BAS40-06LT1G,
SBAS40-06LT1G
Common Anode Schottky
Barrier Diodes
These Schottky barrier diodes are designed for high speed
switching applications, circuit protection, and voltage clamping.
Extremely low forward voltage reduces conduction loss. Miniature
surface mount package is excellent for hand held and portable
applications where space is limited.
Features
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40 VOLTS
SCHOTTKY BARRIER DIODE
•
Extremely Fast Switching Speed
•
Low Forward Voltage
•
S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
•
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
Rating
Reverse Voltage
Symbol
V
R
Value
40
Unit
V
ANODE
3
SOT−23 (TO−236)
CASE 318
STYLE 12
CATHODE
1
2
CATHODE
MARKING DIAGRAM
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Forward Power Dissipation
@ T
A
= 25°C
Derate above 25°C
Operating Junction and Storage
Temperature Range
Forward Continuous Current
Single Forward Current
t
v
1s
t
v
10 ms
Thermal Resistance (Note 1)
Junction−to−Ambient (Note 2)
1. FR−4 @ minimum pad.
2. FR−4 @ 1.0 x 1.0 in pad.
Symbol
P
F
225
1.8
T
J
, T
stg
I
FM
I
FSM
200
600
R
qJA
508
311
°C/W
−55 to +150
120
mW
mW/°C
°C
mA
mA
Max
Unit
L2 M
G
G
L2 = Specific Device Code
M = Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
ORDERING INFORMATION
Device
BAS40−06LT1G
SBAS40−06LT1G
Package
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
Shipping
†
3,000 /
Tape & Reel
3,000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 1997
1
October, 2016 − Rev. 9
Publication Order Number:
BAS40−06LT1/D
BAS40−06LT1G, SBAS40−06LT1G
ELECTRICAL CHARACTERISTICS
(T
A
= 25°C unless otherwise noted)
Characteristic
Reverse Breakdown Voltage
(I
R
= 10
mA)
Total Capacitance
(V
R
= 1.0 V, f = 1.0 MHz)
Reverse Leakage
(V
R
= 25 V)
Forward Voltage
(I
F
= 1.0 mAdc)
Forward Voltage
(I
F
= 10 mAdc)
Forward Voltage
(I
F
= 40 mAdc)
Symbol
V
(BR)R
40
C
T
−
I
R
−
V
F
−
V
F
−
V
F
−
1.0
500
Vdc
380
mVdc
1.0
mVdc
5.0
mAdc
−
pF
Min
Max
Unit
V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
TYPICAL CHARACTERISTICS
100
IR , REVERSE CURRENT (
μ
A)
IF, FORWARD CURRENT (mA)
100
T
A
= 150°C
125°C
10
10
1.0
85°C
150°C
1.0
1 25°C
85°C
25°C
0.1
0
0.1
0.2
- 40°C
0.3
- 55°C
0.4
0.5
0.6
0.7
0.8
0.1
25°C
0.01
0.001
0
5.0
V
F
, FORWARD VOLTAGE (VOLTS)
10
15
V
R
, REVERSE VOLTAGE (VOLTS)
20
25
Figure 1. Typical Forward Voltage
Figure 2. Reverse Current versus Reverse
Voltage
3.5
3.0
C T, CAPACITANCE (pF)
2.5
2.0
1.5
1.0
0.5
0
0
5.0
10
15
20
25
30
35
40
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Capacitance
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2
BAS40−06LT1G, SBAS40−06LT1G
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AR
D
0.25
3
E
1
2
HE
L
3X
b
T
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS.
DIM
A
A1
b
c
D
E
e
L
L1
H
E
T
MIN
0.89
0.01
0.37
0.08
2.80
1.20
1.78
0.30
0.35
2.10
0
°
MILLIMETERS
NOM
MAX
1.00
1.11
0.06
0.10
0.44
0.50
0.14
0.20
2.90
3.04
1.30
1.40
1.90
2.04
0.43
0.55
0.54
0.69
2.40
2.64
−−−
10
°
MIN
0.035
0.000
0.015
0.003
0.110
0.047
0.070
0.012
0.014
0.083
0
°
INCHES
NOM
0.039
0.002
0.017
0.006
0.114
0.051
0.075
0.017
0.021
0.094
−−−
MAX
0.044
0.004
0.020
0.008
0.120
0.055
0.080
0.022
0.027
0.104
10
°
e
TOP VIEW
L1
VIEW C
A
A1
SIDE VIEW
SEE VIEW C
c
END VIEW
STYLE 12:
PIN 1. CATHODE
2. CATHODE
3. ANODE
RECOMMENDED
SOLDERING FOOTPRINT*
2.90
3X
0.90
3X
0.80
0.95
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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BAS40−06LT1/D
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