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MMBZ5244B-HE3-08

CategoryDiscrete semiconductor    diode   
File Size86KB,4 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance
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MMBZ5244B-HE3-08 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerVishay
package instructionR-PDSO-G3
Contacts3
Reach Compliance Codecompliant
ECCN codeEAR99
Factory Lead Time12 weeks
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum dynamic impedance15 Ω
JESD-30 codeR-PDSO-G3
JESD-609 codee3
Humidity sensitivity level1
Number of components1
Number of terminals3
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
polarityUNIDIRECTIONAL
Maximum power dissipation0.225 W
GuidelineAEC-Q101
Nominal reference voltage14 V
surface mountYES
technologyZENER
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperature10
Maximum voltage tolerance5%
Working test current9 mA
MMBZ5225 to MMBZ5267
www.vishay.com
Vishay Semiconductors
Small Signal Zener Diodes
FEATURES
• Silicon planar power Zener diodes
Available
3
• Standard Zener voltage tolerance is ± 5 %
with a “B” suffix (e.g.: MMBZ5225B), suffix
“C” is ± 2 % tolerance.
1
2
• High temperature soldering guaranteed:
260 °C/4 x 10 s at terminals
• AEC-Q101 qualified available
• ESD capability according to AEC-Q101:
Human body model > 8 kV
Machine model > 800 V
PRIMARY CHARACTERISTICS
PARAMETER
V
Z
range nom.
Test current I
ZT
V
Z
specification
Int. construction
VALUE
3 to 75
1.7 to 20
Thermal equilibrium
Single
UNIT
V
mA
• Base P/N-E3 - RoHS-compliant, commercial grade
• Base P/N-HE3 - RoHS-compliant, AEC-Q101 qualified
• Material categorization: for definitions of compliance
please see
www.vishay.com/doc?99912
ORDERING INFORMATION
DEVICE NAME
ORDERING CODE
MMBZ5225B-E3-08 to MMBZ5267B-E3-08
MMBZ5225C-E3-08 to MMBZ5267C-E3-08
MMBZ5225B-HE3-08 to MMBZ5267B-HE3-08
MMBZ5225 to
MMBZ5267
MMBZ5225C-HE3-08 to MMBZ5267C-HE3-08
MMBZ5225B-E3-18 to MMBZ5267B-E3-18
MMBZ5225C-E3-18 to MMBZ5267C-E3-18
MMBZ5225B-HE3-18 to MMBZ5267B-HE3-18
MMBZ5225C-HE3-18 to MMBZ5267C-HE3-18
10 000 (8 mm tape on 13" reel)
10 000/box
3000 (8 mm tape on 7" reel)
15 000/box
TAPED UNITS PER REEL
MINIMUM ORDER QUANTITY
PACKAGE
PACKAGE NAME
SOT-23
WEIGHT
8.8 mg
MOLDING COMPOUND
FLAMMABILITY RATING
UL 94 V-0
MOISTURE SENSITIVITY
LEVEL
MSL level 1
(according J-STD-020)
SOLDERING CONDITIONS
260 °C/10 s at terminals
ABSOLUTE MAXIMUM RATINGS
(T
amb
= 25 °C, unless otherwise specified)
PARAMETER
Power dissipation
Zener current
Thermal resistance,
junction to ambient air
Junction temperature
Storage temperature range
Operating temperature range
TEST CONDITION
On FR - 5
board
using recommended solder pad layout
On alumina substrate
See table “Electrical Characteristics”
On FR - 5
board
using recommended solder pad layout
R
thJA
T
j
T
stg
T
op
556
150
-65 to +150
-55 to +150
K/W
°C
°C
°C
SYMBOL
P
tot
P
tot
VALUE
225
300
UNIT
mW
mW
Rev. 1.8, 08-Nov-16
Document Number: 85772
1
For technical questions within your region:
DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
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