Freescale Semiconductor
Advance Information
Document Number: MC06XSD200
Rev. 3.0, 12/2013
Dual 6.0 mOhm High Side Switch
The 06XSD200 device is part of a 36 V dual high side switch product
family with integrated control and a high number of protective and
diagnostic functions. It has been designed for industrial applications.
The low R
DS(ON)
channels (<6.0 m) can control different load types;
bulbs, solenoids, or DC motors. Control, device configuration, and
diagnostics are performed through a 16-bit serial peripheral interface
(SPI), allowing easy integration into existing applications.
Both channels can be controlled individually by external/internal
clock-signals or by direct inputs. Using the internal clock allows fully
autonomous device operation. Programmable output voltage slew
rates (individually programmable) help improve EMC performance. To
avoid shutting off the device during inrush current, while still being able
to closely track the load current, a dynamic overcurrent threshold
profile is featured. Switching current of each channel can be sensed
with a programmable sensing ratio. Whenever communication with the
external microcontroller is lost, the device enters a fail-safe operation
mode, but remains operational, controllable, and protected.
This device is powered by SMARTMOS technology.
Features
• Normal operating range: 8.0 - 36 V, extended range: 6.0 - 58 V,
3.3 V and 5.0 V compatible 16-bit SPI port for device control,
configuration, and diagnostics at rates up to 8.0 MHz
• Two fully-protected 6.0 m (@ 25 °C) high side switches
• Up to 9.0 A steady-state current per channel
• Separate bulb and DC motor latched overcurrent handling
• Parallel output operating mode with improved switching
synchronization
• Individually programmable internal/external PWM clock signals
(switching frequency, duty cycle, slew rate, switch-on time-shift)
• Overcurrent, short-circuit, and overtemperature protection with
programmable auto-retry functions
• Accurate temperature and current sensing (high/low sensing
ratios/offset compensation)
• OpenLoad detection (channel in OFF and ON state), also for LED
applications (7.0 mA typ.)
V
DD
V
DD
06XSD200
HIGH SIDE SWITCH
FK SUFFIX (PB-FREE)
98ASA00428D
23 PIN PQFN (12 X12 mm)
ORDERING INFORMATION
Device
MC06XSD200FK
Temperature
Range (T
A
)
- 40 to 125 °C
Package
23 PQFN
V
PWR
06XSD200
I/O
I/O
SCLK
CSB
SI
MCU
I/O
SO
I/O
I/O
VDD
VPWR
CLOCK
FSB
SCLK
HS0
CSB
SO
RSTB
SI
HS1
IN0
IN1
CONF0
CONF1
FSOB
SYNC
CSNS
GND
LOAD
M
LOAD
GND
I/O
A/D
A/D
Figure 1. Simplified Application Diagram
*This document contains certain information on a product under development.
Freescale reserves the right to change or discontinue this product without notice
© Freescale Semiconductor, Inc., 2013. All rights reserved.
INTERNAL BLOCK DIAGRAM
INTERNAL BLOCK DIAGRAM
VDD
VPWR
I
UP
CSB
SCLK
I
DWN
SO
SI
RSTB
FSB
IN0
IN1
FSOB
CONF0
CONF1
R
DWN
I
DWN
V
DD
Failure
Detection
Internal
Regulator
V
REG
POR
Over/Undervoltage
Protections
Charge
Pump
Drain/Gate
Clamp
Selectable Slew Rate
Gate Driver
Selectable Overcurrent
Detection
Severe Short-circuit
Detection
Control
HS0
Logic
Short-circuit to
VPWR detec.
Overtemperature
Detect.
