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AS312RAA51NGSC

Description
General Purpose Inductor, 0.051uH, 5%, 1 Element, Ceramic-Core, SMD, 0704, CHIP, 0603
CategoryPassive components    inductor   
File Size80KB,2 Pages
ManufacturerCOILCRAFT
Websitehttp://www.coilcraft.com/
Download Datasheet Parametric View All

AS312RAA51NGSC Overview

General Purpose Inductor, 0.051uH, 5%, 1 Element, Ceramic-Core, SMD, 0704, CHIP, 0603

AS312RAA51NGSC Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerCOILCRAFT
package instructionCHIP, 0603
Reach Compliance Codecompliant
ECCN codeEAR99
uppercase and lowercase codes0704
structureChip
core materialCERAMIC
DC Resistance0.27 Ω
Nominal inductance(L)0.051 µH
Inductor ApplicationsRF INDUCTOR
Inductor typeGENERAL PURPOSE INDUCTOR
JESD-609 codee0
Manufacturer's serial numberAS312RAA
Number of functions1
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height1.02 mm
Package length1.8 mm
Package formSMT
Package width1.12 mm
method of packingTR, 7 Inch
Minimum quality factor (at nominal inductance)38
Maximum rated current0.6 A
self resonant frequency1560 MHz
seriesAS312RAA
Shape/Size DescriptionRECTANGULAR PACKAGE
shieldNO
surface mountYES
Terminal surfaceTin/Lead (Sn63Pb37)
Terminal locationDUAL ENDED
Terminal shapeWRAPAROUND
Test frequency200 MHz
Tolerance5%
Base Number Matches1
0603 CHIP INDUCTORS
OutgassingCompliantChipInductors
AS312RAA
Small size, exceptional Q and high SRFs make these
inductors ideal for high frequency applications where
size is at a premium. They also have excellent DCR
and current carrying characteristics.
This robust version of Coilcraft’s standard 0603CS series
features high temperature materials that pass NASA low
outgassing specifications and allows operation in ambient
temperatures up to 155°C. The leach-resistant base
metalization with tin-lead (Sn-Pb) terminations ensures
the best possible board adhesion.
Current Derating
120
110
100
Percent of rated
I
rms
90
80
70
60
50
Typical L vs Frequency
400
350
300
270 nH
30
20
10
0
-40
-20
0
20
25°C
40
40
60
80
100
120
140 160
Ambient temperature (°C)
Inductance (nH)
250
200
150
100
50
0
10
100
1000
120 nH
B
overall
C
D
I
H
F
A
G
F
J
I
68 nH
33 nH
12 nH
3.9 nH
10000
E
terminal
Terminal wraparound:
approx 0.007/0,18 both ends
Suggested
Land Pattern
Frequency (MHz)
Typical Q vs Frequency
100
90
80
70
A
max
0.071
1,80
B
max
0.044
1,12
C
max
1,02
D
ref
0,38
E
0,76
F
0,33
G
0,86
H
1,02
I
0,64
J
0,64
0.040 0.015 0.030 0.013 0.034 0.040 0.025 0.025
33 nH
68 nH
270 nH
12 nH
3.9 nH
Note: Dimensions are before solder application. For maximum overall
dimensions including solder, add 0.0025 in / 0,064 mm to
B
and
0.006 in / 0,15 mm to
A
and
C.
Q factor
60
50
40
30
20
10
0
10
100
120 nH
1000
10000
Frequency (MHz)
®
Core material
Ceramic
Terminations
Tin-lead (63/37) over silver-platinum-glass frit
Ambient temperature
–55°C to +125°C with
Imax
current, +125°C
to +155°C with derated current
Storage temperature
Component: –55°C to +155°C.
Packaging: –55°C to +80°C
Resistance to soldering heat
Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Temperature Coefficient of Inductance (TCL)
+25 to +155 ppm/°C
Moisture Sensitivity Level (MSL)
1 (unlimited floor life at <30°C /
85% relative humidity)
Enhanced crush-resistant packaging
2000 per 7″ reel
Paper tape: 8 mm wide, 1.0 mm thick, 4 mm pocket spacing
Specifications subject to change without notice.
Please check our website for latest information.
Document AS195-1 Revised 12/17/10
1102 Silver Lake Road
Cary IL 60013
© Coilcraft, Inc. 2011
Phone 800-981-0363
Fax 847-639-1508
E-mail cps@coilcraft.com
Web www.coilcraft-cps.com
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