DS21Q554B- datasheet, PDF - EEWORLD Datasheet

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DS21Q554B-: DescriptionTelecom Interface ICs Quad E1 Transceiver; Categorysemiconductor Analog mixed-signal IC; File Size163KB，13 Pages; ManufacturerMaxim; Websitehttps://www.maximintegrated.com/en.html

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DS21Q554B- Overview

Telecom Interface ICs Quad E1 Transceiver

DS21Q554B- Parametric

Parameter Name	Attribute value
Product Category	Telecom Interface ICs
Manufacturer	Maxim
RoHS	Details
Product	T1/E1 Line Interface Units - LIUs
Operating Supply Voltage	5 V
Mounting Style	SMD/SMT
Package / Case	BGA
Packaging	Tube
Number of Channels	4 Channel
Factory Pack Quantity	40

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DALLAS SEMICONDUCTOR

Quad T1/E1 Transceiver (5V)

Quad T1/E1 Transceiver (3.3V)

FEATURES

•

Four (4) Completely Independent T1 or E1 Transceivers

In One Small 27mm x 27mm Package

•

Each Transceiver Contains a Short & Long Haul Line Interface

Plus a Full Featured Framer with Alarm Detection/Generation,

Elastic Stores, Hardware Based Signaling Support, Per DS0

Channel Control and HDLC Controller

Each Multi-Chip Module (MCM) Contains Four Die of:

DS21352 (DS21Q352)

DS21552 (DS21Q552)

DS21354 (DS21Q354)

DS21554 (DS21Q554)

Selection Guide:

Supply

3.3V

Preliminary

DS21Q552/DS21Q554

DS21Q352/DS21Q354

•

Device

DS21Q352

DS21Q552

DS21Q354

DS21Q554

See the Specific DS21352/DS21552 and DS21354/DS21554

Data Sheets for Details on their Feature Set and Operation

All Four T1 or E1 Transceivers Can be Concatenated into a Single

8.192MHz Backplane Data Stream

IEEE 1149.1 JTAG-Boundary Scan Architecture

DS21Q352/DS21Q552 and DS21Q354/DS21Q554 are Pin Compatible

to Allow the Same Footprint to Support T1 and E1 Applications

256–lead MCM BGA package (27mm X 27mm)

Low Power 5V CMOS or Low Power 3.3V CMOS with 5V

Tolerant Input & Outputs

DESCRIPTION

The Quad T1 and E1 Transceiver MCMs offer a high density packaging arrangement for the

DS21352/DS21552 T1 Single-Chip Transceivers and the DS21354/DS21554 E1 Single-Chip Transceivers.

Four silicon die of one of these devices is packaged in a Multi-Chip Module (MCM) with the electrical

connections as shown in Figure 1. All of the functions available on the DS21352/DS21552 and

DS21354/DS21554 are also available in the MCM packaged version however in order to minimize package

size, some signals have been deleted. These differences are detailed in Table 1.

This data sheet describes the electrical connections and the mechanical dimensions only. Please see the

DS21352/DS21552 and DS21354/DS21554 data sheets for full details on all of the features and the

operating characteristics of the device.

December 29, 1998

DS21Q554B- Related Products

	DS21Q554B-	DS21Q554BN	DS21Q354B	DS21Q354DK	DS21Q354-	DS21Q354B-	DS21Q554	DS21Q354	DS21Q554N-
Description	Telecom Interface ICs Quad E1 Transceiver	Telecom Interface ICs 5V QUAD E1 SCT 256P BGA IND	Telecom Interface ICs 3.3/5V Quad T1/E1 Transceiver	Telecom Interface ICs 3.3/5V Quad T1/E1 Transceiver	Telecom Interface ICs	Telecom Interface ICs 3.3/5V Quad T1/E1 Transceiver	Telecom Interface ICs Quad E1 Transceiver	Telecom Interface ICs 3.3/5V Quad T1/E1 Transceiver	Telecom Interface ICs
Product Category	Telecom Interface ICs	Telecom Interface ICs	Telecom Interface ICs	Networking Development Tools	Telecom Interface ICs	Telecom Interface ICs	-	-	Telecom Interface ICs
Manufacturer	Maxim	Maxim	Maxim	Maxim	Maxim	Maxim	-	-	Maxim
Product	T1/E1 Line Interface Units - LIUs	T1/E1 Line Interface Units - LIUs	T1/E1 Line Interface Units - LIUs	-	T1/E1 Line Interface Units - LIUs	T1/E1 Line Interface Units - LIUs	-	-	T1/E1 Line Interface Units - LIUs
Operating Supply Voltage	5 V	-	3.3 V	-	3.3 V	3.3 V	-	-	5 V
Mounting Style	SMD/SMT	-	SMD/SMT	-	SMD/SMT	SMD/SMT	-	-	SMD/SMT
Package / Case	BGA	-	BGA	-	BGA	BGA-48	-	-	BGA
Number of Channels	4 Channel	4 Channel	4 Channel	-	4 Channel	4 Channel	-	-	4 Channel
Factory Pack Quantity	40	40	40	1	-	4	-	-	-

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