OpenLoad
Detect
HS0
I
UP
V
REG
Calibratable
Oscillator *
HS1
HS1
CLOCK
I
DWN
PWM
Module
*
Temperature
Feedback
Output
Current Sense
Analog MUX
Overtemperature
Prewarning
*blocks marked in grey have been implemented
independently for each of both channels
GND
CSNS
SYNC
Figure 2. Internal Block Diagram
06XSD200
2
Analog Integrated Circuit Device Data
Freescale Semiconductor
TABLE OF CONTENTS
TABLE OF CONTENTS
Internal Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Static Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Dynamic Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Assignment and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Internal Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Device Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operation and Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Logic Commands and Spi Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Typical Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Soldering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Marking Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package Mechanical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2
4
6
6
8
15
20
23
23
23
25
26
26
41
48
50
50
50
50
58
06XSD200
Analog Integrated Circuit Device Data
Freescale Semiconductor
3
PIN CONNECTIONS
PIN CONNECTIONS
Transparent Top View
CSNS
IN0
IN1
FSOB
CONF0
CONF1
FSB
CLOCK
RSTB
CSB
SCLK
SI
VDD
3
4
5
6
7
8
9
10
11
12
13
16
17
18
GND
14
1
2
SO
GND
VPWR
23
22
21
SYNC
GND
VPWR
06XSD200
VPWR
15
19
HS1
20
HS0
Figure 3. Device Pin Assignments
Table 1. 06XSD200 Pin Assignments
The function of each pin is described in the section
Functional Description
Pin
Number
1
Pin Name
CSNS
Function
Output
Formal Name
Output Current/
Temperature
Monitoring
Definition
This pin either outputs a current proportional to the channel’s output current or
a voltage proportional to the temperature of the GND pin (pin 14). Selection
between current and temperature sensing, as well as setting the current
sensing sensitivity are performed through the SPI interface. An external pull-
down resistor must be connected between CSNS and GND.
The IN[0 : 1] input pins are used to directly control the switching state of both
switches and consequently the voltage on the HS0 : HS1 output pins. The pins
are connected to GND by internal pull-down resistors
FSOB is asserted (active-low) upon entering Fail-safe mode (see
Functional
Description)
This open-drain output requires an external pull-up resistor to
V
PWR
The CONF[0 : 1] input pins are used to select the appropriate overcurrent
detection profile (bulb/DC motor) for each of both channels. CONF requires a
pull-down resistor to GND.
This open-drain output pin (external pull-up resistor to V
DD
required) is set
when the device enters Fault mode (see
Fault Mode)
The clock input gives the time-base when the device is operated in external
clock/internal PWM mode.
This pin has an internal pull-down current source.
9
RSTB
Input
Reset
This input pin is used to initialize the device’s configuration - and fault registers.
Reset puts the device in Sleep mode (low current consumption) provided it is
not stimulated by direct input signals.This pin is connected to GND by an
internal pull-down resistor.
This input pin is connected to the SPI chip-select output of an external µ-
controller. CSB is internally pulled up to V
DD
by a current source I
UP
.
2
3
4
IN0
IN1
FSOB
Input
Direct Inputs
Output
Fail-safe Output
(Active Low)
Configuration Input
5
6
7
8
CONF0
CONF1
FSB
CLOCK
Input
Output
Input
Fault Status
(Active Low)
PWM Clock
10
CSB
Input
Chip Select
(Active Low)
06XSD200
4
Analog Integrated Circuit Device Data
Freescale Semiconductor
PIN CONNECTIONS
Table 1. 06XSD200 Pin Assignments (continued)
The function of each pin is described in the section
Functional Description
Pin
Number
11
12
Pin Name
SCLK
SI
Function
Input
Input
Formal Name
Serial Clock
Serial Input
Definition
This input pin is to be connected to an external SPI Clock signal. The SCLK
pin is internally connected to a pull-down current source I
DWN
This input pin receives the SPI input data from an external device
(microcontroller or another extreme switch device in case of daisy-chaining).
The SI pin is internally connected to a pull-down current source I
DWN
This is the positive supply pin of the SPI interface.
This output pin transmits SPI data to an external device (external
microcontroller or the SI pin of the next SPI device in case of daisy-chaining).
The pin doesn’t require external pull-up or pull-down resistors, but a series
resistor is recommended to limit current consumption in case of GND
disconnection
These pins, internally connected, are the ground pins for the logic - and analog
circuitry. It is recommended to also connect these pins on the PCB.
13
16
VDD
SO
Power
Output
Digital Drain Voltage
Serial Output
14, 17, 22
15,18,21
GND
VPWR
Ground
Power
Ground
Positive Power Supply These pins, internally connected, supply both the device’s power and control
circuitry (except the SPI port). The drain of both internal MOSFET switches is
connected to them. Pin 15 is the device’s primary thermal pad.
Power Switch Outputs
Output Current
Monitoring
Synchronization
Output pins of the switches, to be connected to the load.
This output pin is asserted (active low) when the Current Sense (CS) output
signal is within the specified accuracy range. Reading the SYNC pin allows the
external microprocessor to synchronize to the device when operating in
autonomous operating mode. SYNC is open-drain and requires a pull-up
resistor to V
DD
.
19
20
23
HS1
HS0
SYNC
Output
Output
06XSD200
Analog Integrated Circuit Device Data
Freescale Semiconductor
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