MC9RS08KB2CDC datasheet, PDF - EEWORLD Datasheet

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MC9RS08KB2CDC: DescriptionMultilayer Ceramic Capacitors MLCC - SMD/SMT 0402 2.2uF 35volts X5R +/-10% GP; CategoryThe embedded processor and controller Microcontrollers and processors; File Size644KB，39 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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MC9RS08KB2CDC Overview

Multilayer Ceramic Capacitors MLCC - SMD/SMT 0402 2.2uF 35volts X5R +/-10% GP

MC9RS08KB2CDC Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	DFN
package instruction	4 X 4 MM, 1 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, DFN-8
Contacts	8
Reach Compliance Code	unknown
ECCN code	EAR99
bit size	8
JESD-30 code	R-PDSO-G8
Humidity sensitivity level	3
Number of terminals	8
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SON
Encapsulate equivalent code	SOLCC8,.16,32
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	260
power supply	2/5 V
Certification status	Not Qualified
RAM (bytes)	126
rom(word)	2048
ROM programmability	FLASH
speed	20 MHz
Maximum slew rate	7 mA
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

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Freescale Semiconductor

Addendum

Document Number: QFN_Addendum

Rev. 0, 07/2014

Addendum for New QFN

Package Migration

This addendum provides the changes to the 98A case outline numbers for products covered in this book.

Case outlines were changed because of the migration from gold wire to copper wire in some packages. See

the table below for the old (gold wire) package versus the new (copper wire) package.

To view the new drawing, go to Freescale.com and search on the new 98A package number for your

device.

For more information about QFN package use, see EB806:

Electrical Connection Recommendations for

the Exposed Pad on QFN and DFN Packages.

MC9RS08KB2CDC Related Products

	MC9RS08KB2CDC	DEMO9RS08KB12	MC9RS08KB12CTG	MC9RS08KB4CTG	MC9RS08KB12CWJ	MC9RS08KB8CWJ
Description	Multilayer Ceramic Capacitors MLCC - SMD/SMT 0402 2.2uF 35volts X5R +/-10% GP	8-bit Microcontrollers - MCU 8-BIT 4K FLASH	8-bit Microcontrollers - MCU 9RS08KA8 20SOIC	Headers u0026 Wire Housings 4 CKT VERT HEADER	8-bit Microcontrollers - MCU 1K FLASH W/ ACMP 62 RAM	8-bit Microcontrollers - MCU 8-BIT 8K FLASH
Is it lead-free?	Lead free	-	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	-	conform to	conform to	conform to	conform to
Parts packaging code	DFN	-	TSSOP	TSSOP	SOIC	SOIC
package instruction	4 X 4 MM, 1 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, DFN-8	-	0.65 MM PITCH, ROHS COMPLIANT, TSSOP-16	0.65 MM PITCH, ROHS COMPLIANT, TSSOP-16	1.27 MM PITCH, ROHS COMPLIANT, MS-013AC, SOIC-20	1.27 MM PITCH, ROHS COMPLIANT, MS-013AC, SOIC-20
Contacts	8	-	16	16	20	20
Reach Compliance Code	unknown	-	unknown	unknown	unknown	unknown
ECCN code	EAR99	-	EAR99	EAR99	EAR99	EAR99
bit size	8	-	8	8	8	8
JESD-30 code	R-PDSO-G8	-	R-PDSO-G16	R-PDSO-G16	R-PDSO-G20	R-PDSO-G20
Humidity sensitivity level	3	-	3	3	3	3
Number of terminals	8	-	16	16	20	20
Maximum operating temperature	85 °C	-	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SON	-	TSSOP	TSSOP	SOP	SOP
Encapsulate equivalent code	SOLCC8,.16,32	-	TSSOP16,.25	TSSOP16,.25	SOP20,.4	SOP20,.4
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	-	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	260	-	260	260	260	260
power supply	2/5 V	-	2/5 V	2/5 V	2/5 V	2/5 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	126	-	254	126	254	254
rom(word)	2048	-	12288	4096	12288	8192
ROM programmability	FLASH	-	FLASH	FLASH	FLASH	FLASH
speed	20 MHz	-	20 MHz	20 MHz	20 MHz	20 MHz
Maximum slew rate	7 mA	-	7 mA	7 mA	7 mA	7 mA
surface mount	YES	-	YES	YES	YES	YES
technology	CMOS	-	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	-	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.8 mm	-	0.635 mm	0.635 mm	1.27 mm	1.27 mm
Terminal location	DUAL	-	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	40	-	40	40	40	40
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	-	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
JESD-609 code	-	-	e3	e3	e3	e3
Terminal surface	-	-	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)

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