Bit Datapath
– 10 ns Access in Read-Ahead Mode
• 1 Kbit of Additional FlashROM
Integrated A/D Converter (ADC) and Analog I/O
Up to 12-Bit Resolution and up to 600 Ksps
Internal 2.56 V or External Reference Voltage
ADC: Up to 30 Scalable Analog Input Channels
High-Voltage Input Tolerance: –10.5 V to +12 V
Current Monitor and Temperature Monitor Blocks
Up to 10 MOSFET Gate Driver Outputs
– P- and N-Channel Power MOSFET Support
– Programmable 1, 3, 10, 30 µA, and 20 mA Drive
Strengths
• ADC Accuracy is Better than 1%
SRAMs and FIFOs
• Variable-Aspect-Ratio 4,608-Bit SRAM Blocks (×1, ×2,
×4, ×9, and ×18 organizations available)
• True Dual-Port SRAM (except ×18)
• Programmable Embedded FIFO Control Logic
Soft ARM Cortex-M1 Fusion Devices (M1)
• ARM
®
Cortex-™M1–Enabled
On-Chip Clocking Support
Internal 100 MHz RC Oscillator (accurate to 1%)
Crystal Oscillator Support (32 KHz to 20 MHz)
Programmable Real-Time Counter (RTC)
6 Clock Conditioning Circuits (CCCs) with 1 or 2 Integrated
PLLs
– Phase Shift, Multiply/Divide, and Delay Capabilities
– Frequency: Input 1.5–350 MHz, Output 0.75–350
MHz
Pigeon Point ATCA IP Support (P1)
• Targeted to Pigeon Point
®
Board Management
Reference (BMR) Starter Kits
• Designed in Partnership with Pigeon Point Systems
• ARM Cortex-M1 Enabled
• Targeted to Advanced Mezzanine Card (AdvancedMC™
Designs)
• Designed in Partnership with MicroBlade
• 8051-Based Module Management Controller (MMC)
MicroBlade Advanced Mezzanine Card Support (U1)
Low Power Consumption
• Single 3.3 V Power Supply with On-Chip 1.5 V Regulator
• Sleep and Standby Low-Power Modes
Table 1 • Fusion Family
Fusion Devices
ARM Cortex-M1 Devices
Pigeon Point Devices
MicroBlade Devices
System Gates
General
Information
Tiles (D-flip-flops)
Secure (AES) ISP
PLLs
Globals
Flash Memory Blocks (2 Mbits)
Total Flash Memory Bits
Memory
FlashROM Bits
RAM Blocks (4,608 bits)
RAM kbits
Analog Quads
Analog Input Channels
Analog and I/Os
Gate Driver Outputs
I/O Banks (+ JTAG)
Maximum Digital I/Os
Analog I/Os
90,000
2,304
Yes
1
18
1
2M
1,024
6
27
5
15
5
4
75
20
U1AFS250
250,000
6,144
Yes
1
18
1
2M
1,024
8
36
6
18
6
4
114
24
*
AFS090
AFS250
M1AFS250
AFS600
M1AFS600
P1AFS600
U1AFS600
600,000
13,824
Yes
2
18
2
4M
1,024
24
108
10
30
10
5
172
40
AFS1500
M1AFS1500
P1AFS1500
U1AFS1500
1,500,000
38,400
Yes
2
18
4
8M
1,024
60
270
10
30
10
5
252
40
Note:
*Refer to the
Cortex-M1
product brief for more information.
March 2014
© 2014 Microsemi Corporation
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